硬脆材料切割过程中基于线锯速度的切割力自适应控制
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摘要
光学玻璃、工程陶瓷以及硅基材料等硬脆材料因其良好的物理性质和化学性质而广泛应用于光学工程及集成电路等高尖端技术领域,但低塑性、高脆性的物理特性会导致其切片在切割过程中易出现效率低和表面质量较差等问题。为提高切片表面质量,建立了金刚石线锯切割过程中线锯速度与切割力的模型,设计最小方差自校正控制器对切割力进行在线实时控制。实验结果表明:所设计的最小方差自校正器能够降低线锯切割系统中切片所受的切割力波动,使切割力趋于稳定;与定参数切割条件下所得的切片进行比较,采用最小方差自校正控制策略切割完成的工件表面形貌较为平整,表面粗糙度值降低约30%.
Hard and brittle materials,such as optical glass,engineering ceramics,and silicon-based materials,are widely used in high-tech fields,such as optical engineering and integrated circuits,because of their good physical and chemical properties. Their low plasticity and high brittleness lead to low efficiency and poor surface quality during cutting. A model of wire saw velocity and normal cutting force in the cutting process of diamond wire saw is established,and a minimum variance self-tuning controller is designed for controlling the cutting force on-line in real-time. The experimental results show that the minimum variance self-tuning controller can be used to reduce the fluctuation of cutting force on the slice in the wire saw cutting system,and make the cutting force tend to be stable. Compared with the slice cutted under the condition of the constant parameters,the surface of work-piece finished using the minimum variance self-tuning control strategy is relatively smooth,and the surface roughness is decreased by about30%.
Hard and brittle materials,such as optical glass,engineering ceramics,and silicon-based materials,are widely used in high-tech fields,such as optical engineering and integrated circuits,because of their good physical and chemical properties. Their low plasticity and high brittleness lead to low efficiency and poor surface quality during cutting. A model of wire saw velocity and normal cutting force in the cutting process of diamond wire saw is established,and a minimum variance self-tuning controller is designed for controlling the cutting force on-line in real-time. The experimental results show that the minimum variance self-tuning controller can be used to reduce the fluctuation of cutting force on the slice in the wire saw cutting system,and make the cutting force tend to be stable. Compared with the slice cutted under the condition of the constant parameters,the surface of work-piece finished using the minimum variance self-tuning control strategy is relatively smooth,and the surface roughness is decreased by about30%.
引文
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[2] ISHIKAWA Y,YAO Y Z,SUGAWARA Y,et al. Comparison ofslicing-induced damage in hexagonal SiC by wire sawing with looseabrasive,wire sawing with fixed abrasive,and electric dischargemachining[J]. Japanese Journal of Applied Physics,2014,53(7):071301-071311.
[3] HARDIN C W,QU J,SHIH A J. Fixed abrasive diamond wiresaw slicing of single-crystal silicon carbide wafer[J]. AdvancedManufacturing Processes,2004,19(2):355-367.
[4] CLARK W I,SHIH A J,LEMASTER R L,et al. Fixed abrasivediamond wire machining—part II:experiment design and results[J]. International Journal of Machine Tools&Manufacture,2003,43(5):533-542.
[5] LIEDKE T,KUNA M. A macroscopic mechanical model of thewire sawing process[J]. International Journal of Machine Tools&Manufacture,2011,51(9):711-720.
[6] LI S J,DU S M,TANG A F,et al. Force modeling and control ofSi C monocrystal wafer processing[J]. Journal of ManufacturingScience and Engineering,2015,137(6):061003-061010.
[7] CVETKOVI'C S,MORSBACH C,RISSING L. Ultra-precisiondicing and wire sawing of silicon carbide(SiC)[J]. Microelec-tronic Engineering,2011,88(8):2500-2504.
[8]王嘉宾,李淑娟,梁列,等. SiC单晶切割过程中接触弧长建模与实验[J].兵工学报,2016,37(5):879-887.WANG J B,LI S J,LIANG L,et al. Modeling and experiment ofcontact arc length in SiC monocrystal wafer cutting[J]. Acta Ar-mamentarii,2016,37(5):879-887.(in Chinese)
[9]高玉飞,葛培琪,李绍杰.往复式电镀金刚石线锯切割单晶硅片特性研究[J].人工晶体学报,2009,38(2):372-377.GAO Y F,GE P Q,LI S J. Study on the cutting performance ofsingle crystal silicon wafer by using reciprocating electroplated dia-mond wire saw[J]. Journal of Synthetic Crystals,2009,38(2):372-377.(in Chinese)
[10] LANDERS R G,ULSOY A G,MA Y H. A comparison ofmodel-based machining force control approaches[J]. Internation-al Journal of Machine Tools&Manufacture,2004,44(7):733-748.
[11]王佳伟,梁轲,徐国泰,等.陀螺误差在线建模的递推最小二乘法系统识别[J].探测与控制学报,2017,39(5):36-39.WANG J W,LIANG K,XU G T,et al. Recursive least-squaresmethod of system identification in gyro random error on-linemodeling[J]. Journal of Detection&Control,2017,39(5):36-39.(in Chinese)
[12] LEE K Y,KANG M C,JEONG Y H,et al. Simulation of sur-face roughness and profile in high-speed end milling[J]. Jour-nal of Materials Processing Technology,2001,113(1):410-415.
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