高精度硅微简谐振子的设计与制作工艺
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摘要
介绍了MOEMS加速度地震检波器中敏感元件——简谐振子的工作和设计原理,并详细讨论了影响简谐振子腐蚀质量的因素.在实验中采用硅各向异性腐蚀法,制作出了高精度的硅微简谐振子.改进浓度配比的腐蚀液,在80℃时,腐蚀速率控制在(0.53±0.2)μm.测试结果表明:SiO2控制精度达到0.1μm,可应用于光电集成加速度地震检波器的集成光学器件中.
The principle of operation and design of the harmonic oscillator was introduced and the factors influencing the etching quality of the harmonic oscillator were analyzed in detail.In experiment,the fabrication technology was studied and improved to get the high quality of harmonic oscillator. At 80 ℃,the etching velocity of the improved etching liquid was controlled in (0.53±0.2) μm range.The testing result indicates that the control precision of SiO2 is 0.1 μm,which can be applied in the integrated optical chip of the photoelectric integrated acceleration seismic geophone.
引文
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