高质量简谐振子的研制
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摘要
介绍了MOEMS加速度地震检波器中敏感元件-简谐振子的工作和设计原理,并详细讨论了影响简谐振子腐蚀质量的因素,在试验中对各向异性腐蚀工艺进行了研究和改进,制作出了高质量的简谐振子。成功用于国家自然科学基金项目“光电集成加速度地震检波技术理论与试验研究”的集成光学器件试验中。
The principle of operation and the design of the harmonic oscillator is introduced, the factors influencing the anisotropic etching quality of the harmonic oscillator are analyzed. In experiment, the fabrication technology was studied and improved, by which the high quality harmonic oscillator has been successfully fabricated. It has been applied in the integrated optical chip of "the theory and experiment research of photoelectric integrated acceleration seismic geophone technology "-a program supported by the National Nature Science Foundation of China.
引文
[1] Chen Caihe,Cui Yuming.Hybrid Integrated Optical Acceler-ometer[J].Proc SPIE,1996,3895:497-500.
    [2] Chen Caihe,Wu Bo,Ding Guilan,et al.Research and Fabrication on Integrated Optical Chip of Hybrid-Integrated Optical Accelera-tion Seismic Geophone[J].Proc SPIE,2002,4919:1-7.
    [3] Structure Design of Si-based M-Z Interference Acceleration Seismic Geophone[J].Proc SPIE,2003.
    [4] Dan Haronian.A Low-Cost Micromechanical Accelerometer with Integrated Solid-State Sensor[J].Sensor and Actuators A,2000,84:149-155.
    [5] Neil Barbour,George Schmidt.Inertial Sensor Technology Trends[J].IEEE Sensors Journal,2001,1(4):332-339.
    [6] 电子工业半导体专业工人技术教材编写组.半导体器件工艺[M].上海科学技术文献出版社,1984.
    [7] O.D.图累蒲等编,王正华叶小琳夏如兴译.半导体器件工艺手册[M].电子工业出版社,1987.
    [8] 高融,苏明哲译.硅片加工工艺学[M].上海科学技术文献出版社,1985.
    [9] 杨成惠.耦合用硅片V型槽的设计与制作[J].半导体光电,2000,2I(A03):73-74.

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