浅析振动环境中典型电子产品的损伤规律

英文篇名：Study on the Damage of Electronic Product in Vibration Environment
中文刊名：装备环境工程
英文刊名：Equipment Environmental Engineering
作者：满强 ; 马辉
英文作者：MAN Qiang~1 ; MA Hui~2(1.Institute of Ordnance Engineering ; Shijiazhuang 050003 ; China ; 2.No.73907 unit of PLA ; Fuzhou 350101 ; China)
中文关键词：电子产品 ; 振动环境 ; 损伤规律
英文关键词：electronic product ; vibration environment ; damage law
出版日期：2006-10-15
机构：军械工程学院装备指挥与管理系,73907部队石家庄050003,福州350101
年：2006
期：05
出版单位：装备环境工程

摘要

在分析电子装备结构特点及冲击振动环境影响因素基础上,阐述了电子产品在振动环境中的损伤机理与模式,以某型雷达装备为试验对象,选取该装备某型组合体与电路板进行冲击振动与扫频振动试验,分析了电子产品在振动环境中损伤的一般规律。试验表明:电子产品在振动环境中的损伤不仅与振动类型及幅值有关,也与其自身结构有着密切的关系。
The damage mechanism and mode of electronic product in vibration environment was discussed through analysis of the charateristies of electronic equipment and the influencing fators of impact vibration environment.The combination structure and the circuitry board were extracted from the equipment to make impact vibration and swept vibration experiment;damage laws of electronic product in vibration environment were analyzed.The experiment showed that the damage of electronic product in vibration environment has relation with type and amplitude of vibration and structure of the product.

引文

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