Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging

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• 英文论文题名：Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging
• 论文作者：Ming Yang ; Mingyu Li ; Jongmyung Kim
• 英文论文作者：Ming Yang ; Mingyu Li ; Jongmyung Kim ; Shenzhen Graduate School ; Harbin Institute of Technology ; Jeonnam Provincial College
• 年：2016
• 作者机构：Shenzhen Graduate School, Harbin Institute of Technology;Jeonnam Provincial College;
• 会议召开时间：2016-11-10
• 会议录名称：2016中国高端SMT学术会议论文集
• 语种：英文
• 分类号：TG40
• 学会代码：SMTS
• 会议名称：2016中国高端SMT学术会议
• 会议地点：中国福建厦门
• 主办单位：四川省电子学会SMT专委会、广东省电子学会SMT专委会、厦门市技师协会SMT专委会、陕西省电子学会SMT专委会、山东省电子制造技术专委会、上海市电子学会SMT专委会、安徽省电子学会SMT专委会、南京市电子学会SMT专委会、清华大学伟创力SMT实验室、SMTA China、英国环球SMT与封装、EM Asia、电子工艺技术杂志社、广东技术师范学院SMT实训中心
• 学会名称：四川省电子学会SMT专业委员会
• 页数：18
• 文件大小：2316k
• 原文格式：D
• 会议级别：全国

摘要

The growth orientation of Cu_6Sn_5 intermetallic compounds(IMCs) formed at the eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging was investigated. The results indicate that the interfacial Cu_6Sn_5 grains exhibit textured growth under solid-state conditions, and their preferred orientations are affected by the initial joint preparation conditions. Cu6Sn5 grains in the [0001] direction normal to the interface are stable in solid and molten Sn37 Pb solder at 200 ℃, but are rapidly consumed at 280 ℃. This effect leads to the formation of different textures in the Cu_6Sn_5 layer during the solid-state aging treatment of joints formed at 200 and 280℃. In addition, the influence of texture evolution on the growth of interfacial IMCs was evaluated. The results indicate that Sn diffusion is faster along the [0001] direction of the Cu_6Sn_5 crystal than along an angle of 25-45° to the [0001] direction; therefore, more IMCs are generated at the interface of the joints formed at 200 ℃ than at those formed at 280 ℃ under the same solid-state reaction conditions.
The growth orientation of Cu_6Sn_5 intermetallic compounds(IMCs) formed at the eutectic Sn37Pb/polycrystalline Cu interface during solid-state aging was investigated. The results indicate that the interfacial Cu_6Sn_5 grains exhibit textured growth under solid-state conditions, and their preferred orientations are affected by the initial joint preparation conditions. Cu6Sn5 grains in the [0001] direction normal to the interface are stable in solid and molten Sn37 Pb solder at 200 ℃, but are rapidly consumed at 280 ℃. This effect leads to the formation of different textures in the Cu_6Sn_5 layer during the solid-state aging treatment of joints formed at 200 and 280℃. In addition, the influence of texture evolution on the growth of interfacial IMCs was evaluated. The results indicate that Sn diffusion is faster along the [0001] direction of the Cu_6Sn_5 crystal than along an angle of 25-45° to the [0001] direction; therefore, more IMCs are generated at the interface of the joints formed at 200 ℃ than at those formed at 280 ℃ under the same solid-state reaction conditions.

引文

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