NEW COOLING SIMULATION TECHNOLGIES FOR THE INJECTION MOLDING PROCESS

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• 作者：Lu ChenClinton KietzmannDavid AstburyLiang Shao
• 会议时间：2014-07-23
• 关键词：Injection molding ; Autodesk ; transient cool ; simulation ; rapid heating and cooling ; variotherm ; induction heating ; Maxwell equations ; skin depth. Penetration depth ; magnetism
• 作者单位：Lu Chen,Liang Shao(Autodesk ACRD,6F-7F No.130,Lane 91,E Shan Road,Shanghai,China 200127)Clinton Kietzmann,David Astbury(Autodesk Australia Pty Ltd,Moldflow R&D Center,259-261 Colchester Road,Kilsyth Vic 3137)
• 母体文献：第十一届先进成型与材料加工技术国际研讨会论文集
• 会议名称：第十一届先进成型与材料加工技术国际研讨会
• 会议地点：大连
• 主办单位：中国机械工程学会
• 语种：chi

摘要

Injection molding technology now relies on in cycle variable mold heating and cooling in order to improve the surface finish and general part quality without increasing cycle time.Induction heating has the potential to be the most efficient method for heating specific areas of the mold quickly when taking advantage of the skin effect.Simulation of induction heating offers the mold designer an insight into the mechanisms of induction heating before investing in this technology.This paper describes the development of a 3D finite element based electromagnetic solver that is used with an existing 3D finite element based transient mold cooling solver.The derivations of the relevant equations are explained as well their effects on the mold during heating.