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钨铜合金电触头材料的最新研究进展
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  • 英文篇名:Latest Research Progress of Tungsten Copper Alloy Electrical Contact Materials
  • 作者:宫鑫 ; 任帅 ; 李黎
  • 英文作者:GONG Xin;REN Shuai;LI Li;State Key Laboratory of Advanced Electromagnetic Engineering and Technology,Huazhong University of Science and Technology;
  • 关键词:钨铜电触头 ; 电弧烧蚀 ; 制备工艺 ; 掺杂改性 ; 综述
  • 英文关键词:tungsten-copper electrical contact;;arc erosion;;preparation technology;;doping modification;;review
  • 中文刊名:GDDL
  • 英文刊名:Guangdong Electric Power
  • 机构:强电磁工程与新技术国家重点实验室(华中科技大学);
  • 出版日期:2019-05-25
  • 出版单位:广东电力
  • 年:2019
  • 期:v.32;No.256
  • 基金:国家自然科学基金项目(51777082)
  • 语种:中文;
  • 页:GDDL201905013
  • 页数:12
  • CN:05
  • ISSN:44-1420/TM
  • 分类号:97-108
摘要
钨铜合金因其导电导热性好、密度大、强度硬度高、耐电弧烧蚀性能优异,被广泛用作高压电器的触头材料。鉴于电力工业的不断发展对触头材料性能提出的更高要求,综述了提高钨铜电触头性能多种途径的最新研究进展;介绍了电弧对钨铜触头的烧蚀过程与机理;总结了现阶段混合式和包覆式钨铜复合粉末的制备方法。概述钨铜合金触头传统和新型制备工艺的研究进展,提出功能梯度材料和细晶/纳米材料是钨铜合金的发展趋势。介绍添加稀土元素、硬质颗粒、活化剂元素对钨铜触头进行掺杂改性的方法,并列举影响钨铜合金性能的其他因素;最后分析钨铜合金电触头材料的研究热点和存在问题。
        Tungsten-copper alloy is widely used as contact material for high voltage electrical apparatus due to its good electrical and thermal conductivity, high density, high strength and hardness, and excellent resistance to arc erosion. With development of electric power industry, properties of contact material are required to be higher. This paper reviews the latest research progress of various ways to improve properties of tungsten-copper electrical contact. It introduces arc erosion process and mechanism of tungsten-copper contact briefly. It summarizes preparation methods of mixed and coated tungsten-copper composite powder, overviews research progress of traditional and new tungsten-copper alloy contact preparation process emphatically and points out that functionally gradient materials and fine crystal/nanometer materials are developing trends of tungsten-copper alloy. Subsequently, it introduces realization of doping modification of tungsten-copper contact by adding rare earth elements, hard particles and activator elements and lists influence of other factors on the properties of tungsten-copper alloy. Finally, it analyzes research hotspot and existing problems of tungsten-copper alloy electrical contact materials.
引文
[1] 周武平,吕大铭.钨铜材料应用和生产的发展现状[J].粉末冶金材料科学与工程,2005,10(1):21-25.ZHOU Wuping,Lü Daming.Development status of application and production of tungsten and copper materials[J].Journal of Powder Metallurgy Materials Science and Engineering,2005,10(1):21-25.
    [2] 李兴文.高压SF6断路器开断性能仿真方法研究综述[J].广东电力,2018,31(8):27-36.LI Xingwen.Research review on simulation method for interruption performance of high voltage SF6 circuit breaker[J].Guangdong Electric Power,2018,31(8):27-36.
    [3] 王娇娇.石墨烯表面负载金属及其掺杂钨铜复合材料的研究[D].西安:西安理工大学,2018.
    [4] 范志康,梁淑华,肖鹏.高压电触头材料[M].北京:机械工业出版社,2004.
    [5] 王玲玲.提高CuW合金耐电弧烧蚀性能的研究[D].西安:西安理工大学,2008.
    [6] 陈洪科,陆宁懿.电工产品与电接触可靠性领域研究新进展——第五届电工产品可靠性与电接触国际会议论文综述[J].电工材料,2015(2):28-33.CHEN Hongke,LU Ningyi.New progress in the research of electrical products and electrical contact reliability:a summary of the 5th international conference on reliability and electrical contact of electrical products[J].Transactions in Electrical Materials,2015(2):28-33.
    [7] 王珩,李素华,刘立强,等.CuW电触头材料研究综述[J].电工材料,2014(5):11-17,23.WANG Heng,LI Suhua,LIU Liqiang,et al.Review of CuW electrical contact materials[J].Journal of Electrical Engineering,2014(5):11-17,23.
    [8] 陈文革,黎斌.CuW触头材料的制备及失效分析[J].电工材料,2010(4):9-14.CHEN Wenge,LI Bin.Preparation and failure analysis of CuW contact materials[J].Transactions on Electrical Materials,2010(4):9-14.
    [9] WEI X,YU D,SUN Z,et al.Arc characteristics and microstructure evolution of W-Cu contacts during the vacuum breakdown[J].Vacuum,2014(107):83-89.
    [10] LIN Renjie,WANG Lijun,MA Jinwei,et al.Experiment investigation on vacuum arc of AMF contacts under different materials[J].AIP Advances,2018,8(9):1-14.
    [11] LIN Renjie,WANG Lijun,SHI Weixin,et al.Experimental investigation on triggered vacuum arc and erosion behavior under different contact materials[J].IEEE Transactions on Plasma Science,2018,46(8):1-10.
    [12] 刘政泓,吕云卓,陆兴.激光增材制造钨铜复合材料[J].电工材料,2018(5):21-27.LIU Zhenghong,Lü Yunzhuo,LU Xing.Fabrication of tungsten-copper composites by laser additive[J].Electrical Materials,2018(5):21-27.
    [13] 朱永兵.机械合金化法制备W-Cu纳米复合前驱体粉末[D].南京:南京航空航天大学,2007.
    [14] 高翔,李先容,朱彩强,等.热机械合金化法制备纳米晶W-Cu复合粉末[J].粉末冶金材料科学与工程,2015,20(3):444-448.GAO Xiang,LI Xianrong,ZHU Caiqiang,et al.Preparation of nanocrystalline W-Cu composite powder by thermomechanical alloying[J].Powder Metallurgy Materials Science and Engineering,2015,20(3):444-448.
    [15] RYU SS,PARK H R,KIM Y D,et al.Effect of ball-milling time on structural characteristics and densification behavior of W-Cu composite powder produced from WO3-CuO powder mixtures[J].International Journal of Refractory Metals and Hard Materials,2017,(65):39-44.
    [16] 王玉香,袁德林,赖华生.化学法制备钨铜复合粉的工艺研究[J].中国钨业,2010,25(6):31-34.WANG Yuxiang,YUAN Delin,LAI Huasheng.Study on preparation of tungsten-copper composite powder by chemical method[J].China Tungsten Industry,2010,25(6):31-34.
    [17] DOLATMORADI A,RAYGAN S,ABDIZADEH H.Mechanochemical synthesis of W-Cu nanocomposites via in-situ co-reduction of the oxides[J].Powder Technology,2013(233):208-214.
    [18] 刘舒,谢敬佩,马窦琴,等.纳米钨铜复合粉末的制备及其烧结行为研究[J].稀有金属与硬质合金,2014,42(5):34-38,47.LIU Shu,XIE Jingpei,MA Douqin,et al.Preparation and sintering behavior of nano-tungsten-copper composite powder[J].Rare Metals and Cemented Carbides,2014,42(5):34-38,47.
    [19] ARDESTANI M,ARABI H,REZAIE H R,et al.Synthesis and densification of W-30wt%Cu composite powders using ammonium meta tungstate and copper nitrate as precursors[J].International Journal of Refractory Metals & Hard Materials,2009,27(4):796-800.
    [20] 段柏华,刘辉江,王德志,等.纳米钨铜复合粉末的制备与微观形貌[J].粉末冶金材料科学与工程,2014,19(6):903-908.DUAN Baihua,LIU Huijiang,WANG Dezhi,et al.Preparation and micromorphology of nano-tungsten-copper composite powder[J].Powder Metallurgy Materials Science and Engineering,2014,19(6):903-908.
    [21] 徐竹.钨铜复合材料制备技术的发展与应用[J].新技术新工艺,2016(6):76-78.XU Zhu.Development and application of preparation technology of tungsten-copper composites[J].New Technology & New Process,2016(6):76-78.
    [22] ZHANG L,CHEN W,LUO G,et al.Low-temperature densification and excellent thermal properties of W-Cu thermal-management composites prepared from copper-coated tungsten powders[J].Journal of Alloys and Compounds,2014(588):49-52.
    [23] 刘波,庄志强,刘勇,等.粉体的表面修饰与表面包覆方法的研究[J].中国陶瓷工业,2004(1):50-54,31.LIU Bo,ZHUANG Zhiqiang,LIU Yong,et al.Study on surface modification and surface coating of powders[J].China Ceramic Industry,2004(1):50-54,31.
    [24] 赵明,王金淑,刘伟,等.WCu复合粉体的溶胶-凝胶制备及其还原行为研究[J].稀有金属材料与工程,2011,40(2):362-366.ZHAO Ming,WANG Jinshu,LIU Wei,et al.Preparation and reduction behavior of WCu composite powders by sol-gel[J].Rare Metal Materials and Engineering,2011,40(2):362-366.
    [25] 王利剑.铜包钨复合粉体的优化制备及其所制W70Cu30合金抗烧蚀性能的研究[D].西安:西安理工大学,2016.
    [26] 林涛,史萍萍,邵慧萍,等.化学镀工艺参数对制备铜包钨粉的影响研究[J].功能材料,2014,45(13):13067-13070,13075.LIN Tao,SHI Pingping,SHAO Huiping,et al.Effect of electroless plating process parameters on preparation of copper-coated tungsten powder[J].Functional Materials,2014,45(13):13067-13070,13075.
    [27] 许久东.铜包钨复合粉体的电沉积制备技术的研究[D].长沙:湖南大学,2014.
    [28] 魏晓枭.氮化-脱氮制备钨铜复合粉末机理及性能研究[D].南昌:南昌大学,2016.
    [29] CHEN W,SHI Y,DONG L,et al.Infiltration sintering of W-Cu alloys from copper-coated tungsten composite powders for superior mechanical properties and arc-ablation resistance[J].Journal of Alloys & Compounds,2017(728):196-205.
    [30] 赵晶晶,李继文,张盘龙,等.钨铜复合材料制备方法的研究现状[J].稀有金属与硬质合金,2013,41(4):52-54.ZHAO Jingjing,LI Jiwen,ZHANG Panlong,et al.Research status of preparation methods of tungsten-copper composites[J].Rare Metal and Hard Alloys,2013,41(4):52-54.
    [31] 廖利波.钨铜合金相对密度和组织结构的影响因素分析[J].稀有金属与硬质合金,2012,40(6):44-48.LIAO Libo.Analysis of factors affecting relative density and microstructure of tungsten-copper alloys[J].Rare Metals and Cemented Carbides,2012,40(6):44-48.
    [32] 王新刚,张怀龙,李文静,等.制备工艺对WCu30合金的显微组织及抗电弧烧蚀性能的影响[J].稀有金属材料与工程,2015,44(1):140-145.WANG Xingang,ZHANG Huailong,LI Wenjing,et al.Effect of preparation process on microstructure and arc ablation resistance of WCu30 alloy[J].Rare Metal Materials and Engineering,2015,44(1):140-145.
    [33] 李倩.超重力熔渗钨铜复合材料及其成型工作过程仿真[D].泰安:山东农业大学,2014.
    [34] DAS J ,CHAKRABORTY A ,BAGCHI T P ,et al.Improvement of machinability of tungsten by copper infiltration technique[J].International Journal of Refractory Metals and Hard Materials,2008,26(6):530-539.
    [35] 刘克明,谌昀,谢仕芳,等.钨铜复合材料研究现状与展望[J].热处理技术与装备,2012,33(5):40-42,47.LIU Keming,SHEN Yun,XIE Shifang,et al.Research status and prospect of tungsten-copper composites[J].Heat Treatment Technology and Equipment,2012,33(5):40-42,47.
    [36] CHENG J,WAN L,CAI Y B,et al.Fabrication of W-20wt.%Cu alloys by powder injection molding[J].Journal of Materials Processing Technology,2010,210(1):137-142.
    [37] TEJADO E,MüLLER A V,YOU J H,et al.The thermo-mechanical behaviour of W-Cu metal matrix composites for fusion heat sink applications:The influence of the Cu content[J].Journal of Nuclear Materials,2018(498):468-475.
    [38] HO P W,LI Q F,FUH J Y H.Evaluation of W-Cu metal matrix composites produced by powder injection molding and liquid infiltration[J].Materials Science & Engineering A,2008,485(1):657-663.
    [39] 石乃良.电子封装用高导热低膨胀率W/Cu复合材料的研究[D].西安:西安理工大学,2008.
    [40] 邹俭鹏,阮建明,周忠诚,等.功能梯度材料的设计与制备以及性能评价[J].粉末冶金材料科学与工程,2005(2):78-87.ZOU Jianpeng,RUAN Jianming,ZHOU Zhongcheng,et al.Design and preparation of functionally graded materials and performance evaluation[J].Powder Metallurgy Materials Science and Engineering,2005(2):78-87.
    [41] CHAUBEY A K,RAJAT G,ROHIT K,et al.Fabrication and characterization of W-Cu functionally graded material by spark plasma sintering process[J].Fusion Engineering and Design,2018(135):24-30.
    [42] 陈文革,陈勉之.WCu合金与铜合金梯度烧结的设计与分析[J].高压电器,2010,46(8):10-13.CHEN Wenge,CHEN Mianzhi.Design and analysis of gradation sintering of WCu alloy and copper alloy[J].High Voltage Apparatus,2010,46(8):10-13.
    [43] 刘彬彬,谢建新,鲁岩娜.MBE方法制备高致密W-Cu梯度功能材料的研究[J].稀有金属材料与工程,2008(7):1269-1272.LIU Binbin,XIE Jianxin,LU Yanna.Preparation of high density W-Cu gradient functional materials by MBE method[J].Rare Metal Materials and Engineering,2008(7):1269-1272.
    [44] 高红梅.颗粒尺寸对钨铜合金组织性能及电弧烧蚀特性的影响[D].西安:西安理工大学,2017.
    [45] 马窦琴.细晶高致密钨铜复合材料制备及电接触性能研究[D].郑州:郑州大学,2016.
    [46] 古刚,刘德志,耿昊,等.耐电弧烧蚀钨铜复合材料的研究综述[J].海军工程大学学报,2016,28(增刊1):40-43.GU Gang,LIU Dezhi,GENG Hao,et al.Review of research on arc-resistant ablation of tungsten-copper composites[J].Journal of Naval University of Engineering,2016,28(S1):40-43.
    [47] ABBASZADEH H,MASOUDI A,SAFABINESH H,et al.Investigation on the characteristics of micro-andnano-structured W-15 wt.%Cu composites prepared by powder metallurgy route[J].International Journal of Refractory Metals & Hard Materials,2012,30(1):145-151.
    [48] 王晖,张小明,王峰,等.W-Cu材料的应用进展和制备技术[J].硬质合金,2014,31(5):322-326.WANG Hui,ZHANG Xiaoming,WANG Feng,et al.Application progress and preparation technology of W-Cu materials[J].Cemented Carbide,2014,31(5):322-326.
    [49] 赵晶晶,李继文,张盘龙,等.水热合成-共还原法制备W-20%Cu复合粉体及其组织结构[J].粉末冶金材料科学与工程,2014,19(4):628-634.ZHAO Jingjing,LI Jiwen,ZHANG Panlong,et al.Microstructure of W-20%Cu composite powders prepared by hydrothermal synthesis combined with co-reduction method[J].Powder Metallurgy Materials Science and Engineering,2014,19(4):628-634.
    [50] WANG Zhanlei,LI Xiaojie,ZHU Jianqiao,et al.Dynamic consolidation of W-Cu nanocomposites from W-CuO powder mixture[J].Materials Science & Engineering A,2010,527(21):6098-6101.
    [51] QIU W T,PANG Y,XIAO Z,et al.Preparation of W-Cu alloy with high density and ultrafine grains by mechanical alloying and high pressure sintering[J].International Journal of Refractory Metals and Hard Materials,2016(61):91-97.
    [52] ELSAYED A,LI W,EL KADY O A,et al.Experimental investigations on the synthesis of W-Cunanocomposite through spark plasma sintering[J].Journal of Alloys & Compounds,2015(639):373-380.
    [53] 刘冰,陈文革,张志军.钨铜合金表面纳米化及其性能分析[J].稀有金属材料与工程,2015,44(12):3188-3191.LIU Bing,CHEN Wenge,ZHANG Zhijun.Surface nanocrystallization of tungsten-copper alloy and its performance analysis[J].Rare Metal Materials and Engineering,2015,44(12):3188-3191.
    [54] WALID M D,YAO J,SHAMMA M,et al.Ultra-rapid processing of high-hardness tungsten-coppernanocomposites[J].Scripta Materialia,2016(113):246-249.
    [55] 薛翔,李松,丘如亮,等.W-Cu复合材料的研究进展[J].材料导报,2008,22(增刊1):294-298.XUE Xiang,LI Song,QIU Ruliang,et al.Research progress of W-Cu composites[J].Material research,2008,22(S1):294-298.
    [56] 高娃,张存信.钨铜合金的最新研究进展及应用[J].新材料产业,2006(2):57-60.GAO Wa,ZHANG Cunxin.The latest research progress and application of tungsten-copper alloys[J].New Materials Industry,2006(2):57-60.
    [57] 黄丽枚,罗来马,丁孝禹,等.钨铜复合材料的研究进展[J].机械工程材料,2014,38(4):1-6,14.HUANG Limei,LUO Laima,DING Xiaoyu,et al.Research progress of tungsten-copper composites[J].Journal of Mechanical Engineering,2014,38(4):1-6,14.
    [58] DONG LL,AHANGARKANI M,CHEN W G,et al.Recent progress in development of tungsten-copper composites:fabrication,modification and applications[J].International Journal of Refractory Metals and Hard Materials,2018(75):30-42.
    [59] QIAN K,LIANG S,XIAO P,et al.In situ synthesis and electrical properties of CuW-La2O3 composites[J].International Journal of Refractory Metals & Hard Materials,2012,31(3):147-151.
    [60] LUO L M,LU Z L,HUANG X M,et al.Fabrication ofCuW/La2O3 composite powder with a novel pretreatment prepared by electroless plating and its sintering characterization[J].International Journal of Refractory Metals and Hard Materials,2015(48):1-4.
    [61] ZHANG CC,LUO G Q,ZHANG J,et al.Synthesis and thermal conductivity improvement of W-Cu composites modified with WC interfacial layer[J].Materials & Design,2017(127):233-242.
    [62] 种法力,周张建,陈俊凌,等.核聚变钨铜面对等离子体材料研究[J].功能材料,2018,49(3):3109-3112.CHONG Fali,ZOU Zhangjian,CHEN Junling,et al.Study on nuclear fusion tungsten-copper facing plasma materials[J].Functional Materials,2018,49(3):3109-3112.
    [63] 陈娟,王献辉,成军,等.添加LaB6的CuW70触头材料的电弧侵蚀行为[J].中国有色金属学报,2015,25(11):3147-3154.CHEN Juan,WANG Xianhui,CHENG Jun,et al.Arc erosion behavior of CuW70 contact material with LaB6 added[J].Chinese Journal of Nonferrous Metals,2015,25(11):3147-3154.
    [64] YANG X,LIANG S,WANG X,et al.Effect of WC and CeO2 on microstructure and properties of W-Cu electrical contact material[J].International Journal of Refractory Metals & Hard Materials,2010,28(2):305-311.
    [65] DONG LL,CHEN W G,DENG N,et al.Investigation on arc erosion behaviors and mechanism of W70Cu30 electrical contact materials adding graphene[J].Journal of Alloys and Compounds,2017(696):923-930.
    [66] YANG X H,XIAO P,LIANG S H,et al.Alloying effect of Ni and Cr on the wettability of copper on W substrate[J].Acta Metallurgica Sinica ,2008,21(5):369-379.
    [67] AHANGARKANI M,BORGI S,ABBASZADEH H,et al.The effect of additive and sintering mechanism on the microstructural characteristics of W-40Cu composites[J].International Journal of Refractory Metals and Hard Materials,2012(32):39-44.
    [68] ZANGENEH-MADAR K,AMIRJAN M,PARVIN N.Improvement of physical properties of Cu-infiltrated W compacts viaelectroless nickel plating of primary tungsten powder[J].Surface and Coatings Technology,2009,203(16):2333-2336.
    [69] ZHUO L,ZHANG Y,CHEN Q,et al.Fabrication and properties of the W-Cu composites reinforced with uncoated and nickel-coated tungsten fibers[J].International Journal of Refractory Metals and Hard Materials,2018(71):175-180.
    [70] 范景莲,刘涛,朱松,等 .W-Cu复合材料制备新技术与发展前景[J].硬质合金,2011,28(1):56-65,72.FAN Jinglian,LIU Tao,ZHU Song,et al.New technology and development prospects of W-Cu composites[J].Cemented Carbide,2011,28(1):56-65,72.
    [71] XU L,YAN M,XIA Y,et al.Influence of copper content on the property of Cu-W alloy prepared by microwave vacuum infiltration sintering[J].Journal of Alloys & Compounds,2014,592(12):202-206.
    [72] 王玲玲,方林霞,刘雪,等.钨铜合金制备工艺分析[J].广州化工,2012,40(4):10-11,33.WANG Lingling,FANG Linxia,LIU Xue,et al.Analysis into the preparation process of W-Cu composites[J].Guangzhou Chemical Industry,2012,40(4):10-11,33.
    [73] 李君强,陈文革,陶文俊,等.W纤维增强高Cu含量W-Cu复合材料的研究[J].粉末冶金技术,2012,30(2):125-129.LI Junqiang,CHEN Wenge,TAO Wenjun,et al.Study on W-Cu reinforced high-Cu content W-Cu composites[J].Powder Metallurgy Technology,2012,30(2):125-129.
    [74] 王利剑,陈文革.钨铜合金表面粗糙度对抗电弧烧蚀性能的影响[J].粉末冶金材料科学与工程,2016,21(5):802-808.WANG Lijian,CHEN Wenge.Effect of surface roughness of tungsten-copper alloy on arc ablation performance[J].Powder Metallurgy Materials Science and Engineering,2016,21(5):802-808.
    [75] ZHANG R F,LI Z C,LIU B X.Metastable phase formed in immiscible Cu-W multilayers by ion mixing[J].Japanese Journal of Applied Physics,2003,42(11):7009-7012.
    [76] VILLAIN P,GOUDEAU P,BADAWI F,et al.Physical origin of spontaneous interfacial alloying in immiscible W/Cu multilayers[J].Journal of Materials Science,2007,42(17):7446-7450.
    [77] ZHANG D L.Processing of advanced materials using high-energy mechanical milling[J].Progress in Materials Science,2004,49(4):537-560.
    [78] TABRIZI N S,XU Q,PERS N M V D,et al.Generation of mixed metallic nanoparticles from immiscible metals by spark discharge[J].Journal of Nanoparticle Research,2010,12(1):247-259.
    [79] EDWARDS D,SABIROV I,SIGLE W,et al.Microstructure andthermostability of a W-Cu nanocomposite produced via high-pressure torsion[J].Philosophical Magazine,2012,92(33):4151-4166.
    [80] AI Y P,XIE S K,ZENG YY,et al.Research on Cu-W homogeneous film structure prepared by ion beam sputtering[J].Journal of Alloys and Compounds,2010,496(2):385-387.
    [81] 梁超平.若干过渡族金属及合金系统关键性能的第一性原理研究[D].长沙:中南大学,2013.
    [82] LIANG C P,WU C Y,FAN J L,et al.Structural,thermodynamic,and mechanical properties of W-Cu solid solutions[J].Journal of Physics and Chemistry of Solids,2017(110):401-408.
    [83] 马晓红.高压开关用钨铜触头材料研究[J].黑龙江科技信息,2013(14):48.MA Xiaohong.Study on tungsten-copper contact materials for high-voltage switch[J].Heilongjiang Science and Technology Information,2013(14):48.

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