电子设备电磁兼容与热设计的协同设计
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摘要
当今电子设备设计中,热设计与电磁兼容的冲突越来越激烈,通过仿真可以使产品的测试前移,即融合到研发过程中,在设备投入生产之前就发现并解决问题,减小修改设计的成本。为了准确快速地研究电子设备的热性能与电磁兼容特性,就需要建立合适的仿真模型,共享数据,反馈信息,不断修改,这就是协同设计的基本设计理念。
本文从结构设计、数值理论分析、热分析、电磁兼容测试等方面对协同设计在热与电磁兼容领域的应用进行了研究。论文首先对某非密闭电子机箱进行了热分析仿真建模,利用正交试验法分析了影响温度的诸多因素,找出关键因素;然后,按照电磁兼容测试要求,简化模型,通过设置发射源,接收天线测出屏蔽效能;最后在温度指标达标的情况下,通过屏效的测试来不断修改相关因素参数,设计实验对比分析,最终找出一种既能符合热设计标准又能使屏蔽效果得到最佳的方案。
本文成功应用了协同设计思想,并结合实例,找出热与电磁兼容的协同点,并在电磁兼容模型的建立中参考简化模型准则,利用Flotherm与FloEMC软件进行分析,提出了对协同设计思想在该领域应用的一些补充和展望。
The conflicts of thermal design and EMC are more and more in modern electronic equipments,the product test may be moved forward to research stage via simulation,we can find and resolve the problem before the product be produced and reduce the design cost. In order to research the electronic box’s thermal and EMC factors, we should establish suitably simulate model which consists the data share, information feedback, modification constantly. This is the collaboration design.
According to the structure design, theoretic numerical computation, and simulation of the thermal analysis, electromagnetic test, this paper researched collaboration of EMC, thermal management. First, author modeled a thermal management modeling , found the key factors that affect the temperature; Second, simplify the modeling by the EMC test request, test the electromagnetic shielding effectiveness; At last, found the best result by all experiments which both cater to thermal design and EMC.
This paper shows many factors of temperature and electromagnetic capability, and find out the“Collaboration point”, consulted the simplified rule and simplified the modeling, analysed the result by used the Flotherm and FloEMC software ,complemented the collaboration design theory of thermal design and EMC.
本文从结构设计、数值理论分析、热分析、电磁兼容测试等方面对协同设计在热与电磁兼容领域的应用进行了研究。论文首先对某非密闭电子机箱进行了热分析仿真建模,利用正交试验法分析了影响温度的诸多因素,找出关键因素;然后,按照电磁兼容测试要求,简化模型,通过设置发射源,接收天线测出屏蔽效能;最后在温度指标达标的情况下,通过屏效的测试来不断修改相关因素参数,设计实验对比分析,最终找出一种既能符合热设计标准又能使屏蔽效果得到最佳的方案。
本文成功应用了协同设计思想,并结合实例,找出热与电磁兼容的协同点,并在电磁兼容模型的建立中参考简化模型准则,利用Flotherm与FloEMC软件进行分析,提出了对协同设计思想在该领域应用的一些补充和展望。
The conflicts of thermal design and EMC are more and more in modern electronic equipments,the product test may be moved forward to research stage via simulation,we can find and resolve the problem before the product be produced and reduce the design cost. In order to research the electronic box’s thermal and EMC factors, we should establish suitably simulate model which consists the data share, information feedback, modification constantly. This is the collaboration design.
According to the structure design, theoretic numerical computation, and simulation of the thermal analysis, electromagnetic test, this paper researched collaboration of EMC, thermal management. First, author modeled a thermal management modeling , found the key factors that affect the temperature; Second, simplify the modeling by the EMC test request, test the electromagnetic shielding effectiveness; At last, found the best result by all experiments which both cater to thermal design and EMC.
This paper shows many factors of temperature and electromagnetic capability, and find out the“Collaboration point”, consulted the simplified rule and simplified the modeling, analysed the result by used the Flotherm and FloEMC software ,complemented the collaboration design theory of thermal design and EMC.
引文
[1]谢英俊.电子设备散热与电磁兼容的协同设计.电子机械工程,2004第20卷第1期
[2]唐金欢.电子设备电磁兼容仿真模型的简化研究.硕士论文.西安:西安电子大学,2008
[3]唐兴伦,范群波.ANSYS工程应用教程-热与电磁学篇.中国铁道出版社,2003.1
[4]杨士元.电磁屏蔽理论与时间.北京:国防工业出版社,2006.1
[5]刘国强,赵凌志.ANSOFT工程电磁场有限元分析.北京:电子工业出版社,2005
[6]蔡仁钢.电磁兼容原理、设计和预测技术.北京:北京航空航天大学出版社,1997
[7] Ram,D.J.,Vivekananda.N, Constraint meta-object:a new object model for distributed collaborative designing. IEEE Transactions on Systems, Man and Cybernetcs,1997,27(2):208-220..
[8] Goonetillakea,J.S, Carnduffb, T.W. and Grayc,W.A. An integrity constraint management framework in engineering design. Computers in Indutry,2002,48:29-44.
[9] Lee , Yan-chuen,Gilleard,J,D.Collaborative design:a process model for refurbishment. Automation in Construction,2002,11(5):535-544
[10] Kaga Atsuko, Nakahama Kimio, Hamada Shiro, Yamaguchi Syuichic, Sasada, Tsuyoshi. Collaborative design system with hypermedium and network. Automation in Construction,2001,10(3):309-318
[11] Milad Saad and Mary Lou Mather, Shared understanding in computer-supported collaborative design,Computer Ailded Design. Computer Aided Design,1996.28(3):183-192
[12]何发智,秦亮,罗小春.项目网络协同设计信息化管理系统框架.第十二届全国工程建设计算机应用学术会议论文集, 2004
[13]段玉聪,林伟,董胜.基于网格技术的现代协同设计研究.北京:机械设计,2000,第22卷增刊:39-41
[14] David P.Johns,Alexandra Francois-Saint-Cyr,Fred Genman. EMC&Thermal Design Conflicts in a Pentium PC[J].Electronics Cooling.2002,8(3):1-6.
[15]陶文铨.数值传热学(第二版),西安:西安交通大学出版社,2001
[16]齐从谦.制造业信息化导论.北京:中国宇航出版社,2003.2
[17] Michael P Case,Stephen C-Y Lu, discourse Model for Collaborative Design, Computer Aided Design, 1996,28(5):333-345.
[18]传热学.北京:科学出版社,2002
[19]龚维蒸,张裕荣,电子设备结构设计基础.南京:东南大学出版社,1994
[20]诸邦田,电子电路实用抗干扰技术.北京:人民邮电出版社,1994
[21]生建友,现代军用通信设备结构总体设计.无线电通信技术,2000(6)
[22]吕仁清,蒋全兴.电磁兼容性结构设计.南京:东南大学出版社
[23]刘新颜.接收机散热及电磁兼容设计.电子机械工程,2002,18 (1) 59-62
[24]生建友.抗干扰通信设备的电磁兼容性和热设计.船舰电子对抗,2002,25(1):36-39
[25] Ph.d,Brian P.Rawson, Chang-Yu Wu. Interaction of EMC,Acoustics and Thermal management in the reliable operation of a data center.New York:International Business Machines
[26] B.G.Taylor,“Computer Center Power Engineering for the Tropics”Power Engineering Journal,Vol.1,No.1,p.37-41,January 1987.
[27] Frank BJ.Leferink and Marcel J.C.M van Doom,Inductance ofprinted circuit board ground planes. Electromagnetic Compatibility,1993. Symposium Record. 1993 IEEE International Symposium on 9-13 Aug.1993 Page(s):327-329
[28]Brench,C.E. Heatsink radiation as a function of geometry, Electromagnetic Compatibility,1994. Symposium Record. Compatibility in the Loop. IEEE International Symposium on 22-26 Aug. 1994 Page(s):105-109
[29]David M. Hockanson and James L.Drewniak,Investigation of Fundamental EMI Source Mechanisms Driving Common-Mode Radiation from Printed Circuit Boards with Attached Cables. Electromagnetic Compatibility, IEEE Transactions on Volume 38,Issue 4,Nov. 1996 Page(s):557-566
[30]杨占民.电子机箱屏蔽设计的仿真分析.硕士论文.西安电子科大学,1999
[31]石长生.机箱屏蔽效果的新定义,电磁兼容学术会议论文集,EMC95/郑州, 1995,207-213,
[32]白同云.电磁干扰与兼容,长沙:国防科技大学出版社,1991
[33]杨世铭.传热学(第二版),北京:高等教育出版社,1987
[34]正交试验法编写组.正交试验法,北京:国防工业出版社,1976
[35]丁莲芬.电子设备可靠性设计手册,西安:电子工业出版社
[36]赵春林.电子设备的热设计,电子机械工程, 2002第18卷5期
[37]齐永强,何雅玲等.电子设备热设计的初探研究,现代电子技术, (l1) 2003.144
[38] Lothar O. Hoeft,A Simplified Relationship Between Surface Transfer Impedance and Mode Strirred Chamber Shielding Effectiveness of Cables and Connectors,IEEE.int,Symposium on EMC,2002,441-446.
[39]钱俊锋,章云峰.基于热分析的电子元器件可靠性探讨.电子设计, 2005:161-163
[40]王松岩,王骏.屏蔽技术在结构设计中的应用.机械设计与制造工程,1998,27(5):16-17
[41] J.P.Quine,Aj. Pests Shielding Effectivense of an Enclosure Employing Gasketed Seams Relation Between SE and Gasket Transfer impedance,IEEE,1995, 392-395
[2]唐金欢.电子设备电磁兼容仿真模型的简化研究.硕士论文.西安:西安电子大学,2008
[3]唐兴伦,范群波.ANSYS工程应用教程-热与电磁学篇.中国铁道出版社,2003.1
[4]杨士元.电磁屏蔽理论与时间.北京:国防工业出版社,2006.1
[5]刘国强,赵凌志.ANSOFT工程电磁场有限元分析.北京:电子工业出版社,2005
[6]蔡仁钢.电磁兼容原理、设计和预测技术.北京:北京航空航天大学出版社,1997
[7] Ram,D.J.,Vivekananda.N, Constraint meta-object:a new object model for distributed collaborative designing. IEEE Transactions on Systems, Man and Cybernetcs,1997,27(2):208-220..
[8] Goonetillakea,J.S, Carnduffb, T.W. and Grayc,W.A. An integrity constraint management framework in engineering design. Computers in Indutry,2002,48:29-44.
[9] Lee , Yan-chuen,Gilleard,J,D.Collaborative design:a process model for refurbishment. Automation in Construction,2002,11(5):535-544
[10] Kaga Atsuko, Nakahama Kimio, Hamada Shiro, Yamaguchi Syuichic, Sasada, Tsuyoshi. Collaborative design system with hypermedium and network. Automation in Construction,2001,10(3):309-318
[11] Milad Saad and Mary Lou Mather, Shared understanding in computer-supported collaborative design,Computer Ailded Design. Computer Aided Design,1996.28(3):183-192
[12]何发智,秦亮,罗小春.项目网络协同设计信息化管理系统框架.第十二届全国工程建设计算机应用学术会议论文集, 2004
[13]段玉聪,林伟,董胜.基于网格技术的现代协同设计研究.北京:机械设计,2000,第22卷增刊:39-41
[14] David P.Johns,Alexandra Francois-Saint-Cyr,Fred Genman. EMC&Thermal Design Conflicts in a Pentium PC[J].Electronics Cooling.2002,8(3):1-6.
[15]陶文铨.数值传热学(第二版),西安:西安交通大学出版社,2001
[16]齐从谦.制造业信息化导论.北京:中国宇航出版社,2003.2
[17] Michael P Case,Stephen C-Y Lu, discourse Model for Collaborative Design, Computer Aided Design, 1996,28(5):333-345.
[18]传热学.北京:科学出版社,2002
[19]龚维蒸,张裕荣,电子设备结构设计基础.南京:东南大学出版社,1994
[20]诸邦田,电子电路实用抗干扰技术.北京:人民邮电出版社,1994
[21]生建友,现代军用通信设备结构总体设计.无线电通信技术,2000(6)
[22]吕仁清,蒋全兴.电磁兼容性结构设计.南京:东南大学出版社
[23]刘新颜.接收机散热及电磁兼容设计.电子机械工程,2002,18 (1) 59-62
[24]生建友.抗干扰通信设备的电磁兼容性和热设计.船舰电子对抗,2002,25(1):36-39
[25] Ph.d,Brian P.Rawson, Chang-Yu Wu. Interaction of EMC,Acoustics and Thermal management in the reliable operation of a data center.New York:International Business Machines
[26] B.G.Taylor,“Computer Center Power Engineering for the Tropics”Power Engineering Journal,Vol.1,No.1,p.37-41,January 1987.
[27] Frank BJ.Leferink and Marcel J.C.M van Doom,Inductance ofprinted circuit board ground planes. Electromagnetic Compatibility,1993. Symposium Record. 1993 IEEE International Symposium on 9-13 Aug.1993 Page(s):327-329
[28]Brench,C.E. Heatsink radiation as a function of geometry, Electromagnetic Compatibility,1994. Symposium Record. Compatibility in the Loop. IEEE International Symposium on 22-26 Aug. 1994 Page(s):105-109
[29]David M. Hockanson and James L.Drewniak,Investigation of Fundamental EMI Source Mechanisms Driving Common-Mode Radiation from Printed Circuit Boards with Attached Cables. Electromagnetic Compatibility, IEEE Transactions on Volume 38,Issue 4,Nov. 1996 Page(s):557-566
[30]杨占民.电子机箱屏蔽设计的仿真分析.硕士论文.西安电子科大学,1999
[31]石长生.机箱屏蔽效果的新定义,电磁兼容学术会议论文集,EMC95/郑州, 1995,207-213,
[32]白同云.电磁干扰与兼容,长沙:国防科技大学出版社,1991
[33]杨世铭.传热学(第二版),北京:高等教育出版社,1987
[34]正交试验法编写组.正交试验法,北京:国防工业出版社,1976
[35]丁莲芬.电子设备可靠性设计手册,西安:电子工业出版社
[36]赵春林.电子设备的热设计,电子机械工程, 2002第18卷5期
[37]齐永强,何雅玲等.电子设备热设计的初探研究,现代电子技术, (l1) 2003.144
[38] Lothar O. Hoeft,A Simplified Relationship Between Surface Transfer Impedance and Mode Strirred Chamber Shielding Effectiveness of Cables and Connectors,IEEE.int,Symposium on EMC,2002,441-446.
[39]钱俊锋,章云峰.基于热分析的电子元器件可靠性探讨.电子设计, 2005:161-163
[40]王松岩,王骏.屏蔽技术在结构设计中的应用.机械设计与制造工程,1998,27(5):16-17
[41] J.P.Quine,Aj. Pests Shielding Effectivense of an Enclosure Employing Gasketed Seams Relation Between SE and Gasket Transfer impedance,IEEE,1995, 392-395