Fault Tolerant and Reliable Automotive Body Control Module System by Using Silicon Relay Devices Made with ST's MO~(TM) Technology Smart Power Devices.

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• 英文论文题名：Fault Tolerant and Reliable Automotive Body Control Module System by Using Silicon Relay Devices Made with ST's MO~(TM) Technology Smart Power Devices.
• 论文作者：Romeo Letor
• 英文论文作者：Romeo Letor STMicroelectronics
• 年：2013
• 作者机构：STMicroelectronics;
• 英文论文关键词：Silicon Relay ; Smart power devices ; Short-circuit ; Reliability ; AEC-Q100 ; BCM ; Safety level
• 会议召开时间：2013-11-26
• 会议录名称：2013中国汽车工程学会年会论文集
• 英文会议录名称：Proceedings of 2013 SAE-China Congress
• 语种：英文
• 分类号：U463.6
• 学会代码：QCGC
• 会议名称：2013中国汽车工程学会年会
• 会议地点：中国北京
• 主办单位：中国汽车工程学会
• 学会名称：中国汽车工程学会
• 页数：7
• 文件大小：445k
• 原文格式：O
• 会议级别：全国

摘要

<正>Cost saving,reliability and fault tolerance requirements are since several years the driving forces for using smart power devices in automotive.Smart Power solid state switches are widely used for power actuator purposes where fault tolerance against system failures in short circuit and overload is essential.The process to design a fault tolerant and reliable power management with real failure condition engages a 2 sides approach: 1.The silicon supplier to define optimized short circuit protection for a maximum number of activations and to supply unambiguous speciation of the short circuit ruggedness. 2.The system supplier to assess the reliability of the device in short circuit as a function of the fault handling strategy required by the car maker. This paper is a complement to the standard AEC-Q100-012 short circuit specification.The paper describes short circuit protection philosophy,what are the stresses applied to the device and the failure mechanisms.This allows calculating the damage applied to the physical structure at given working and boundary conditions.
Cost saving,reliability and fault tolerance requirements are since several years the driving forces for using smart power devices in automotive.Smart Power solid state switches are widely used for power actuator purposes where fault tolerance against system failures in short circuit and overload is essential.The process to design a fault tolerant and reliable power management with real failure condition engages a 2 sides approach: 1.The silicon supplier to define optimized short circuit protection for a maximum number of activations and to supply unambiguous speciation of the short circuit ruggedness. 2.The system supplier to assess the reliability of the device in short circuit as a function of the fault handling strategy required by the car maker. This paper is a complement to the standard AEC-Q100-012 short circuit specification.The paper describes short circuit protection philosophy,what are the stresses applied to the device and the failure mechanisms.This allows calculating the damage applied to the physical structure at given working and boundary conditions.

引文

[1]Sebastiano Russo,Romeo Letor,Orazio Viscuso,Lucia Torrisi,Gianluigi Vitali:"Fast thermal fatigue on top metal layer of power devices",ESRF 2002,Elsevier Science.
    [2]Mauro Ciappa,Flavio Carbognani,Wolfgang Fichtner: "Lifetime Prediction and Design of Reliability Tests for High Power Devices in Automotive Applications",IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY,Vol 3,NO.4,December 2003.
    [3]Giovanni Breglio,Andrea Irace,Paolo Spirito,Romeo Letor,Sebastiano Russo." Fast transient infrared thermal analysis of smart Power MOSFTES in permanent short circuit operation" Proceeding of the 18th international symposium on Power Semiconductor Devices & IC' s,page 257,2006 IEEE.
    [4]AEC-Q100-012.