脉冲电流对金属凝固组织的影响
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摘要
脉冲电流对金属凝固过程具有重要影响。研究电流对凝固组织的作用规律，探讨其作用机理是材料制备领域的重要研究课题。本文采用自主研制的中频脉冲电源，以纯铝、纯铜和铝硅、铝铜二元合金为研究对象，运用实验研究方法，探讨了脉冲电流对金属凝固过程及组织的影响，揭示了脉冲电流细化金属凝固组织的机理。
实验研究了中频脉冲电流峰值、脉冲频率及脉宽对纯铝、纯铜凝固组织的影响规律。结果表明：随着电流峰值密度、脉冲频率的增加及脉冲宽度的减小，纯铝的凝固组织由未处理试样的粗大柱状穿晶组织转变为细小的等轴晶组织；但中频脉冲电流对纯铜凝固组织的细化作用不明显，而高压脉冲电流对纯铜凝固组织有较明显的细化作用。这说明脉冲电流对纯铜凝固组织的细化需要更大的脉冲能量，反映了脉冲电流对金属凝固组织的细化作用与金属的性质有密切关系。
研究了脉冲电流对铝硅、铝铜合金宏观和微观凝固组织的影响。发现随着脉冲电流峰值密度和脉冲频率的增加，亚共晶铝硅、铝铜合金宏观凝固组织由未处理时的粗大等轴晶转变为细小等轴晶组织，其微观凝固组织中初生α-Al相由粗大的柱状树枝晶转变为细小等轴晶。铝硅合金中初生α-Al相的量增加，其组织中的共晶硅相随脉冲电流参数的增大由未处理时较大的长条状转变为细小的短条状，且分布变得均匀；铝铜合金微观组织中二次枝晶变短且逐渐消失。研究还发现，随着溶质含量的增加，脉冲电流对铝铜合金凝固组织的细化作用减弱。这也说明脉冲电流对金属的细化作用与金属的性质有密切关系。
本文从研究脉冲电流对晶体形核和晶体长大的影响出发，探讨了脉冲电流对金属凝固组织细化的机理。首先，根据纯铝的不同凝固阶段设计了8种脉冲电流处理工艺，发现脉冲电流作用于形核之前的高温液相阶段对凝固组织没有细化作用，作用于晶体生长阶段对凝固组织的细化作用也不明显，而作用于凝固的形核阶段对纯铝凝固组织细化效果最佳。由此发现脉冲电流对金属凝固组织的细化作用是极大地提高了金属的形核率。为了进一步探讨其机理，本文又设计了在铸型中放置金属网和铸型预热实验。结果表明：脉冲电流作用下铸型型壁上晶核的不断形成和脱落是脉冲电流细化金属凝固组织的直接原因，延迟型壁处形成凝固壳层的时间会极大地提高脉冲电流细化金属凝固组织的效果。
在上述发现的基础上，本文利用电动力学和电磁学理论研究了脉冲电流对金属熔体凝固形核过程的作用，建立了脉冲电流导致晶核增殖的数学模型。揭示了凝固组织的细化不仅与脉冲电流参数有关，而且还与金属的物化性能及铸型材料有关，从理论上解释了相同脉冲电流参数下脉冲电流为何对不同金属的凝固组织有不同的细化效果。通过对脉冲电流作用下晶核的运动分析，解释了试样凝固组织的晶区形状形成原因。
利用定向凝固技术研究了脉冲电流对晶体生长的影响。结果表明：脉冲电流使界面前沿液相中的溶质浓度降低，溶质扩散层厚度减小，脉冲电流显著增大固液界面前沿液相中的温度梯度。当下拉速度为3μm／s时，可使界面生长形态由未施加脉冲电流时的胞状晶生长形态转变为平面晶生长；当下拉速度为14μm／s时，可使未施加脉冲电流时的胞状枝晶生长形态转变为胞状晶生长形态；当下拉速度为96μm／s时，脉冲电流能够抑制柱状树枝晶的二次枝晶臂生长，使二次枝晶臂变短甚至消失。
脉冲电流提高了固液界面生长形态的稳定性，增大了由平面晶向胞状晶、胞状晶向胞状树枝晶转变的临界生长速度。研究发现，随着脉冲电流的增大，界面生长的糊状区深度和一次臂间距逐渐减小。
The electric current pulse (ECP) remarkably influences on solidification processes of metal. In recent years, studying effect and mechanism of ECP on solidification structure is an important item in field of material preparation. The effect of ECP on solidification process and structure of pure Al, pure Cu, and Al-Si, Al-Cu alloys is experimentally investigated by using self-designed pulse current equipment, and the refinement mechanism of ECP on solidification structure is analysed.
Using pulse current with lower voltage and higher frequency investigates the effect of pulse current peak value, frequency and pulse width on solidification structure of pure Al and Cu. The results show that the solidification structure of pure Al transforms from coarse columnar crystal into fine globular crystal with increase of peak value current density and frequency or decrease of pulse width. However, the refining effect of pulse current with higher voltage and lower frequency on solidification structure of pure Cu is more than that of pulse with lower voltage and higher frequency. It is indicated that refinement of solidification structure of pure Cu must use a lager ECP, which reflects there is a closely relationship between effect of ECP on solidification structure and characteristics of metal.
The influence of electric current pulse on solidification structure of hypoeutectic Al-Si and Al-Cu alloy is investigated. The results show that their macrostructure is remarkably refined by using electric current pulse. Moreover, with an increase of the peak value and frequency of current, not only the size of grain is decreased , but also primary a-Al phase of microstructure is transformed from dendritic crystals into equiaxed ones. For the microstructure of Al-Si alloy, quantity of primary a-A\ phase increases, and eutectic Si phase is changed short strip and well-proportioned distribution with ECP from long strip without ECP. For the microstructure of Al-Cu alloys, the secondary-arm gradually disappears. In addition, with the increase of Cu content of hypoeutectic Al-Cu alloys, the refining effect of ECP on macrostructure is weakened, which illustrates farther that there is a closely relationship between effect of ECP on solidification structure and characteristics of metal.
The refining mechanism of ECP on solidification structure is investigated by studying effect of ECP on crystal nucleation and growth.
Firstly, eight ECP treatment techniques are designed according to different solidification stage of pure Al. The experimental results show that the solidification structure can not be refined by exerting ECP on high temperature liquid phase. The ECP has also no obvious influence on the solidification structure when it is applied during crystal growth. However, the very fine structure is obtained by applying ECP during the nucleation of the melt. These verify that refining effect of ECP on structure of metal is promoting the nucleation rate. For making out the reason of enhancing nucleation rate, secondly, the experiments of wire netting beforehand putting into each sand mould and preheating mould are designed. The reason of enhancing nucleation rate is certify that the nuclei created on the mould wall are broken off and fall into the melt, and conformed that the nucleation rate increases by retarding the formation of the solidification shell.
Based on the above results, the effect of ECP on solidification nucleation process is studied by theories of electrodynamics and electromagnetics, and established the mathematic model of nucleus multiplication by ECP. These show that refinement of structure relate with not only parameter of ECP but also characteristic of melt and material of sand mould, which make clear why has a different refining effect for various metal with same parameter of ECP, And make out the formation reason of shape of globular crystal zone by analyzing movement of nucleus under ECP.
The effect of ECP on interface front of temperature field, solute field and interface morphology and stability is investigated during directional solidification. The results show that ECP can decrease solute concentration and solute boundary layer thickness nearby front of solid-liquid interface, and increase remarkably liquid temperature gradient at interface. Application of ECP could makes solid-liquid interface change from cellular to planar interface at the puling rate of 3μm/s, from cellular-dendritic to cellular interface at the puling rate of 14μm/s. When the puling rate is 96μm/s, application of ECP suppresses the secondary dendrites, and makes them shorten even disappear.
The ECP improves the solid-liquid interface stability and increases the critical growth velocity that the interface morphology transforms planar crystal to cellular crystal and cellular crystal to cellular dendrite. It also shows that the cellular spacing and the mushy zone depth decrease with increasing current density.
实验研究了中频脉冲电流峰值、脉冲频率及脉宽对纯铝、纯铜凝固组织的影响规律。结果表明：随着电流峰值密度、脉冲频率的增加及脉冲宽度的减小，纯铝的凝固组织由未处理试样的粗大柱状穿晶组织转变为细小的等轴晶组织；但中频脉冲电流对纯铜凝固组织的细化作用不明显，而高压脉冲电流对纯铜凝固组织有较明显的细化作用。这说明脉冲电流对纯铜凝固组织的细化需要更大的脉冲能量，反映了脉冲电流对金属凝固组织的细化作用与金属的性质有密切关系。
研究了脉冲电流对铝硅、铝铜合金宏观和微观凝固组织的影响。发现随着脉冲电流峰值密度和脉冲频率的增加，亚共晶铝硅、铝铜合金宏观凝固组织由未处理时的粗大等轴晶转变为细小等轴晶组织，其微观凝固组织中初生α-Al相由粗大的柱状树枝晶转变为细小等轴晶。铝硅合金中初生α-Al相的量增加，其组织中的共晶硅相随脉冲电流参数的增大由未处理时较大的长条状转变为细小的短条状，且分布变得均匀；铝铜合金微观组织中二次枝晶变短且逐渐消失。研究还发现，随着溶质含量的增加，脉冲电流对铝铜合金凝固组织的细化作用减弱。这也说明脉冲电流对金属的细化作用与金属的性质有密切关系。
本文从研究脉冲电流对晶体形核和晶体长大的影响出发，探讨了脉冲电流对金属凝固组织细化的机理。首先，根据纯铝的不同凝固阶段设计了8种脉冲电流处理工艺，发现脉冲电流作用于形核之前的高温液相阶段对凝固组织没有细化作用，作用于晶体生长阶段对凝固组织的细化作用也不明显，而作用于凝固的形核阶段对纯铝凝固组织细化效果最佳。由此发现脉冲电流对金属凝固组织的细化作用是极大地提高了金属的形核率。为了进一步探讨其机理，本文又设计了在铸型中放置金属网和铸型预热实验。结果表明：脉冲电流作用下铸型型壁上晶核的不断形成和脱落是脉冲电流细化金属凝固组织的直接原因，延迟型壁处形成凝固壳层的时间会极大地提高脉冲电流细化金属凝固组织的效果。
在上述发现的基础上，本文利用电动力学和电磁学理论研究了脉冲电流对金属熔体凝固形核过程的作用，建立了脉冲电流导致晶核增殖的数学模型。揭示了凝固组织的细化不仅与脉冲电流参数有关，而且还与金属的物化性能及铸型材料有关，从理论上解释了相同脉冲电流参数下脉冲电流为何对不同金属的凝固组织有不同的细化效果。通过对脉冲电流作用下晶核的运动分析，解释了试样凝固组织的晶区形状形成原因。
利用定向凝固技术研究了脉冲电流对晶体生长的影响。结果表明：脉冲电流使界面前沿液相中的溶质浓度降低，溶质扩散层厚度减小，脉冲电流显著增大固液界面前沿液相中的温度梯度。当下拉速度为3μm／s时，可使界面生长形态由未施加脉冲电流时的胞状晶生长形态转变为平面晶生长；当下拉速度为14μm／s时，可使未施加脉冲电流时的胞状枝晶生长形态转变为胞状晶生长形态；当下拉速度为96μm／s时，脉冲电流能够抑制柱状树枝晶的二次枝晶臂生长，使二次枝晶臂变短甚至消失。
脉冲电流提高了固液界面生长形态的稳定性，增大了由平面晶向胞状晶、胞状晶向胞状树枝晶转变的临界生长速度。研究发现，随着脉冲电流的增大，界面生长的糊状区深度和一次臂间距逐渐减小。
The electric current pulse (ECP) remarkably influences on solidification processes of metal. In recent years, studying effect and mechanism of ECP on solidification structure is an important item in field of material preparation. The effect of ECP on solidification process and structure of pure Al, pure Cu, and Al-Si, Al-Cu alloys is experimentally investigated by using self-designed pulse current equipment, and the refinement mechanism of ECP on solidification structure is analysed.
Using pulse current with lower voltage and higher frequency investigates the effect of pulse current peak value, frequency and pulse width on solidification structure of pure Al and Cu. The results show that the solidification structure of pure Al transforms from coarse columnar crystal into fine globular crystal with increase of peak value current density and frequency or decrease of pulse width. However, the refining effect of pulse current with higher voltage and lower frequency on solidification structure of pure Cu is more than that of pulse with lower voltage and higher frequency. It is indicated that refinement of solidification structure of pure Cu must use a lager ECP, which reflects there is a closely relationship between effect of ECP on solidification structure and characteristics of metal.
The influence of electric current pulse on solidification structure of hypoeutectic Al-Si and Al-Cu alloy is investigated. The results show that their macrostructure is remarkably refined by using electric current pulse. Moreover, with an increase of the peak value and frequency of current, not only the size of grain is decreased , but also primary a-Al phase of microstructure is transformed from dendritic crystals into equiaxed ones. For the microstructure of Al-Si alloy, quantity of primary a-A\ phase increases, and eutectic Si phase is changed short strip and well-proportioned distribution with ECP from long strip without ECP. For the microstructure of Al-Cu alloys, the secondary-arm gradually disappears. In addition, with the increase of Cu content of hypoeutectic Al-Cu alloys, the refining effect of ECP on macrostructure is weakened, which illustrates farther that there is a closely relationship between effect of ECP on solidification structure and characteristics of metal.
The refining mechanism of ECP on solidification structure is investigated by studying effect of ECP on crystal nucleation and growth.
Firstly, eight ECP treatment techniques are designed according to different solidification stage of pure Al. The experimental results show that the solidification structure can not be refined by exerting ECP on high temperature liquid phase. The ECP has also no obvious influence on the solidification structure when it is applied during crystal growth. However, the very fine structure is obtained by applying ECP during the nucleation of the melt. These verify that refining effect of ECP on structure of metal is promoting the nucleation rate. For making out the reason of enhancing nucleation rate, secondly, the experiments of wire netting beforehand putting into each sand mould and preheating mould are designed. The reason of enhancing nucleation rate is certify that the nuclei created on the mould wall are broken off and fall into the melt, and conformed that the nucleation rate increases by retarding the formation of the solidification shell.
Based on the above results, the effect of ECP on solidification nucleation process is studied by theories of electrodynamics and electromagnetics, and established the mathematic model of nucleus multiplication by ECP. These show that refinement of structure relate with not only parameter of ECP but also characteristic of melt and material of sand mould, which make clear why has a different refining effect for various metal with same parameter of ECP, And make out the formation reason of shape of globular crystal zone by analyzing movement of nucleus under ECP.
The effect of ECP on interface front of temperature field, solute field and interface morphology and stability is investigated during directional solidification. The results show that ECP can decrease solute concentration and solute boundary layer thickness nearby front of solid-liquid interface, and increase remarkably liquid temperature gradient at interface. Application of ECP could makes solid-liquid interface change from cellular to planar interface at the puling rate of 3μm/s, from cellular-dendritic to cellular interface at the puling rate of 14μm/s. When the puling rate is 96μm/s, application of ECP suppresses the secondary dendrites, and makes them shorten even disappear.
The ECP improves the solid-liquid interface stability and increases the critical growth velocity that the interface morphology transforms planar crystal to cellular crystal and cellular crystal to cellular dendrite. It also shows that the cellular spacing and the mushy zone depth decrease with increasing current density.
引文
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