废印刷电路板中金属铜湿法回收的实验研究
|
摘要
废印刷电路板由于含有对环境有害的物质及丰富的有色金属而受到公众的关注。如果废印刷电路板得不到妥善处理,其中的危险废物会引起严重的环境问题,同时也会浪费含量丰富的有色金属。因此本论文提出了一条从废印刷电路板中回收铜的绿色工艺。
废印刷线路板主要含有金属铜,杂质金属含量很少。因此选择硫酸-双氧水浸出体系从废印刷线路板中回收金属铜,以期望一步获得可供后续铜精炼的纯净硫酸铜溶液。以破碎后的废印刷线路板样品为原料,开展实验以确定硫酸-双氧水浸出体系最佳的工艺参数。实验结果表明,在室温下对10 g废印刷线路板样品一个优化的浸出工艺参数为:100 ml的浸出液,硫酸浓度为15%,双氧水加入量为10 ml。20-50℃的温度范围内、浸出液中铜离子的初始浓度小于13 g/L不会对铜的浸出产生明显的影响。
由于废印刷线路板的破碎过程是一个高能耗的过程,因此在保证铜浸出率的情况下,增大破碎粒径可以降低破碎过程的能量消耗。采用优化的浸出工艺参数,开展实验研究废印刷破碎线路板样品的破碎粒径对铜浸出率的影响。实验结果表明,将废印刷线路板破碎到<1 mm即可满足浸出要求。在这个结果的基础上,本论文提出了一条合理的破碎流程,该流程可以将废印刷线路板总质量的84.67%一次破碎到<1 mm。
浸出液经蒸发结晶后即可得到纯净的五水硫酸铜晶体。由于结晶母液主要含有一定量的硫酸铜和硫酸,母液的循环利用可以避免硫酸及含铜废液的排放,实现工艺的零排放。结晶母液用于浸出过程的5个循环实验中,铜的浸出率均保持在96%以上,结果表明浸出母液用于铜浸出过程是可行的。
Waste printed circuit boards (PCBs) have been attracting the public attention by its environmentally harmful materials and abundant valuable non-ferrous metals. If the waste PCBs are improperly disposed, hazardous materials could cause serious environmental problems and numerous valuable metals would be lost. In this regard, a green process for leaching copper from shredded particles of waste PCBs at room temperature was investigated in the present research.
Waste PCBs contain mainly metal copper and other heavy metals were pretty low. Therefore, sulfuric acid-hydrogen peroxide leaching system was used to obtain pure cupric sulfate solution directly for copper refining. Leaching copper from shredded particles of waste printed circuit boards (PCBs) was carried out in sulfuric acid solution using hydrogen peroxide as an oxidant at room temperature. The results shown that the optimum addition amount was 100ml 15% (wt) sulfuric acid solution and 10 ml of 30% hydrogen peroxide for leaching 10 g waste PCBs powder with a solid/liquid ratio of 1/10 for 3 h at room temperature (~23℃). Moreover leaching temperature and initial copper ion concentration had insignificant effect on the leaching recovery of copper.
Waste PCBs shredding is a high energy-consumption process. Thus specimen with a larger shredding particle would lower the energy consumption. The effect of different particle size of shredded waste PCBs on leaching of copper was investigated under the optimum leaching condition. The results revealed that shredding pieces of waste PCBs smaller than 1 mm was efficient and suitable for copper leaching. Then a reasonable shredding process was proposed and 84.67% (wt) of PCBs pieces were shredded smaller than 1 mm finally.
The leaching solution was concentrated to crystallize pure CuSO4·5H2O product. Since the crystal liquor was mainly consisted of cupric sulfate and sulfuric acid, the reuse of the crystal liquor could avoid the emission of acid waste water with copper content. The recovery of copper reached 96% for the 5 cycles of reusing the raffinate produced from the crystallization to the leaching step, which showed that reusing the crystal liquor at leaching step was feasible.
废印刷线路板主要含有金属铜,杂质金属含量很少。因此选择硫酸-双氧水浸出体系从废印刷线路板中回收金属铜,以期望一步获得可供后续铜精炼的纯净硫酸铜溶液。以破碎后的废印刷线路板样品为原料,开展实验以确定硫酸-双氧水浸出体系最佳的工艺参数。实验结果表明,在室温下对10 g废印刷线路板样品一个优化的浸出工艺参数为:100 ml的浸出液,硫酸浓度为15%,双氧水加入量为10 ml。20-50℃的温度范围内、浸出液中铜离子的初始浓度小于13 g/L不会对铜的浸出产生明显的影响。
由于废印刷线路板的破碎过程是一个高能耗的过程,因此在保证铜浸出率的情况下,增大破碎粒径可以降低破碎过程的能量消耗。采用优化的浸出工艺参数,开展实验研究废印刷破碎线路板样品的破碎粒径对铜浸出率的影响。实验结果表明,将废印刷线路板破碎到<1 mm即可满足浸出要求。在这个结果的基础上,本论文提出了一条合理的破碎流程,该流程可以将废印刷线路板总质量的84.67%一次破碎到<1 mm。
浸出液经蒸发结晶后即可得到纯净的五水硫酸铜晶体。由于结晶母液主要含有一定量的硫酸铜和硫酸,母液的循环利用可以避免硫酸及含铜废液的排放,实现工艺的零排放。结晶母液用于浸出过程的5个循环实验中,铜的浸出率均保持在96%以上,结果表明浸出母液用于铜浸出过程是可行的。
Waste printed circuit boards (PCBs) have been attracting the public attention by its environmentally harmful materials and abundant valuable non-ferrous metals. If the waste PCBs are improperly disposed, hazardous materials could cause serious environmental problems and numerous valuable metals would be lost. In this regard, a green process for leaching copper from shredded particles of waste PCBs at room temperature was investigated in the present research.
Waste PCBs contain mainly metal copper and other heavy metals were pretty low. Therefore, sulfuric acid-hydrogen peroxide leaching system was used to obtain pure cupric sulfate solution directly for copper refining. Leaching copper from shredded particles of waste printed circuit boards (PCBs) was carried out in sulfuric acid solution using hydrogen peroxide as an oxidant at room temperature. The results shown that the optimum addition amount was 100ml 15% (wt) sulfuric acid solution and 10 ml of 30% hydrogen peroxide for leaching 10 g waste PCBs powder with a solid/liquid ratio of 1/10 for 3 h at room temperature (~23℃). Moreover leaching temperature and initial copper ion concentration had insignificant effect on the leaching recovery of copper.
Waste PCBs shredding is a high energy-consumption process. Thus specimen with a larger shredding particle would lower the energy consumption. The effect of different particle size of shredded waste PCBs on leaching of copper was investigated under the optimum leaching condition. The results revealed that shredding pieces of waste PCBs smaller than 1 mm was efficient and suitable for copper leaching. Then a reasonable shredding process was proposed and 84.67% (wt) of PCBs pieces were shredded smaller than 1 mm finally.
The leaching solution was concentrated to crystallize pure CuSO4·5H2O product. Since the crystal liquor was mainly consisted of cupric sulfate and sulfuric acid, the reuse of the crystal liquor could avoid the emission of acid waste water with copper content. The recovery of copper reached 96% for the 5 cycles of reusing the raffinate produced from the crystallization to the leaching step, which showed that reusing the crystal liquor at leaching step was feasible.
引文
[1]中华人民共和国工业和信息化部.中国印刷线路板行业发展情况, 2006. http://www.mii.gov.cn/art/2006/06/23/art 81 16373.html
[2] Jia Li, Hongzhou Lu, Jie Guo et al. Recycle technology for recovering resources and products from waste printed circuit boards. Environmental Science & Technology, 2007, 41(6): 1995~2000
[3] Maixi Lu, ChuiHong Zhou. Recovery metals from electronic scrap by dry separation. Clean Coal Technology, 2002: 259~262
[4] Brandl H, Bosshard R, Wegmann M. Computer munching microbes: Metal leaching from electronic scrap by bacteria and fungi. Hydrometallurgy, 2001, 59(2): 319~326
[5]中华人民共和国环境保护部,中华人民共和国发展与改革委员会.国家危险废物名录, 2008
[6]徐政,沈志刚.废线路板的处理技术.中国粉体技术, 2005, 1: 6~9
[7] Institute of scrap recycling industries Inc. (ISRI). Scrap recycling: where tomorrow begins, Report of ISRI, Washington DC, USA, pp. 16~24, http://www.isri.org/isri-downloads/scrap2.pdf, 2003-01-06
[8]柴晓兰,赵跃民,王春彦等.电子废弃物机械回收的研究现状与发展.污染防治技术, 2003, 16(3): 47~49
[9] Jirang Cui, Eric Forssberg. Mechanical recycling of waste electric and electronic equipment: a review. Journal of Hazardous Materials, 2003, B99: 243~263
[10]丁涛,夏志东,毛倩瑾等.废弃印刷线路板的气流分选研究.电子工艺技术, 2006, 27(6): 348~351
[11]殷进,李光明,徐敏等.废弃印刷线路板中金属的气流分选富集.扬州大学学报(自然科学版), 2008, 11(2): 74~78
[12] S. Zhang, E. Forssberg. Optimization of electrodynamic separation for metals recovery from electronic scrap. Resources, Conservation and Recycling, 1998, 22: 143~162
[13] Chenlong Duan, XuefengWen, Changsheng Shi et al. Recovery of metals from waste printed circuit boards by a mechanical method using a water medium. Journal of Hazardous Materials, 2009, 166: 478~482
[14]李玉文,赵光愉,杨洁.液体浮选法回收废旧电脑线路板中铜的研究.环境科学与管理, 2006, 31(9): 96~98
[15] Gungor, S. M. Gupta. Disassembly sequence planning for products with defective parts in product recovery. Computers & Industrial Engineering, 1998, 35: 161~164
[16]马俊伟,王真真,杨志峰等.电选法回收利用废印刷线路板.环境污染治理技术与设备, 2007, 6(7): 63~66
[17] Jia Li, Zhenming Xu. Environmental Friendly Automatic Line for Recovering Metal from Waste Printed Circuit Boards. Environmental Science & Technology, 2010, 44: 1418~1423
[18] Wu Jiang, Li Jia, Xu Zhen-ming. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board. Journal of Hazardous Materials, 2009, 161: 257~262
[19]白庆中,王晖,韩洁等.世界废弃印刷线路板的机械处理技术现状.环境污染治理技术与设备, 2001, 2(1): 84~89
[20] S. Zhang, E. Forssberg. Mechanical separation-oriented characterization of electronic scrap. Resources Conservation and Recycle, 1997, 21: 247~269
[21]温雪峰,李金惠,朱芬芬等.我国废弃线路板的物理处理技术评述.矿冶, 2005, 14(3): 58~63
[22]高远,程华月,吴昊等.废弃线路板再资源化利用的清洁生产技术.材料研究与应用, 2008, 2(4): 265~268
[23] Yihui Zhou, Wenbiao Wu, Keqiang Qiu. Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation. Waste Management, 2010, 30: 2299~2304
[24]李晶莹,盛广能,孙银峰.电子废弃物中的金属回收技术研究进展.污染防治技术, 2007, 20(6): 40~45
[25] Jirang Cui, Lifeng Zhang. Metallurgical recovery of metals from electronic waste: A review. Journal of Hazardous Materials, 2008, 158: 228~256
[26]罗志华.火法冶金工艺处理电子线路板并富集贵稀金属的研究: [硕士学位论文].上海:同济大学图书馆, 2007
[27] H. Veldbuizen, B. Sippel. Mining discarded electronics. Ind. Environ., 1994, 17(3), 7
[28] APME. Plastics recovery from waste electrical & electronic equipment in non-ferrous metal processes, 8036/GB/07/00, APME (Association of Plastics Manufacturers in Europe) Report, 2000
[29]刘辉,王同华,谭瑞淀.废印刷电路板资源化处理技术研究进展.环境科学与技术, 2009, 32(50): 92~95
[30] S. A. Shuey, P. Taylor. Review of pyrometallurgical treatment of electronic scrap. Mining Engeering, 2005, 57(4): 67~70
[31] H. L. Ehrlich. Microbes and metals. Applied Microbiology and Biotechnology, 1997, 48(6): 687~692
[32] G. J. Olson, J. A. Brierley, C. L. Brierley. Progress in bioleaching: applications of microbial processes by the minerals industries. Applied Microbiology and Biotechnology, 2003, 63(3): 249~257
[33]周培国,郑正,彭晓成等.氧化亚铁硫杆菌浸出线路板中铜的研究.环境污染治理技术与设备, 2006, 7(12): 126~128
[34]周培国,郑正,彭晓成等.氧化亚铁硫杆菌浸出线路板中铜及过程中铁的变化研究.环境污染与防治, 2007, 29(2): 119~122
[35] Tao Yang, Zheng Xu, Jiankang Wen et al. Factors influencing bioleaching copper from waste printed circuit boards by Acidithiobacillus ferrooxidans. Hydrometallurgy, 2009, 97: 29~32
[36] Guobin Liang, Yiwei Mo, Quanfa Zhou et al. Novel strategies of bioleaching metals from printed circuit boards (PCBs) in mixed cultivation of two acidophiles. Enzyme and Microbial Technology, 2010, 47: 322~326
[37] D. Andrews, A. Raychaudhuri, C. Frias. Environmentally sound technologies for recycling secondary lead. Journal of Power Sources, 2000, 84(1): 124~129
[38] L. M. Abrantes, M. C. Costa. Electro-oxidation as a pre-treatment for gold recovery. Hydrometallurgy, 1996, 40: 99~110
[39] S. Ubaldini, P. Fornari, R. Massidda et al. Innovative thiourea gold leaching process. Hydrometallurgy, 1998, 48: 113~124
[40]蔡定建.含金废料中金的回收.再生资源研究, 2001, 4: 14~15
[41] J. Ficeriova, P. Balaz, C. L. Villachica. Thiosulfate leaching of silver, gold and bismuth from a complex sulfide concentrates. Hydrometallurgy, 2005, 77: 35~39
[42]陈占华,顾帼华,锁军.废旧电脑主板中Cu、Al的湿法浸出研究.矿冶工程, 2005, 25(2): 36~38
[43] Zhu Ping, Fan ZeYun, Lin Jie et al. Enhancement of leaching copper by electro-oxidation from metal powders of waste printed circuit board. Journal of Hazardous Materials, 2009, 166: 746~750
[44]张武学.电子废弃物的预处理及铜的电积制备: [硕士学位论文].上海:东华大学图书馆, 2007
[45] Andrea Mecucci, Keith Scott. Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards. Journal of Chemical Technology and Biotechnology, 2002, 77: 449~457
[46]李晶莹.从废电脑线路板中回收金属铜的试验研究.湿法冶金, 2009, 28(4): 225~228
[47] Koyama K., Tanaka M., Lee J. C. Copper leaching behavior from waste printed circuit board in ammonniacal alkaline solution. Mater. Trans., 2006, 47(7): 1788~1792
[48] Koyama K., Tanaka M., Lee J. C. Electrolytic copper deposition from ammoniacal alkaline solution containing Cu(I). Mater. Trans., 2006, 47(8): 2076~2080
[49] Oishi T., Koyama K., Tanaka M. et al. Influence of electrolyte on an energy-saving copper recycling process using ammoniacal alkaline solution. Mater. Trans., 2006, 47(11): 2871~2876
[50] Oishi T., Koyama K., Tanaka M. et al. Influence of ammonium salt on electrowinning of copper from ammoniacal alkaline solution. Electrochemical Acta, 2007, 53: 127~132
[51] T. Oishi, K. Koyama, S. Alam et al. Recovery of high purity copper cathode from printed circuit boards using ammoniacao sulfate or chloride solutions. Hydrometallurgy, 2007, 89: 82~88
[52] Chien Y C, Wang H P, Lin K S et al Oxidation of printed circuit board waste in supercritical water. Water Research, 2000, 34(17): 4279~4283
[53]洪大剑,张德华,邓杰.废印刷电路板的回收处理技术.云南化工, 2006, 33(1): 34~34
[54]李金惠,段晨龙,王海峰等著.电子废弃物处理技术.北京:中国环境科学出版社, 2006
[55]刘景洋.基于湿法剥离的废电路板中焊点锡铅回收关键影响因素研究: [博士学位论文].北京:北京师范大学图书馆, 2010
[56]赵国华,郑正,罗兴章等.测定废弃线路板中重金属的酸消解方法比较.环境化学, 2008, 27(5): 694~695
[57]秦海燕,张立娟,孙家寿.催化氧化-硫酸溶解废杂铜生产硫酸铜试验研究.中国资源综合利用, 2003, 2: 19~20
[58] Keith E. Gubbins, Robert D. Walker. The Solubility and Diffusivity of Oxygen in Electrolytic Solutions. J. Electrochem. Soc., 1965, 112: 469~471
[59] T. Yang, Z. Xu, J.K. Wen et al. Factors influencing bioleaching copper from waste printed circuit boards by Acidithiobacillus ferrooxidans. Hydrometallurgy, 2009, 97: 29~32
[60] F.R. Xiu, F.S. Zhang. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process. J. Hazard. Mater., 2009, 165: 1002~1007
[61] L.K. Wu, K.Y. Chen, S.Y. Cheng et al. Thermal decomposition of hydrogen peroxide in the present of sulfuric acid. Journal of Thermal Analysis and Calorimetry, 2008, 93: 115~120
[2] Jia Li, Hongzhou Lu, Jie Guo et al. Recycle technology for recovering resources and products from waste printed circuit boards. Environmental Science & Technology, 2007, 41(6): 1995~2000
[3] Maixi Lu, ChuiHong Zhou. Recovery metals from electronic scrap by dry separation. Clean Coal Technology, 2002: 259~262
[4] Brandl H, Bosshard R, Wegmann M. Computer munching microbes: Metal leaching from electronic scrap by bacteria and fungi. Hydrometallurgy, 2001, 59(2): 319~326
[5]中华人民共和国环境保护部,中华人民共和国发展与改革委员会.国家危险废物名录, 2008
[6]徐政,沈志刚.废线路板的处理技术.中国粉体技术, 2005, 1: 6~9
[7] Institute of scrap recycling industries Inc. (ISRI). Scrap recycling: where tomorrow begins, Report of ISRI, Washington DC, USA, pp. 16~24, http://www.isri.org/isri-downloads/scrap2.pdf, 2003-01-06
[8]柴晓兰,赵跃民,王春彦等.电子废弃物机械回收的研究现状与发展.污染防治技术, 2003, 16(3): 47~49
[9] Jirang Cui, Eric Forssberg. Mechanical recycling of waste electric and electronic equipment: a review. Journal of Hazardous Materials, 2003, B99: 243~263
[10]丁涛,夏志东,毛倩瑾等.废弃印刷线路板的气流分选研究.电子工艺技术, 2006, 27(6): 348~351
[11]殷进,李光明,徐敏等.废弃印刷线路板中金属的气流分选富集.扬州大学学报(自然科学版), 2008, 11(2): 74~78
[12] S. Zhang, E. Forssberg. Optimization of electrodynamic separation for metals recovery from electronic scrap. Resources, Conservation and Recycling, 1998, 22: 143~162
[13] Chenlong Duan, XuefengWen, Changsheng Shi et al. Recovery of metals from waste printed circuit boards by a mechanical method using a water medium. Journal of Hazardous Materials, 2009, 166: 478~482
[14]李玉文,赵光愉,杨洁.液体浮选法回收废旧电脑线路板中铜的研究.环境科学与管理, 2006, 31(9): 96~98
[15] Gungor, S. M. Gupta. Disassembly sequence planning for products with defective parts in product recovery. Computers & Industrial Engineering, 1998, 35: 161~164
[16]马俊伟,王真真,杨志峰等.电选法回收利用废印刷线路板.环境污染治理技术与设备, 2007, 6(7): 63~66
[17] Jia Li, Zhenming Xu. Environmental Friendly Automatic Line for Recovering Metal from Waste Printed Circuit Boards. Environmental Science & Technology, 2010, 44: 1418~1423
[18] Wu Jiang, Li Jia, Xu Zhen-ming. A new two-roll electrostatic separator for recycling of metals and nonmetals from waste printed circuit board. Journal of Hazardous Materials, 2009, 161: 257~262
[19]白庆中,王晖,韩洁等.世界废弃印刷线路板的机械处理技术现状.环境污染治理技术与设备, 2001, 2(1): 84~89
[20] S. Zhang, E. Forssberg. Mechanical separation-oriented characterization of electronic scrap. Resources Conservation and Recycle, 1997, 21: 247~269
[21]温雪峰,李金惠,朱芬芬等.我国废弃线路板的物理处理技术评述.矿冶, 2005, 14(3): 58~63
[22]高远,程华月,吴昊等.废弃线路板再资源化利用的清洁生产技术.材料研究与应用, 2008, 2(4): 265~268
[23] Yihui Zhou, Wenbiao Wu, Keqiang Qiu. Recovery of materials from waste printed circuit boards by vacuum pyrolysis and vacuum centrifugal separation. Waste Management, 2010, 30: 2299~2304
[24]李晶莹,盛广能,孙银峰.电子废弃物中的金属回收技术研究进展.污染防治技术, 2007, 20(6): 40~45
[25] Jirang Cui, Lifeng Zhang. Metallurgical recovery of metals from electronic waste: A review. Journal of Hazardous Materials, 2008, 158: 228~256
[26]罗志华.火法冶金工艺处理电子线路板并富集贵稀金属的研究: [硕士学位论文].上海:同济大学图书馆, 2007
[27] H. Veldbuizen, B. Sippel. Mining discarded electronics. Ind. Environ., 1994, 17(3), 7
[28] APME. Plastics recovery from waste electrical & electronic equipment in non-ferrous metal processes, 8036/GB/07/00, APME (Association of Plastics Manufacturers in Europe) Report, 2000
[29]刘辉,王同华,谭瑞淀.废印刷电路板资源化处理技术研究进展.环境科学与技术, 2009, 32(50): 92~95
[30] S. A. Shuey, P. Taylor. Review of pyrometallurgical treatment of electronic scrap. Mining Engeering, 2005, 57(4): 67~70
[31] H. L. Ehrlich. Microbes and metals. Applied Microbiology and Biotechnology, 1997, 48(6): 687~692
[32] G. J. Olson, J. A. Brierley, C. L. Brierley. Progress in bioleaching: applications of microbial processes by the minerals industries. Applied Microbiology and Biotechnology, 2003, 63(3): 249~257
[33]周培国,郑正,彭晓成等.氧化亚铁硫杆菌浸出线路板中铜的研究.环境污染治理技术与设备, 2006, 7(12): 126~128
[34]周培国,郑正,彭晓成等.氧化亚铁硫杆菌浸出线路板中铜及过程中铁的变化研究.环境污染与防治, 2007, 29(2): 119~122
[35] Tao Yang, Zheng Xu, Jiankang Wen et al. Factors influencing bioleaching copper from waste printed circuit boards by Acidithiobacillus ferrooxidans. Hydrometallurgy, 2009, 97: 29~32
[36] Guobin Liang, Yiwei Mo, Quanfa Zhou et al. Novel strategies of bioleaching metals from printed circuit boards (PCBs) in mixed cultivation of two acidophiles. Enzyme and Microbial Technology, 2010, 47: 322~326
[37] D. Andrews, A. Raychaudhuri, C. Frias. Environmentally sound technologies for recycling secondary lead. Journal of Power Sources, 2000, 84(1): 124~129
[38] L. M. Abrantes, M. C. Costa. Electro-oxidation as a pre-treatment for gold recovery. Hydrometallurgy, 1996, 40: 99~110
[39] S. Ubaldini, P. Fornari, R. Massidda et al. Innovative thiourea gold leaching process. Hydrometallurgy, 1998, 48: 113~124
[40]蔡定建.含金废料中金的回收.再生资源研究, 2001, 4: 14~15
[41] J. Ficeriova, P. Balaz, C. L. Villachica. Thiosulfate leaching of silver, gold and bismuth from a complex sulfide concentrates. Hydrometallurgy, 2005, 77: 35~39
[42]陈占华,顾帼华,锁军.废旧电脑主板中Cu、Al的湿法浸出研究.矿冶工程, 2005, 25(2): 36~38
[43] Zhu Ping, Fan ZeYun, Lin Jie et al. Enhancement of leaching copper by electro-oxidation from metal powders of waste printed circuit board. Journal of Hazardous Materials, 2009, 166: 746~750
[44]张武学.电子废弃物的预处理及铜的电积制备: [硕士学位论文].上海:东华大学图书馆, 2007
[45] Andrea Mecucci, Keith Scott. Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards. Journal of Chemical Technology and Biotechnology, 2002, 77: 449~457
[46]李晶莹.从废电脑线路板中回收金属铜的试验研究.湿法冶金, 2009, 28(4): 225~228
[47] Koyama K., Tanaka M., Lee J. C. Copper leaching behavior from waste printed circuit board in ammonniacal alkaline solution. Mater. Trans., 2006, 47(7): 1788~1792
[48] Koyama K., Tanaka M., Lee J. C. Electrolytic copper deposition from ammoniacal alkaline solution containing Cu(I). Mater. Trans., 2006, 47(8): 2076~2080
[49] Oishi T., Koyama K., Tanaka M. et al. Influence of electrolyte on an energy-saving copper recycling process using ammoniacal alkaline solution. Mater. Trans., 2006, 47(11): 2871~2876
[50] Oishi T., Koyama K., Tanaka M. et al. Influence of ammonium salt on electrowinning of copper from ammoniacal alkaline solution. Electrochemical Acta, 2007, 53: 127~132
[51] T. Oishi, K. Koyama, S. Alam et al. Recovery of high purity copper cathode from printed circuit boards using ammoniacao sulfate or chloride solutions. Hydrometallurgy, 2007, 89: 82~88
[52] Chien Y C, Wang H P, Lin K S et al Oxidation of printed circuit board waste in supercritical water. Water Research, 2000, 34(17): 4279~4283
[53]洪大剑,张德华,邓杰.废印刷电路板的回收处理技术.云南化工, 2006, 33(1): 34~34
[54]李金惠,段晨龙,王海峰等著.电子废弃物处理技术.北京:中国环境科学出版社, 2006
[55]刘景洋.基于湿法剥离的废电路板中焊点锡铅回收关键影响因素研究: [博士学位论文].北京:北京师范大学图书馆, 2010
[56]赵国华,郑正,罗兴章等.测定废弃线路板中重金属的酸消解方法比较.环境化学, 2008, 27(5): 694~695
[57]秦海燕,张立娟,孙家寿.催化氧化-硫酸溶解废杂铜生产硫酸铜试验研究.中国资源综合利用, 2003, 2: 19~20
[58] Keith E. Gubbins, Robert D. Walker. The Solubility and Diffusivity of Oxygen in Electrolytic Solutions. J. Electrochem. Soc., 1965, 112: 469~471
[59] T. Yang, Z. Xu, J.K. Wen et al. Factors influencing bioleaching copper from waste printed circuit boards by Acidithiobacillus ferrooxidans. Hydrometallurgy, 2009, 97: 29~32
[60] F.R. Xiu, F.S. Zhang. Recovery of copper and lead from waste printed circuit boards by supercritical water oxidation combined with electrokinetic process. J. Hazard. Mater., 2009, 165: 1002~1007
[61] L.K. Wu, K.Y. Chen, S.Y. Cheng et al. Thermal decomposition of hydrogen peroxide in the present of sulfuric acid. Journal of Thermal Analysis and Calorimetry, 2008, 93: 115~120