Wetting and spreading kinetics of liquid Sn on Ag and Ag₃Sn substrates

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• 作者：O.Y. Liashenko^a ; ^b ; ^c ; F. Hodaj^a ; ^b ; ^{fhodaj@simap.grenoble-inp.fr" class="auth_mail" title="E-mail the corresponding author}
• 关键词：Wetting ; Kinetics ; Interfaces ; Soldering ; Ag3Sn
• 刊名：Scripta Materialia
• 出版年：2017
• 出版时间：15 January 2017
• 年：2017
• 卷：127
• 期：Complete
• 页码：24-28
• 全文大小：1769 K

文摘

The isothermal wetting and spreading of liquid Sn on Ag and Ag₃Sn substrates are studied for the first time using the dispensed drop technique under high vacuum at 300° and 400 °C. The Sn/Ag₃Sn interaction involves only dissolution of Ag₃Sn in the molten phase while the Sn/Ag interaction involves both dissolution of Ag and Ag₃Sn formation at the interface. Only one spreading regime is observed in Sn/Ag₃Sn system and two spreading regimes in Sn/Ag system. The contact angles of liquid Sn on Ag and Ag₃Sn substrates are evaluated and a mechanism of reactive spreading in the liquid Sn/Ag system is proposed.