若干微电子机械系统研制及相关LIGA工艺研究
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摘要
随着MEMS传感器芯片在物理、化学、生物和医学等方面的广泛应用,相应的微加工工艺成为当前微系统技术的一个研究热点。MEMS微加工技术涉及微电子、材料、物理(力学及流体力学等)、化学、生物、机械学诸多学科领域,是多学科相互交叉的产物。MEMS器件是采用微电子和微机械加工技术将所有的零件、电路和系统在整体设计下几乎同时制造出来,零件和系统是紧密结合在一起的,因此,开发MEMS器件需要采用新观念,在系统级上进行设计和制造。
由于微系统器件在性能上对大深宽比微结构的需求,采用LIGA技术制作MEMS器件成为目前非常有潜力的一种加工方法。然而,MEMS与微电子制造工艺不同,它必须进行微机械所特有的三维加工,必须克服大深宽比对加工工艺带来的影响,有时还要求与集成电路工艺兼容。要解决好这一系列问题有一定的难度,研究人员需要不断努力,发展和完善MEMS制造技术。
对于每个特定功能的MEMS器件,都需要单独设计一套与之对应的加工工艺流程,每一步工艺参数都需要重新摸索确定,以适应不同的微结构性能要求。为了对MEMS制造过程中微细加工工艺进行深入研究,总结分析MEMS微细加工技术的设计规则和具体的工艺规范,设计并制作出具有大深宽比结构的MEMS器件,同时进行相应的性能分析和评价,本论文主要开展了以下几个方面的工作:
1.LIGA/UV-LIGA光刻工艺
发展了X射线光刻中的掩模制作工艺,完善了硅基底开窗法制作高精度同步辐射掩模的方法;利用同步辐射X射线光刻技术和深紫外光刻技术制作大深宽比微结构;对紫外光刻工艺和SU-8厚胶工艺制作大高宽比结构进行工艺研究:采用了低温后烘的方法有效降低胶结构内应力,并运用兆声辅助的方法有效提高的大深宽比微结构的显影效率。
2.Zn牺牲层技术
发展完善了沉积厚层Zn牺牲层技术在LIGA/UV-LIGA工艺中的应用。对Zn牺牲层的电镀工艺,种子层对粘附性的影响,牺牲层的释放等工艺细节进行深入研究,将沉积厚层Zn牺牲层工艺发展为一种完善成熟的牺牲层技术;同时将LIGA技术和厚Zn牺牲层工艺引入武器安全系统中的引信设计和制造中,制作出基于平面结构形式的安全保险装置微结构。
3.极限大深宽比微结构电铸
对具有极限深宽比的微结构的深镀能力和均镀能力进行探索,分析了大深宽比微结构电铸工艺中的离子传质过程对金属离子沉积的影响;运用了兆声辅助的方法提高离子的传质扩散能力,以获得具有较大深宽比的微结构。
4.纳米颗粒复合电镀
利用纳米颗粒复合电镀工艺制作镍基复合微结构。为使纳米Al_2O_3颗粒较均匀地分散在微结构中,实验中搭建了低成本有效的小孔喷流场进行辅助电镀,并获得了分散效果较好纳米颗粒复合镀件;同时对纳米颗粒复合镀件进行了微机械性能的测试,相比于纯镍微结构,其硬度由HV_(0.2)300增至HV_(0.2) 500,抗磨损率增强1倍,试验中还测试了微结构的抗压强度,其平均抗压强度约为960Mpa。这些结果表明,复合镀件在某些方面的微机械性能有着显著提高:论文中运用流体动力学有限元分析方法模拟复合电镀中的小孔喷射流场的分布,分析喷射流场对纳米颗粒分散的影响,表明喷流辅助电铸有助于纳米颗粒的分散和吸附沉积。
5.微型加速度触发开关研制
运用LIGA/UV-LIGA技术、微电铸以及Zn牺牲层技术,完成悬臂梁式和螺旋形加速度开关的研制。
悬臂梁式微型加速度开关:采用了X射线深度光刻工艺,结合本论文开发的厚Zn牺牲层工艺,进行悬臂梁式微型加速度开关的制作。实验中分析了大深宽比微结构电铸所出现的缺陷,并对电铸成品率进行统计分析,在此基础上优化结构设计和工艺流程,获得具有大深宽比悬臂梁结构的微型加速度开关样品;并对微结构进行运动测试,结果表明,微结构的运动符合设计上的要求。
螺旋形微型加速度开关:采用了深紫外光刻技术,结合SU-8厚胶工艺,进行微型螺旋形加速度开关的制作。对牺牲层材料的特性进行分析与实验,解决了微结构脱落的问题,通过工艺优化,得到了平整的微弹簧结构;并对微结构的开关工作阈值和弹性系数进行测试,开关阈值从1g～10g,在设计的低阈值工作范围,所测微结构弹性系数在140～200μN/nm范围,为所需的低刚度弹簧,满足设计者对系统低频响应的要求。
6.毫米波矩形封闭加速通道研制
运用UV-LIGA技术,结合SU-8多层对准紫外光刻和微电铸工艺,进行封闭复杂的内部空腔结构的微型毫米波加速通道的制作。对SU-8的多层光刻电铸工艺、SU-8热裂解去除,以及微结构内部空腔超声清洗等微细加工工艺进行了深入研究,并获得具有复杂的内部空腔结构的微型毫米波加速通道。
With the MEMS sensors widely applied in fields of physics,chemistry,biology and medicine,etc.,the related microfabricaton technology has become a hot point in the current micro-system research.The micro-processing technology of MEMS relates to micro-electronics,materials,physics(mechanics and fluid mechanics,etc.),chemistry, biology,mechanics and many other subjects,it is the product of multidisciplinary subjects.All of the parts in MEMS devices are produced almost at the same time using micro-electronics and micro-machining technology under overall consideration, the parts and the systems are closely linked,it is a top-down approach.Therefore,the developments of MEMS devices require new concepts and have to be designed and manufactured in the system-level.
Since the demands of micro structures with high aspect ratio in micro systems, the LIGA process has the potential to become a popular technique in microfabrication fields.Unlike the micro-electronics technique,the micro-machining technology has to be specific during three-dimensional micro-processing,to overcome the effect of high aspect ratio,and sometimes it also has to be compatible with integrated circuit technology.It is necessary for researchers to make great efforts to solve this series of problems,and develop and improve MEMS manufacturing technology.
For every specific MEMS device,there is a separate micro-machining process required to be designed,and the parameters in every process step are needed to be re-explored and determined to meet the demands of special performance of the microstructures.In order to investigate the micro-machining processes in detail and summarize some MEMS design rules,and furthermore to develop the MEMS products with high aspect ratio structures,and do the corresponding performance evaluation and analysis,the main thesis works are carried out in the following areas:
1.Improve the X-ray lithography and ultraviolet lithography process
A high-precision synchrotron radiation mask fabricating methods is developed by using the silicon substrate fenestration.The microstructures with high aspect ratio are successfully obtained by using X-ray lithography technology and ultraviolet lithography technology.The processing details in UV lithography technique and SU-8 thick resist technique are studied in detail,the inner stress in SU-8 resist structures is reduced effectively by the low-temperature post baking,and the developing efficiency of micro structures with high aspect ratio is obviously improved by using megasonic agitation assistance.
2.The application of thick sacrificial layer of zinc in LIGA process
The zinc electrochemical depositing process,the effects of the seed layers to the adhesion of sacrificial layer on silicon substrate,and the release process of the sacrificial layer,are investigated in detail.And the thick zinc sacrificial layer process is developed to be a mature sacrificial layer technology.The zinc sacrificial layer technology is also introduced into the fabrication of the weapon's fuze device,and some microstructures used in the plane frame insurance device are successfully obtained.
3.Micro electroforming with utmost high aspect ratio structures
The micro electroforming technique with utmost high aspect ratio structures is explored in the experiment;the effect of metallic ion transmission condition in the electrolyte to deposition status is studied.A very high aspect ratio metallic structure is obtained successfully by using megasonic agitation assistance which effectively improves the transmission ability of metallic ion in the electrolyte.
4.Fabrication of nickel base composite microstructures with Al_2O_3 nanoparticles
In order to deposit the alumina nanopartMes uniformly in the composite micro structures and obtain the composite microstructures with good distribution of the alumina nanoparticles,an effective and low cost spraying assistance circulation system is set up in the experiment to improve the dispersing and depositing condition of the nanoparticles in the electrolyte.The analysis on the micromechanical hardness and wearing property shows that the composite components' hardness are improved form HV_(0.2) 300to HV_(0.2) 500 compared with pure nickel components,their wearing resistance are also increased nearly 100 percent,and the average compressive stress reaches 960Mpa.The micromechanical properties of composite components are significantly improved in comparison with the pure nickel components.
The hydrokinetic flow field during the spraying assistance deposition process is also simulated presumably by using hydrokinetics finite element analysis.The simulated results also show that the spraying riptides in electrolyte would be helpful to promote the nanoparticles to disperse in the electrolyte and deposit onto the cathode uniformly.
5.Fabrication of micro acceleration trigger switch combined with LIGA /UV-LIGA technology and thick zinc sacrificial layer technology
A cantilever-type micro acceleration switch is fabricated successfully by using the X-ray deep lithography process,combined with thick Zn sacrificial layer technology developed in this thesis.The electroforming defects in plating very high aspect ratio microstructures are studied,and the yield of the microstructures is counted and analyzed.On the basis of these experimental data,the design of the microstructures and the fabrication process flow are optimized,and the micro acceleration switch samples with high aspect ratio structures are fabricated.The movement testing results of the microstructures shows that the micro system accords with the design requirements.
A spiral type micro-acceleration switch is fabricated successfully by using the ultraviolet lithography technology,combined with SU-8 thick photoresist technique. The properties of sacrificial layer materials are analyzed and experimented to solve the desquamating problem of microstructures,and through process optimization,the planar micro spiral spring structures are obtained.The test results of the switching threshold(1g～10g) and the elasticity coefficient(140～200μN/nm) show that the microstructures accords with the designer's demands of the low frequency response.
6.Development of millimeter-wave rectangular accelerating channel.
A millimeter-wave rectangular accelerating channel with complex internal cavity is fabricated successfully by using the UV-LIGA technology,combined with multi-layer SU-8 lithography and microelectroforming process.The micro-machining process of SU-8 lithography,SU-8 pyrolysis removal,and internal cavity ultrasonic cleaning are studied in detail.
由于微系统器件在性能上对大深宽比微结构的需求,采用LIGA技术制作MEMS器件成为目前非常有潜力的一种加工方法。然而,MEMS与微电子制造工艺不同,它必须进行微机械所特有的三维加工,必须克服大深宽比对加工工艺带来的影响,有时还要求与集成电路工艺兼容。要解决好这一系列问题有一定的难度,研究人员需要不断努力,发展和完善MEMS制造技术。
对于每个特定功能的MEMS器件,都需要单独设计一套与之对应的加工工艺流程,每一步工艺参数都需要重新摸索确定,以适应不同的微结构性能要求。为了对MEMS制造过程中微细加工工艺进行深入研究,总结分析MEMS微细加工技术的设计规则和具体的工艺规范,设计并制作出具有大深宽比结构的MEMS器件,同时进行相应的性能分析和评价,本论文主要开展了以下几个方面的工作:
1.LIGA/UV-LIGA光刻工艺
发展了X射线光刻中的掩模制作工艺,完善了硅基底开窗法制作高精度同步辐射掩模的方法;利用同步辐射X射线光刻技术和深紫外光刻技术制作大深宽比微结构;对紫外光刻工艺和SU-8厚胶工艺制作大高宽比结构进行工艺研究:采用了低温后烘的方法有效降低胶结构内应力,并运用兆声辅助的方法有效提高的大深宽比微结构的显影效率。
2.Zn牺牲层技术
发展完善了沉积厚层Zn牺牲层技术在LIGA/UV-LIGA工艺中的应用。对Zn牺牲层的电镀工艺,种子层对粘附性的影响,牺牲层的释放等工艺细节进行深入研究,将沉积厚层Zn牺牲层工艺发展为一种完善成熟的牺牲层技术;同时将LIGA技术和厚Zn牺牲层工艺引入武器安全系统中的引信设计和制造中,制作出基于平面结构形式的安全保险装置微结构。
3.极限大深宽比微结构电铸
对具有极限深宽比的微结构的深镀能力和均镀能力进行探索,分析了大深宽比微结构电铸工艺中的离子传质过程对金属离子沉积的影响;运用了兆声辅助的方法提高离子的传质扩散能力,以获得具有较大深宽比的微结构。
4.纳米颗粒复合电镀
利用纳米颗粒复合电镀工艺制作镍基复合微结构。为使纳米Al_2O_3颗粒较均匀地分散在微结构中,实验中搭建了低成本有效的小孔喷流场进行辅助电镀,并获得了分散效果较好纳米颗粒复合镀件;同时对纳米颗粒复合镀件进行了微机械性能的测试,相比于纯镍微结构,其硬度由HV_(0.2)300增至HV_(0.2) 500,抗磨损率增强1倍,试验中还测试了微结构的抗压强度,其平均抗压强度约为960Mpa。这些结果表明,复合镀件在某些方面的微机械性能有着显著提高:论文中运用流体动力学有限元分析方法模拟复合电镀中的小孔喷射流场的分布,分析喷射流场对纳米颗粒分散的影响,表明喷流辅助电铸有助于纳米颗粒的分散和吸附沉积。
5.微型加速度触发开关研制
运用LIGA/UV-LIGA技术、微电铸以及Zn牺牲层技术,完成悬臂梁式和螺旋形加速度开关的研制。
悬臂梁式微型加速度开关:采用了X射线深度光刻工艺,结合本论文开发的厚Zn牺牲层工艺,进行悬臂梁式微型加速度开关的制作。实验中分析了大深宽比微结构电铸所出现的缺陷,并对电铸成品率进行统计分析,在此基础上优化结构设计和工艺流程,获得具有大深宽比悬臂梁结构的微型加速度开关样品;并对微结构进行运动测试,结果表明,微结构的运动符合设计上的要求。
螺旋形微型加速度开关:采用了深紫外光刻技术,结合SU-8厚胶工艺,进行微型螺旋形加速度开关的制作。对牺牲层材料的特性进行分析与实验,解决了微结构脱落的问题,通过工艺优化,得到了平整的微弹簧结构;并对微结构的开关工作阈值和弹性系数进行测试,开关阈值从1g～10g,在设计的低阈值工作范围,所测微结构弹性系数在140～200μN/nm范围,为所需的低刚度弹簧,满足设计者对系统低频响应的要求。
6.毫米波矩形封闭加速通道研制
运用UV-LIGA技术,结合SU-8多层对准紫外光刻和微电铸工艺,进行封闭复杂的内部空腔结构的微型毫米波加速通道的制作。对SU-8的多层光刻电铸工艺、SU-8热裂解去除,以及微结构内部空腔超声清洗等微细加工工艺进行了深入研究,并获得具有复杂的内部空腔结构的微型毫米波加速通道。
With the MEMS sensors widely applied in fields of physics,chemistry,biology and medicine,etc.,the related microfabricaton technology has become a hot point in the current micro-system research.The micro-processing technology of MEMS relates to micro-electronics,materials,physics(mechanics and fluid mechanics,etc.),chemistry, biology,mechanics and many other subjects,it is the product of multidisciplinary subjects.All of the parts in MEMS devices are produced almost at the same time using micro-electronics and micro-machining technology under overall consideration, the parts and the systems are closely linked,it is a top-down approach.Therefore,the developments of MEMS devices require new concepts and have to be designed and manufactured in the system-level.
Since the demands of micro structures with high aspect ratio in micro systems, the LIGA process has the potential to become a popular technique in microfabrication fields.Unlike the micro-electronics technique,the micro-machining technology has to be specific during three-dimensional micro-processing,to overcome the effect of high aspect ratio,and sometimes it also has to be compatible with integrated circuit technology.It is necessary for researchers to make great efforts to solve this series of problems,and develop and improve MEMS manufacturing technology.
For every specific MEMS device,there is a separate micro-machining process required to be designed,and the parameters in every process step are needed to be re-explored and determined to meet the demands of special performance of the microstructures.In order to investigate the micro-machining processes in detail and summarize some MEMS design rules,and furthermore to develop the MEMS products with high aspect ratio structures,and do the corresponding performance evaluation and analysis,the main thesis works are carried out in the following areas:
1.Improve the X-ray lithography and ultraviolet lithography process
A high-precision synchrotron radiation mask fabricating methods is developed by using the silicon substrate fenestration.The microstructures with high aspect ratio are successfully obtained by using X-ray lithography technology and ultraviolet lithography technology.The processing details in UV lithography technique and SU-8 thick resist technique are studied in detail,the inner stress in SU-8 resist structures is reduced effectively by the low-temperature post baking,and the developing efficiency of micro structures with high aspect ratio is obviously improved by using megasonic agitation assistance.
2.The application of thick sacrificial layer of zinc in LIGA process
The zinc electrochemical depositing process,the effects of the seed layers to the adhesion of sacrificial layer on silicon substrate,and the release process of the sacrificial layer,are investigated in detail.And the thick zinc sacrificial layer process is developed to be a mature sacrificial layer technology.The zinc sacrificial layer technology is also introduced into the fabrication of the weapon's fuze device,and some microstructures used in the plane frame insurance device are successfully obtained.
3.Micro electroforming with utmost high aspect ratio structures
The micro electroforming technique with utmost high aspect ratio structures is explored in the experiment;the effect of metallic ion transmission condition in the electrolyte to deposition status is studied.A very high aspect ratio metallic structure is obtained successfully by using megasonic agitation assistance which effectively improves the transmission ability of metallic ion in the electrolyte.
4.Fabrication of nickel base composite microstructures with Al_2O_3 nanoparticles
In order to deposit the alumina nanopartMes uniformly in the composite micro structures and obtain the composite microstructures with good distribution of the alumina nanoparticles,an effective and low cost spraying assistance circulation system is set up in the experiment to improve the dispersing and depositing condition of the nanoparticles in the electrolyte.The analysis on the micromechanical hardness and wearing property shows that the composite components' hardness are improved form HV_(0.2) 300to HV_(0.2) 500 compared with pure nickel components,their wearing resistance are also increased nearly 100 percent,and the average compressive stress reaches 960Mpa.The micromechanical properties of composite components are significantly improved in comparison with the pure nickel components.
The hydrokinetic flow field during the spraying assistance deposition process is also simulated presumably by using hydrokinetics finite element analysis.The simulated results also show that the spraying riptides in electrolyte would be helpful to promote the nanoparticles to disperse in the electrolyte and deposit onto the cathode uniformly.
5.Fabrication of micro acceleration trigger switch combined with LIGA /UV-LIGA technology and thick zinc sacrificial layer technology
A cantilever-type micro acceleration switch is fabricated successfully by using the X-ray deep lithography process,combined with thick Zn sacrificial layer technology developed in this thesis.The electroforming defects in plating very high aspect ratio microstructures are studied,and the yield of the microstructures is counted and analyzed.On the basis of these experimental data,the design of the microstructures and the fabrication process flow are optimized,and the micro acceleration switch samples with high aspect ratio structures are fabricated.The movement testing results of the microstructures shows that the micro system accords with the design requirements.
A spiral type micro-acceleration switch is fabricated successfully by using the ultraviolet lithography technology,combined with SU-8 thick photoresist technique. The properties of sacrificial layer materials are analyzed and experimented to solve the desquamating problem of microstructures,and through process optimization,the planar micro spiral spring structures are obtained.The test results of the switching threshold(1g～10g) and the elasticity coefficient(140～200μN/nm) show that the microstructures accords with the designer's demands of the low frequency response.
6.Development of millimeter-wave rectangular accelerating channel.
A millimeter-wave rectangular accelerating channel with complex internal cavity is fabricated successfully by using the UV-LIGA technology,combined with multi-layer SU-8 lithography and microelectroforming process.The micro-machining process of SU-8 lithography,SU-8 pyrolysis removal,and internal cavity ultrasonic cleaning are studied in detail.
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