高速高效LED专用贴片机关键技术研究
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摘要
LED照明有着节能效果好、发光效率高、寿命长、绿色环保等特点,是未来最主要的照明光源。随着LED通用照明的普及,作为LED照明生产线重要装备之一—贴片机的需求量急剧上升,国内对贴片机的研究大都以通用型贴片机为主,研究水平仍处于起步阶段。
通用型贴片机具有高精度、多功能的特点,因此通用型贴片机硬件配置高、开发难度较大、成本高。而LED芯片规格少,贴装密度大且贴装PCB板较长,因此对贴装效率要求高,而精度要求不高等特点。若采用通用型多功能贴片机进行贴装,将面临高成本、低贴装效率等问题,因此开发一款较低成本、高速、高效专用于LED芯片贴装的贴片机必将带动LED行业的发展,这也是贴片机在LED行业的一个必然发展趋势。
论文结合LED芯片贴装特点,对高速、高效LED专用贴片机的关键技术展开研究,主要工作如下：
(1)通过对国内外各种典型贴片机进行全面分析,并对LED芯片贴装特点进行研究,设计出低成本、高速度与高效率的LED专用贴片机,样机采用双悬臂梁双贴片头结构,可实现一头贴装,另一头吸料,减少贴装吸料空闲等待时间,贴装效率高。
(2)贴片头和送料器直接影响着贴片机的整体性能,是贴片机的核心部件。通过对不同数量吸嘴贴装效率的比较分析,设计了两吸嘴双工位拱架式贴片头,两个这种贴片头交替工作的效率比单头四吸嘴结构提高30%以上,具有高效性特点。另外,本文在保证精度与速度的前提下设计了一款质量轻、高效率的送料器,该送料器采用步进电机驱动,体积仅为普通送料器的1/4。
(3)横梁与机架是贴片机两个重要结构部件,仅靠传统的静力学设计与经验设计无法获得较好的动态特性。本文采用频率设计原则结合静力校核的方法,对贴片机的横梁与机架进行了静力学校核与动态分析,使机架与横梁的变形和固有频率达达到合理要求,整机结构最优。
(4)结合吉村允孝法对贴片机整机各关键部件之间的接合面刚度和阻尼参数进行了辨识,完成贴片机整机模态分析,对并对影响整机的固有频率及振型的因素进行了分析,找出薄弱环节,并提出了解决方法。
(5)最后,利用LMS振动测试仪对样机进行锤击法振动测试,获取整机的实验固有频率,验证了贴片机的动态性能。
样机的贴装结果表明,在不采用视觉校正时开发的LED贴片机能满足其贴装精度要求,并且贴装速度和效率达到国内中高档贴片机的水平。通过对整机进行锤击法振动实验,与理论分析结果比较,说明基于吉村允孝法的接合面参数识别方法在LED专用贴片机的整机动态分析中,获取数据方便、有效,精度较高。
LED lighting has many advantages, such as energy conservation, high luminous efficiency, long life, green environmental protection. It will be the main source of illumination in future all over the world with the development of general LED lighting, Placement Machine, one of the important components on LED lighting production line, will be sharp rise in demand. The domestic researches on the placement machine mostly base on general purpose SMT, and still in the development stage.
General purpose SMT machine with high precision, multi function characteristic, which determines the general SMT needs high hardware requirements and the difficulty in the development. LED chip mount is affixed with a high speed, low precision, few species and long PCB size. If using the general SMT to mount LED chip, there will be faced with high cost, low mounting efficiency problems. Therefore, The development of a low cost, high speed, high efficient Placement Machine specially used for LED is sure to drive the development of the LED industry, and is the inevitable trend in the development of SMT in the LED industry.
This paper will research the key technology to high speed and high efficiency LED placement machine, the main work is as follows:
(1) Through the structure analysis of typical pick-place equipment and the research of the LED chip mounting characteristics Design a low-cost, high-speed and high-efficiency LED placement machine with double cantilever beam. It can achieve that one head is on paste while another is on suction. So that it can reduce the mount suction idle waiting time and get a high efficiency.
(2) Patch head and feeder directly effect the overall performance of the placement machine. Through the analysis of efficiency in different number of nozzle mount, Design a patch head with two nozzle. Both of this patch head alternating working are more efficient than a single-head with four-nozzle in30%.In addition, under the premise of ensuring accuracy and speed,Design a high speed light belt feeder which is driven by a step-motor, and it's volume is only1/4of the ordinary feeders.
(3) The beam and the frame are two important structural components of the placement machine. It cannot get a good dynamic characteristics only by static mechanical design or experience design. In this paper base on the frequency of design principles combined with the static force checking. making statics and modal analysis on the placement machine's key structure component such as beams and the frame to make sure that the deformation and the natural frequency is to Achieve a reasonable requirements.
(4) The Mesataka Yoshimura method is presented to used in research the stiffness and damping parameters of actual conjoint faces, and complete the dynamic analysis of the placement machine.and analyze the factor affecting the machine's natural frequencies and mode shapes.
(5) Use the LMS vibration instrument to make a hammer vibration test on the prototype to acquire the experimental natural frequency. through comparing with the analysis natural frequency, It shows that the placement machine dynamic performance is Reasonable and effective.
The results of the actual prototype mount show that without the visual correction,the LED Placement machine can meet the precision requirement, and the mount speed reaches the domestic high-grade speed. By hammering method dynamic vibration test, we prove that the dynamic analysis on the LED Placement machine basing on the Mesataka Yoshimura method is feasible, convenient, effective and high analysis precision.
通用型贴片机具有高精度、多功能的特点,因此通用型贴片机硬件配置高、开发难度较大、成本高。而LED芯片规格少,贴装密度大且贴装PCB板较长,因此对贴装效率要求高,而精度要求不高等特点。若采用通用型多功能贴片机进行贴装,将面临高成本、低贴装效率等问题,因此开发一款较低成本、高速、高效专用于LED芯片贴装的贴片机必将带动LED行业的发展,这也是贴片机在LED行业的一个必然发展趋势。
论文结合LED芯片贴装特点,对高速、高效LED专用贴片机的关键技术展开研究,主要工作如下：
(1)通过对国内外各种典型贴片机进行全面分析,并对LED芯片贴装特点进行研究,设计出低成本、高速度与高效率的LED专用贴片机,样机采用双悬臂梁双贴片头结构,可实现一头贴装,另一头吸料,减少贴装吸料空闲等待时间,贴装效率高。
(2)贴片头和送料器直接影响着贴片机的整体性能,是贴片机的核心部件。通过对不同数量吸嘴贴装效率的比较分析,设计了两吸嘴双工位拱架式贴片头,两个这种贴片头交替工作的效率比单头四吸嘴结构提高30%以上,具有高效性特点。另外,本文在保证精度与速度的前提下设计了一款质量轻、高效率的送料器,该送料器采用步进电机驱动,体积仅为普通送料器的1/4。
(3)横梁与机架是贴片机两个重要结构部件,仅靠传统的静力学设计与经验设计无法获得较好的动态特性。本文采用频率设计原则结合静力校核的方法,对贴片机的横梁与机架进行了静力学校核与动态分析,使机架与横梁的变形和固有频率达达到合理要求,整机结构最优。
(4)结合吉村允孝法对贴片机整机各关键部件之间的接合面刚度和阻尼参数进行了辨识,完成贴片机整机模态分析,对并对影响整机的固有频率及振型的因素进行了分析,找出薄弱环节,并提出了解决方法。
(5)最后,利用LMS振动测试仪对样机进行锤击法振动测试,获取整机的实验固有频率,验证了贴片机的动态性能。
样机的贴装结果表明,在不采用视觉校正时开发的LED贴片机能满足其贴装精度要求,并且贴装速度和效率达到国内中高档贴片机的水平。通过对整机进行锤击法振动实验,与理论分析结果比较,说明基于吉村允孝法的接合面参数识别方法在LED专用贴片机的整机动态分析中,获取数据方便、有效,精度较高。
LED lighting has many advantages, such as energy conservation, high luminous efficiency, long life, green environmental protection. It will be the main source of illumination in future all over the world with the development of general LED lighting, Placement Machine, one of the important components on LED lighting production line, will be sharp rise in demand. The domestic researches on the placement machine mostly base on general purpose SMT, and still in the development stage.
General purpose SMT machine with high precision, multi function characteristic, which determines the general SMT needs high hardware requirements and the difficulty in the development. LED chip mount is affixed with a high speed, low precision, few species and long PCB size. If using the general SMT to mount LED chip, there will be faced with high cost, low mounting efficiency problems. Therefore, The development of a low cost, high speed, high efficient Placement Machine specially used for LED is sure to drive the development of the LED industry, and is the inevitable trend in the development of SMT in the LED industry.
This paper will research the key technology to high speed and high efficiency LED placement machine, the main work is as follows:
(1) Through the structure analysis of typical pick-place equipment and the research of the LED chip mounting characteristics Design a low-cost, high-speed and high-efficiency LED placement machine with double cantilever beam. It can achieve that one head is on paste while another is on suction. So that it can reduce the mount suction idle waiting time and get a high efficiency.
(2) Patch head and feeder directly effect the overall performance of the placement machine. Through the analysis of efficiency in different number of nozzle mount, Design a patch head with two nozzle. Both of this patch head alternating working are more efficient than a single-head with four-nozzle in30%.In addition, under the premise of ensuring accuracy and speed,Design a high speed light belt feeder which is driven by a step-motor, and it's volume is only1/4of the ordinary feeders.
(3) The beam and the frame are two important structural components of the placement machine. It cannot get a good dynamic characteristics only by static mechanical design or experience design. In this paper base on the frequency of design principles combined with the static force checking. making statics and modal analysis on the placement machine's key structure component such as beams and the frame to make sure that the deformation and the natural frequency is to Achieve a reasonable requirements.
(4) The Mesataka Yoshimura method is presented to used in research the stiffness and damping parameters of actual conjoint faces, and complete the dynamic analysis of the placement machine.and analyze the factor affecting the machine's natural frequencies and mode shapes.
(5) Use the LMS vibration instrument to make a hammer vibration test on the prototype to acquire the experimental natural frequency. through comparing with the analysis natural frequency, It shows that the placement machine dynamic performance is Reasonable and effective.
The results of the actual prototype mount show that without the visual correction,the LED Placement machine can meet the precision requirement, and the mount speed reaches the domestic high-grade speed. By hammering method dynamic vibration test, we prove that the dynamic analysis on the LED Placement machine basing on the Mesataka Yoshimura method is feasible, convenient, effective and high analysis precision.
引文
[1]刘耀彬.我国LED产业的发展现状、趋势及战略选择[J].科技进步与对策,2010,27(12)：77-87.
[2]R.Rajbhandari,P.Csaszar, P.Nelson,T.M.Tirpak. Optimization of automated high speed modular placement machines using expert systems[C].Tech Rep, AI Lab,Univ.Illinois,Chicago.1998:224—230.
[3]Lee S H, Lee B H, Park T H. A hierarchical method to improve the productivity of a multi-headsurface mounting machine[C].Proc Of the 1999 IEEE on Robotics and Automation.Michigan.1999:2110—2115.
[4]Ahmadi 1,S Gmtzinger and D Johnson. Component Allocation and Partitioning for a Dual Delivery Placement Machine[J]. Operations Research(ISSN:0030—364x), 1988,36(2):176—191.
[5]孙红飚,银万根,荆秀莲,SMD与贴片机[J].电子工艺技术,1999,20(02)：55-57.
[6]Igor Sosman,Simon Davis.Placement Machine and Process Control Optimizat-ation[J].Electronics Systemintegration Technoloty Conference.2006,9(2):867-872.
[7]Brien, Katherine. Surface mount on flex[C]. Surface Mount Technology.1993: 32—35.
[8]肖永山.片式电子元件贴装设备动力学性能研究[D].机械电子工程：中南大学,2008.
[9]姜凤鹏.基于ADAMS和ANSYS的贴片机动力学分析与结构优化[D].机械设计及理论：上海交通大学,2008.
[10]贾春艳.贴片机研究与结构设计[D].机械电子工程：哈尔滨工程大学,2008
[11]江松根.多头拱架型贴片机全自动工艺优化技术研究[D].机械设计及理论：上海交通大学,2008.
[12]肖永山、宋福民、刘少军.片式电子元件贴装设备综述[J].电子工业专用设备,2006,143(12)：7-13.
[13]鲜飞.贴片设备的选择.表面贴装设备[J].2006(4)：64—67.
[14]鲜飞.贴片机现状及发展趋势[J].中国集成电路,2007,12(16)：71-76.
[15]龙乐.发光二极管封装结构及技术[J].电子与封装,2004,4(4)：24-32.
[16]Homayoun Houman, Li Kin—F, Rafatirad Setareh. Functional units power gating in SMT processors[C]. Institute of Electrical and Electronics Engineers Inc.2005: 125—128.
[17]刘生财.基于虚拟样机的SMT送料器设计与分析[D].机械工程：上海交通大学,2005.
[18]ANSI/EIA 481-C-2003[Z],2003.
[19]商跃进,曹茹,赖文烨.基于CAD/CAE/CAM技术的曲柄连杆机构设计方法研究[J].内燃机车,2008(2)：18-24.
[20]刘晓东,吴入军.车床主轴箱模态分析[J].机械设计与制造,2007(2)：24-25.
[21]扬明亚,扬涛,阴红,等.有限元分析软件在机床床身模态分析中的应用[J].机电工程技术,2007,36(1)：25—27.
[22]张学良,徐格宁,温淑画.机械结合面静动态特性研究回顾及展望[J].太原重型机械学院学报,2002,3(23)：276-279.
[23]张学良.机械结合面动态特性及应用[M].中国科学技术出版社,2002.
[24]刘晓平,徐燕申,宋健伟等.机械结构结合面阻尼参数识别的研究[J].振动与冲击,1995,14(3)：61-65.
[25]徐敏.机床固定结合面动态与热态特性分析[D].机械制造及自动化.东南大学,2006.
[26]M. Zatarain, E. lejardi, EEgana. Modular Synthesis of Machine Tools[J]. Annals of the CIRP,1998,47(1):333-336.
[27]Jung. Do Suh, Seung Hwan Chang, Dai Gil Lee, et al. Damping Characteristics of Composite Hybrid Spindle Covers for High Speed Machine Tools[J]. Journal of Material Processing Technology,2001,113:178—183.
[28]张宇,廖伯瑜,机床结合部参数的有效识别方法[J].昆明理工大学学报,1998(2),36-41.
[29]廖伯瑜,周新民,尹志宏.现代机械动力学及其应用—建模、分析、仿真、修改、控制、优化[M].北京：机械工业出版社,2004.
[30]濮良贵,纪名刚,机械设计[M],北京：高等教育出版社,1999,65-66.
[31]孙健利.精密直线导轨的预加载荷及刚度计算.华中理工大学学报,1988 (6)：35-37.
[32]唐兴伦,范群波,张朝晖等,.A.NSYS工程应用教程[M].北京：中国铁道出版社,2003.
[33]M.Masuko, Y.ITO and C.Fujinoto. Behaviour of Horizontal Stiffness and Micro-sliding on the Bolted Joint under the Normal Preload[C].Proc.12nd Intern.Confer.M.T.D.R.,1972.
[34]Peters J,Merqeay M. Dynamic analysis of machine tools using complex modal method[C].Annals of the CIRP,1976,257-261.
[2]R.Rajbhandari,P.Csaszar, P.Nelson,T.M.Tirpak. Optimization of automated high speed modular placement machines using expert systems[C].Tech Rep, AI Lab,Univ.Illinois,Chicago.1998:224—230.
[3]Lee S H, Lee B H, Park T H. A hierarchical method to improve the productivity of a multi-headsurface mounting machine[C].Proc Of the 1999 IEEE on Robotics and Automation.Michigan.1999:2110—2115.
[4]Ahmadi 1,S Gmtzinger and D Johnson. Component Allocation and Partitioning for a Dual Delivery Placement Machine[J]. Operations Research(ISSN:0030—364x), 1988,36(2):176—191.
[5]孙红飚,银万根,荆秀莲,SMD与贴片机[J].电子工艺技术,1999,20(02)：55-57.
[6]Igor Sosman,Simon Davis.Placement Machine and Process Control Optimizat-ation[J].Electronics Systemintegration Technoloty Conference.2006,9(2):867-872.
[7]Brien, Katherine. Surface mount on flex[C]. Surface Mount Technology.1993: 32—35.
[8]肖永山.片式电子元件贴装设备动力学性能研究[D].机械电子工程：中南大学,2008.
[9]姜凤鹏.基于ADAMS和ANSYS的贴片机动力学分析与结构优化[D].机械设计及理论：上海交通大学,2008.
[10]贾春艳.贴片机研究与结构设计[D].机械电子工程：哈尔滨工程大学,2008
[11]江松根.多头拱架型贴片机全自动工艺优化技术研究[D].机械设计及理论：上海交通大学,2008.
[12]肖永山、宋福民、刘少军.片式电子元件贴装设备综述[J].电子工业专用设备,2006,143(12)：7-13.
[13]鲜飞.贴片设备的选择.表面贴装设备[J].2006(4)：64—67.
[14]鲜飞.贴片机现状及发展趋势[J].中国集成电路,2007,12(16)：71-76.
[15]龙乐.发光二极管封装结构及技术[J].电子与封装,2004,4(4)：24-32.
[16]Homayoun Houman, Li Kin—F, Rafatirad Setareh. Functional units power gating in SMT processors[C]. Institute of Electrical and Electronics Engineers Inc.2005: 125—128.
[17]刘生财.基于虚拟样机的SMT送料器设计与分析[D].机械工程：上海交通大学,2005.
[18]ANSI/EIA 481-C-2003[Z],2003.
[19]商跃进,曹茹,赖文烨.基于CAD/CAE/CAM技术的曲柄连杆机构设计方法研究[J].内燃机车,2008(2)：18-24.
[20]刘晓东,吴入军.车床主轴箱模态分析[J].机械设计与制造,2007(2)：24-25.
[21]扬明亚,扬涛,阴红,等.有限元分析软件在机床床身模态分析中的应用[J].机电工程技术,2007,36(1)：25—27.
[22]张学良,徐格宁,温淑画.机械结合面静动态特性研究回顾及展望[J].太原重型机械学院学报,2002,3(23)：276-279.
[23]张学良.机械结合面动态特性及应用[M].中国科学技术出版社,2002.
[24]刘晓平,徐燕申,宋健伟等.机械结构结合面阻尼参数识别的研究[J].振动与冲击,1995,14(3)：61-65.
[25]徐敏.机床固定结合面动态与热态特性分析[D].机械制造及自动化.东南大学,2006.
[26]M. Zatarain, E. lejardi, EEgana. Modular Synthesis of Machine Tools[J]. Annals of the CIRP,1998,47(1):333-336.
[27]Jung. Do Suh, Seung Hwan Chang, Dai Gil Lee, et al. Damping Characteristics of Composite Hybrid Spindle Covers for High Speed Machine Tools[J]. Journal of Material Processing Technology,2001,113:178—183.
[28]张宇,廖伯瑜,机床结合部参数的有效识别方法[J].昆明理工大学学报,1998(2),36-41.
[29]廖伯瑜,周新民,尹志宏.现代机械动力学及其应用—建模、分析、仿真、修改、控制、优化[M].北京：机械工业出版社,2004.
[30]濮良贵,纪名刚,机械设计[M],北京：高等教育出版社,1999,65-66.
[31]孙健利.精密直线导轨的预加载荷及刚度计算.华中理工大学学报,1988 (6)：35-37.
[32]唐兴伦,范群波,张朝晖等,.A.NSYS工程应用教程[M].北京：中国铁道出版社,2003.
[33]M.Masuko, Y.ITO and C.Fujinoto. Behaviour of Horizontal Stiffness and Micro-sliding on the Bolted Joint under the Normal Preload[C].Proc.12nd Intern.Confer.M.T.D.R.,1972.
[34]Peters J,Merqeay M. Dynamic analysis of machine tools using complex modal method[C].Annals of the CIRP,1976,257-261.