基于振镜扫描的激光微焊接技术研究
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摘要
基于振镜扫描的激光微焊接技术,是指在毫米以下非常小的区域内,在计算机的控制下,通过摆动振镜反射激光束来实施快速扫描焊接的一种先进的激光加工技术,它是随着激光技术的发展而逐渐形成的一种新兴的焊接技术。
本文从振镜扫描激光微焊接的技术特点入手,针对激光微焊接目前存在的一些问题和不足,对振镜扫描的激光微焊接技术进行深入的研究,主要内容如下:
振镜扫描的激光微焊接机理的研究。初步研究了不同功率密度的激光束照射到金属表面时发生的物理现象;尤其对激光功率密度在104~107W/cm2范围内的、能进行激光微焊接的激光束照射到金属表面的情况作了更多的分析研究;分析了偏振激光束的特点及其在微焊接中的应用。通过计算机数值模拟,模拟出了激光微焊接过程中的温度场分布。认为激光微焊接的过程是快速加热、快速冷却的过程,且材料在激光束的作用下被动升温的速度大于由于热传导等作用下主动降温的速度。还模拟了激光束照射下形成金属熔池的情况,并对熔池的形成、特性、流态以及在激光微焊接中的作用进行了研究。研究认为激光微焊接中的熔池是表面张力作用相对很强的、Marangoni效应显著的、小雷诺数的、复杂流态的熔池。
振镜扫描的激光微焊接技术的研究。提出了激光微焊接技术的发展趋势,即精密性、准确性、可靠性、快速性。研究了获得精密、准确、可靠、快速地进行激光微焊接的方法和途径。(1)通过合理地选择激光器、f-θ聚焦透镜和扫描振镜等,并配备CCD监视系统以及对激光束的传输变换等方式,实现准确、精密的激光微焊接;(2)通过合理设置激光微焊接过程中的工艺参数(如激光功率、焊接速度、激光光斑尺寸、离焦量、激光脉冲频率、脉冲宽度、脉冲波形等)来实现激光微焊接的可靠性;并且通过研究获得了在脉冲激光缝焊时激光脉冲频率f、激光光斑直径d及扫描速度v之间的关系式f ? d?(1 .2~1.4)?v;(3)研究了如何提高激光微焊接速度的方法。分析认为,激光器本身、焊接过程中所用的钎料(或待焊接的基体材料)以及激光微焊接的系统结构对焊接的速度都有影响。通过遗传算法处理距离循环矩阵的方法来实现对扫描路径的优化,多工位、分时工作等方式的采用来提高设备的利用率,进而提高总体的焊接速度。同时对振镜扫描的激光微焊接系统进行了研究,获得了分别由能量负反馈型Nd:YAG激光器和光纤激光器组成的两套完整的振镜扫描式激光微焊接系统。
通过三个典型实例,即无铅激光植球、漆包线与集成电路铝电极的直接焊接、细铜丝与集成电路铝电极这两种异质金属间的焊接,对基于振镜扫描的激光微焊接技术进行了验证。(1)无铅激光植球是激光微焊接在电子封装领域中的典型应用。通过研究,认为十字交叉的扫描方式和走圆形轨迹的扫描方式不是激光植球的最佳扫描方式。相对而言,直线扫描方式有一定的优越性。能用直线扫描的方式在覆铜板上成功获得直径约为300微米的、与基体材料结合良好的无铅焊料凸点,植球速度可达25点/秒。(2)能将直径为0.10毫米的漆包线与集成电路铝电极直接进行激光微焊接。在焊接前不需要专门去除绝缘漆的过程,简化了漆包线的焊接过程,为大批量漆包线的自动化焊接创造了条件。(3)能将直径为0.25毫米的细铜丝直接焊接到集成电路的铝电极上。在焊接的过程中,激光束直接照射在高熔点的细铜丝上,熔化细铜丝,熔化后的高温液态金属铜向下流动包覆低熔点的铝电极,形成焊点。这种激光微焊接的方法克服了铜铝异质金属间特性差异给焊接过程带来的难度,避免了铝及铝合金焊接过程中易出现气孔、热裂、缺陷、接头软化等的不足。这种方法具有普遍意义,对其它异质金属间的激光焊接也有一定的借鉴意义。
Laser micro-welding technology based on galvanometer scanning, within the welding zone dimension of less than one millimeter, is an advanced laser processing technology, which under the control of the computer, the laser micro-welding is implemented through reflecting laser beam by scanning galvanometers. It is a novel welding technology, which developed along with the development of laser technology.
Focus on the existing problems and shortcomings in laser micro-welding technology, starting with the characteristic of laser micro-welding, this paper studies more deeply laser micro-welding technology based on galvanometer scanning. The major contents are as follows:
Laser micro-welding mechanism and the physical phenomena that laser beams with different power density irradiate the metal surface are studied in this paper. Especially, the circumstances are more analyzed that laser beam, which can be used in laser micro-welding and has the power density of 104~107W/cm2, irradiates the metal surface. Then the characteristic of polarized laser beam and its applications in laser micro-welding are analyzed. Through the numerical simulation to the process of laser micro-welding, obtaining the distribution of the temperature field and coming to the conclusion that the laser micro-welding is a flash heating and cooling process. The results also demonstrate that the heating speed is higher than the cooling speed, which because the temperature are raised passively due to laser energy input and the temperature decreases initiatively due to the heat conduction. The metal molted pool is also simulated. In addition, its formation, characteristic, fluid state and application in the laser micro-welding are studied too. The research shows that the liquid metals flow state in laser micro-welding molted pool is very complex, which the surface tension is relatively stronger, Marangon effect is significant and the Reynolds number is low.
Through the deep study of laser micro-welding technology based on galvanometer scanning, the development trend of laser micro-welding is proposed, namely, precision, accuracy, reliability and rapidity. Then the precise, accurate, reliable and rapid methods and ways of laser micro-welding are studied. (1) The precision and accuracy of laser micro-welding can be realized by transforming laser beam, equipping with CCD real-time monitoring system, and selecting laser, f-theta lens, scanning galvanometers and so on. (2) The reliability assurance in leaser micro-welding can be realized through adjusting process parameters. The process parameters include laser power, welding speed, laser spot in the focal plane, defocusing amount, laser pulse frequency, pulse width, pulse waveform, etc. Moreover, the relation in the laser seam welding among laser pulse frequency f, laser spot d and scanning speed v is obtained through the research, that is f ? d?(1 .2~1.4)?v. (3)Finally, how to improve the laser welding speed is studied. It is considered by analysis that laser, solder (or the matrix material for welding) and the system structure of laser micro-welding had influence on the welding speed. Optimization the scanning path can increase the welding speed through genetic algorithm to the cycle-matrix of distance. It can improve laser micro-welding system utilization rate through using multiple-channel and time-sharing scheme in multi-spot welding. Then, the total laser welding speed is improved.
The system structure of laser micro-welding based on galvanometer scanning is studied. Two kinds of laser micro-welding systems based on galvanometer scanning, which equipped with Nd:YAG laser with an energy negative feedback control system and fiber laser, are obtained through the research.
Laser micro-welding technology based on galvanometer scanning is validated through three typical examples, namely laser soldering bump of lead-free, welding between enameled wire and IC aluminum electrode, and welding for thin copper wire and IC aluminum electrode. (1)Laser lead-free soldering bump is a representative application for laser micro-welding in electronic packaging field. It is considered that the scanning mode of decussate or cycle isn’t the best for laser soldering bump. Comparatively speaking, the linear scanning mode has certain superiority in soldering bump. Soldering bump of lead-free with diameter of 300μm, which has a good bond with the matrix material of CCL(Copper Clad Laminate), can be obtained in linear scanning mode. We can solder 25 bumps per second in this way. (2)The laser micro-welding can be implemented between enameled wire with diameter of 0.10mm and the IC aluminum electrode directly without removing insullac. This method simplifies the process of laser welding for enameled wire and creates the conditions for automatic batch welding. (3)The laser micro-welding can be implemented between thin copper wire with diameter of 0.25mm and the IC aluminum electrode. The thin copper wires are irradiated directly by laser beam and melted. The molten liquid metals Cu flow cocurrently downward and coat IC aluminum electrode, Then the welding joint would be formed. It overcomes the welding difficulty due to the characteristic difference of dissimilar meter Cu-Al, and avoids several disadvantages in laser welding for Al and Al-alloy like porosity, hot cracking, welding joint softening and defect etc. This method has universal significance, and can serve for welding other diisimilar metals.
本文从振镜扫描激光微焊接的技术特点入手,针对激光微焊接目前存在的一些问题和不足,对振镜扫描的激光微焊接技术进行深入的研究,主要内容如下:
振镜扫描的激光微焊接机理的研究。初步研究了不同功率密度的激光束照射到金属表面时发生的物理现象;尤其对激光功率密度在104~107W/cm2范围内的、能进行激光微焊接的激光束照射到金属表面的情况作了更多的分析研究;分析了偏振激光束的特点及其在微焊接中的应用。通过计算机数值模拟,模拟出了激光微焊接过程中的温度场分布。认为激光微焊接的过程是快速加热、快速冷却的过程,且材料在激光束的作用下被动升温的速度大于由于热传导等作用下主动降温的速度。还模拟了激光束照射下形成金属熔池的情况,并对熔池的形成、特性、流态以及在激光微焊接中的作用进行了研究。研究认为激光微焊接中的熔池是表面张力作用相对很强的、Marangoni效应显著的、小雷诺数的、复杂流态的熔池。
振镜扫描的激光微焊接技术的研究。提出了激光微焊接技术的发展趋势,即精密性、准确性、可靠性、快速性。研究了获得精密、准确、可靠、快速地进行激光微焊接的方法和途径。(1)通过合理地选择激光器、f-θ聚焦透镜和扫描振镜等,并配备CCD监视系统以及对激光束的传输变换等方式,实现准确、精密的激光微焊接;(2)通过合理设置激光微焊接过程中的工艺参数(如激光功率、焊接速度、激光光斑尺寸、离焦量、激光脉冲频率、脉冲宽度、脉冲波形等)来实现激光微焊接的可靠性;并且通过研究获得了在脉冲激光缝焊时激光脉冲频率f、激光光斑直径d及扫描速度v之间的关系式f ? d?(1 .2~1.4)?v;(3)研究了如何提高激光微焊接速度的方法。分析认为,激光器本身、焊接过程中所用的钎料(或待焊接的基体材料)以及激光微焊接的系统结构对焊接的速度都有影响。通过遗传算法处理距离循环矩阵的方法来实现对扫描路径的优化,多工位、分时工作等方式的采用来提高设备的利用率,进而提高总体的焊接速度。同时对振镜扫描的激光微焊接系统进行了研究,获得了分别由能量负反馈型Nd:YAG激光器和光纤激光器组成的两套完整的振镜扫描式激光微焊接系统。
通过三个典型实例,即无铅激光植球、漆包线与集成电路铝电极的直接焊接、细铜丝与集成电路铝电极这两种异质金属间的焊接,对基于振镜扫描的激光微焊接技术进行了验证。(1)无铅激光植球是激光微焊接在电子封装领域中的典型应用。通过研究,认为十字交叉的扫描方式和走圆形轨迹的扫描方式不是激光植球的最佳扫描方式。相对而言,直线扫描方式有一定的优越性。能用直线扫描的方式在覆铜板上成功获得直径约为300微米的、与基体材料结合良好的无铅焊料凸点,植球速度可达25点/秒。(2)能将直径为0.10毫米的漆包线与集成电路铝电极直接进行激光微焊接。在焊接前不需要专门去除绝缘漆的过程,简化了漆包线的焊接过程,为大批量漆包线的自动化焊接创造了条件。(3)能将直径为0.25毫米的细铜丝直接焊接到集成电路的铝电极上。在焊接的过程中,激光束直接照射在高熔点的细铜丝上,熔化细铜丝,熔化后的高温液态金属铜向下流动包覆低熔点的铝电极,形成焊点。这种激光微焊接的方法克服了铜铝异质金属间特性差异给焊接过程带来的难度,避免了铝及铝合金焊接过程中易出现气孔、热裂、缺陷、接头软化等的不足。这种方法具有普遍意义,对其它异质金属间的激光焊接也有一定的借鉴意义。
Laser micro-welding technology based on galvanometer scanning, within the welding zone dimension of less than one millimeter, is an advanced laser processing technology, which under the control of the computer, the laser micro-welding is implemented through reflecting laser beam by scanning galvanometers. It is a novel welding technology, which developed along with the development of laser technology.
Focus on the existing problems and shortcomings in laser micro-welding technology, starting with the characteristic of laser micro-welding, this paper studies more deeply laser micro-welding technology based on galvanometer scanning. The major contents are as follows:
Laser micro-welding mechanism and the physical phenomena that laser beams with different power density irradiate the metal surface are studied in this paper. Especially, the circumstances are more analyzed that laser beam, which can be used in laser micro-welding and has the power density of 104~107W/cm2, irradiates the metal surface. Then the characteristic of polarized laser beam and its applications in laser micro-welding are analyzed. Through the numerical simulation to the process of laser micro-welding, obtaining the distribution of the temperature field and coming to the conclusion that the laser micro-welding is a flash heating and cooling process. The results also demonstrate that the heating speed is higher than the cooling speed, which because the temperature are raised passively due to laser energy input and the temperature decreases initiatively due to the heat conduction. The metal molted pool is also simulated. In addition, its formation, characteristic, fluid state and application in the laser micro-welding are studied too. The research shows that the liquid metals flow state in laser micro-welding molted pool is very complex, which the surface tension is relatively stronger, Marangon effect is significant and the Reynolds number is low.
Through the deep study of laser micro-welding technology based on galvanometer scanning, the development trend of laser micro-welding is proposed, namely, precision, accuracy, reliability and rapidity. Then the precise, accurate, reliable and rapid methods and ways of laser micro-welding are studied. (1) The precision and accuracy of laser micro-welding can be realized by transforming laser beam, equipping with CCD real-time monitoring system, and selecting laser, f-theta lens, scanning galvanometers and so on. (2) The reliability assurance in leaser micro-welding can be realized through adjusting process parameters. The process parameters include laser power, welding speed, laser spot in the focal plane, defocusing amount, laser pulse frequency, pulse width, pulse waveform, etc. Moreover, the relation in the laser seam welding among laser pulse frequency f, laser spot d and scanning speed v is obtained through the research, that is f ? d?(1 .2~1.4)?v. (3)Finally, how to improve the laser welding speed is studied. It is considered by analysis that laser, solder (or the matrix material for welding) and the system structure of laser micro-welding had influence on the welding speed. Optimization the scanning path can increase the welding speed through genetic algorithm to the cycle-matrix of distance. It can improve laser micro-welding system utilization rate through using multiple-channel and time-sharing scheme in multi-spot welding. Then, the total laser welding speed is improved.
The system structure of laser micro-welding based on galvanometer scanning is studied. Two kinds of laser micro-welding systems based on galvanometer scanning, which equipped with Nd:YAG laser with an energy negative feedback control system and fiber laser, are obtained through the research.
Laser micro-welding technology based on galvanometer scanning is validated through three typical examples, namely laser soldering bump of lead-free, welding between enameled wire and IC aluminum electrode, and welding for thin copper wire and IC aluminum electrode. (1)Laser lead-free soldering bump is a representative application for laser micro-welding in electronic packaging field. It is considered that the scanning mode of decussate or cycle isn’t the best for laser soldering bump. Comparatively speaking, the linear scanning mode has certain superiority in soldering bump. Soldering bump of lead-free with diameter of 300μm, which has a good bond with the matrix material of CCL(Copper Clad Laminate), can be obtained in linear scanning mode. We can solder 25 bumps per second in this way. (2)The laser micro-welding can be implemented between enameled wire with diameter of 0.10mm and the IC aluminum electrode directly without removing insullac. This method simplifies the process of laser welding for enameled wire and creates the conditions for automatic batch welding. (3)The laser micro-welding can be implemented between thin copper wire with diameter of 0.25mm and the IC aluminum electrode. The thin copper wires are irradiated directly by laser beam and melted. The molten liquid metals Cu flow cocurrently downward and coat IC aluminum electrode, Then the welding joint would be formed. It overcomes the welding difficulty due to the characteristic difference of dissimilar meter Cu-Al, and avoids several disadvantages in laser welding for Al and Al-alloy like porosity, hot cracking, welding joint softening and defect etc. This method has universal significance, and can serve for welding other diisimilar metals.
引文
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