基于钎料球重熔的MEMS微部件自组装及熔滴激光驱动行为
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摘要
基于微钎料熔滴表面张力的MEMS部件自组装技术能够自行实现对微机械部件的组装，形成具有高深宽比的三维复杂微结构，对微机械部件的制造具有重要意义。与此同时，微液滴的驱动行为则为MEMS微开关及微流体器件提供了关键技术，能够启发新型MEMS器件的研发。本文基于激光重熔工艺开发了一种新型的MEMS自组装技术，并搭建了高精度的自组装微操作平台；通过数值方法与试验相结合对影响自组装静平衡位置及精度的各因素进行了系统的研究；并基于计算流体力学方法对自组装的动态翻转过程、钎料同微部件之间的流固耦合机制进行了深入分析；同时，还首次对固体基板上微钎料熔滴的激光驱动行为进行了探索。
自组装精度影响因素研究表明，自组装角度偏差小于2.5o；随着焊盘尺寸和长宽比的增大，自组装静平衡角度越小；同时，自组装中使用的钎料体积越小，静平衡角度越小，越利于自组装系统保持其静平衡位置；而在假设完全铺展润湿的前提下，钎料的表面张力及接触角变化对自组装静平衡位置几乎不会产生影响；在焊盘尺寸／钎料球直径一定时，其静平衡位置几乎相同，这一比值可定义为自组装尺寸因子η。
对无铰链自组装结构的能量分析表明，系统具有减小固定和活动微部件之间间距的趋势（由此提出了“虚铰链”的概念），该趋势会逐渐随着活动微部件接近于静平衡位置而减小，当活动微部件达到静平衡位置时，间距闭合趋势消失。针对无铰链结构基于引线键合工艺，开发了一种新型的MEMS自组装限位结构，在引入该限位结构后，自组装角度偏差小于0.5o。
基于数值研究方法探寻了微钎料熔滴的动态润湿行为，结果表明动态润湿角模型更适合于对快速润湿铺展过程进行拟合，随着润湿铺展时间的加大，会降低拟合准确性。在润湿铺展的初期快速铺展阶段，Rw(t)~tn（n=0.32~0.45）关系能很好的拟合润湿半径随时间的变化，但当钎料趋于平衡状态时，拟合出现偏差。进一步研究表明，钎料的润湿铺展过程可以通过两段Rw(t)~tn关系进行拟合，n值的差异意味着润湿铺展机制的转变。
自组装动态过程的研究结果表明，自组装中钎料熔滴优先铺展翻转的活动微部件，之后才在固定微部件上快速铺展。翻转过程具有增大同一时刻下钎料熔滴在活动微部件上的动态接触角的趋势，增大润湿驱动力，使得活动微部件上熔滴润湿速率更快，呈现出优先铺展的不对称现象。转矩分析表明，自组装动态过程中净转矩Mnet上下振荡，接触线的前进会加剧Mnet的复杂性。平衡位置附近，Mnet会一直保持在0值附近波动，且正负两边的波动接近对称。能量分析表明，自组装钎料熔滴及微部件动能相对于减少的钎料表面能而言十分微小，能量转换效率较低，大部分能量通过转化为内能的方式耗散。
对影响自组装动态过程的各因素分析表明，随着钎料熔滴体积的减小，自组装翻转的速度也越快；钎料润湿铺展速度较慢时，自组装过程呈现出明显的“快-慢-快”的三阶段，这是钎料不对称铺展的结果。而钎料润湿铺展速度较快时，翻转作用对于润湿力的增强效应减弱，钎料熔滴呈现对称铺展的趋势。对于自组装翻转速度而言，当翻转速度较慢时，钎料熔滴自由表面能最低。翻转速度较快时，钎料熔滴自由表面能会出现升高的趋势，之后随着固定微部件上接触线的快速前进，又会急剧降低。
最后，使用激光偏置局部加热方法在开放的固体基板上成功实现了微钎料熔滴的驱动，熔滴总是向着激光中心一侧（热端）移动，之后当激光束中心线同钎料熔滴对称中心重合时，熔滴停止前进。这同一般的液滴热致驱动方向（向冷端移动）正好相反。定性及定量分析结果表明微钎料熔滴驱动过程中，Marangoni对流及钎剂蒸汽反冲作用力会推动熔滴向偏离激光束中心一侧移动（冷端），减弱熔滴向激光束中心靠拢的趋势，钎料熔滴在基板上的热致润湿性变化才是驱动熔滴前进的主要机制。
MEMS self-assembly, which utilizes molten solder surface tension forces to self-assemble MEMS microcomponents, can successfully fabricate sophisticated3-D microstructures with high aspect-ratio. It is significant for MEMS manufacturing. Moreover, actuation of microdroplet is a critical technique for microswithes and microfluidic devices, inspiring the developments of novel MEMS devices. This dissertation presented a new self-assembly method using laser reflowing, and a micromanipulation prototype was developed. Systematic studies were conducted on the factors affecting the equilibrium position and precision of self-assembly via the combined experimental and numerical approaches. Dynamic self-assembly process and solder-microcomponents interactions were also investigated. In addition, a pioneer research was conducted on actuating a microscale solder droplet on an open surface.
Studies on the factors affecting the self-assembly precision show that variations of the equilibrium angle can be controlled within±2.5o; the increasing of pad size and aspect-ratio decrease the equilibrium angle; with smaller solder volume, the equilibrium angle is also smaller and the tendency restoring the microcomponents to equilibrium position is stronger; based on the assumption that the pads can be completely wetted, the variations of solder surface tension and contact angle have no effects on the equilibrium position; a parameter η representing the combination of pad size and solder volumes is proposed and the same η value almost achieves the same equilibrium angle. Energy investigations on the hingeless self-assembly structures demonstrate
that the self-assembly system has the tendency decreasing the gap between the microcomponents (a visual hinge definition is proposed). This tendency decreases with the free microcomponent approaching the equilibrium position, and it vanishes at the equilibrium position. For hingeless structures, a wire limiter, which optimized the self-assembly precision to±0.5o, was developed. Based on the numerical method, dynamic wetting of a microscale solder
droplet was studied. It shows that the dynamic contact angle model is more appropriate for describing the initial fast wetting process, and has a poor accuracy in the vicinity of the equilibrium position. Moreover, the prediction shows that the relations between wetting radius and time can be perfectly described by Rw(t)~tn (n=0.32~0.45) in the initial fast wetting process. A further study indicates that the overall process of wetting can be described by the combined of two Rw(t)~tn relations, in which the change of n represents the difference of wetting mechanisms.
Studies were conducted on the dynamic self-assembly process. The results show that the solder droplet tends to spreading on the free microcomponent firstly, and then spreads on the fixed microcomponent. The self-assembly rotation has the tendency increasing the dynamic contact angle of solder on the free microcomponent. This tendency can increase the wetting force, leading a fast and asymmetric spreading process. A torque analysis show that the net torque of self-assembly oscillates. The advancing of the contact line will increase the complexity of net torque. In the vicinity of the equilibrium position, the net torque oscillates between zero-value and almost presents same amplitudes at positive and negative sides. Energy analysis shows that the kinetic energies of the microcomponent and solder are small compared with the decease of the solder surface energy, which indicates the energy conversion efficiency is low and most of the energy needs to be dissipated.
Analysis on the factors affecting the dynamic self-assembly process shows that the microcomponent rotates faster with the decrease of solder volume. For the slow spreading solder, self-assembly shows obvious “fast-slow-fast” three-stage, which is induced by asymmetric wetting. For the fast spreading solder, the wetting force enhancing effect induced by rotation is weakened, and the solder tends to spreading symmetrically. Investigation on the rotating rate shows that the smaller rate leads to a smaller solder surface energy. With a high rotating rate, the solder surface energy may increase during the self-assembly, and then decreases fast when the contact line advancing on the fixed microcomponent.
In addition, microscale solder droplets were successfully actuated by laser offset-heating on an open surface. The actuations always allow the microdroplet moving to the center of laser beam (hot side), and then trap the droplet when the center of the laser beam and droplet coincides. This movement is opposite to the common thermally induced microdroplet actuations. Qualitative and quantitative analyses demonstrate that Marangoni flow and the vapor recoil forces of the soldering flux lead a movement towards the cold regions, weakening the driving tendency. Whereas, thermally induced wettability alternation is the main mechanism driving the droplet forward.
自组装精度影响因素研究表明，自组装角度偏差小于2.5o；随着焊盘尺寸和长宽比的增大，自组装静平衡角度越小；同时，自组装中使用的钎料体积越小，静平衡角度越小，越利于自组装系统保持其静平衡位置；而在假设完全铺展润湿的前提下，钎料的表面张力及接触角变化对自组装静平衡位置几乎不会产生影响；在焊盘尺寸／钎料球直径一定时，其静平衡位置几乎相同，这一比值可定义为自组装尺寸因子η。
对无铰链自组装结构的能量分析表明，系统具有减小固定和活动微部件之间间距的趋势（由此提出了“虚铰链”的概念），该趋势会逐渐随着活动微部件接近于静平衡位置而减小，当活动微部件达到静平衡位置时，间距闭合趋势消失。针对无铰链结构基于引线键合工艺，开发了一种新型的MEMS自组装限位结构，在引入该限位结构后，自组装角度偏差小于0.5o。
基于数值研究方法探寻了微钎料熔滴的动态润湿行为，结果表明动态润湿角模型更适合于对快速润湿铺展过程进行拟合，随着润湿铺展时间的加大，会降低拟合准确性。在润湿铺展的初期快速铺展阶段，Rw(t)~tn（n=0.32~0.45）关系能很好的拟合润湿半径随时间的变化，但当钎料趋于平衡状态时，拟合出现偏差。进一步研究表明，钎料的润湿铺展过程可以通过两段Rw(t)~tn关系进行拟合，n值的差异意味着润湿铺展机制的转变。
自组装动态过程的研究结果表明，自组装中钎料熔滴优先铺展翻转的活动微部件，之后才在固定微部件上快速铺展。翻转过程具有增大同一时刻下钎料熔滴在活动微部件上的动态接触角的趋势，增大润湿驱动力，使得活动微部件上熔滴润湿速率更快，呈现出优先铺展的不对称现象。转矩分析表明，自组装动态过程中净转矩Mnet上下振荡，接触线的前进会加剧Mnet的复杂性。平衡位置附近，Mnet会一直保持在0值附近波动，且正负两边的波动接近对称。能量分析表明，自组装钎料熔滴及微部件动能相对于减少的钎料表面能而言十分微小，能量转换效率较低，大部分能量通过转化为内能的方式耗散。
对影响自组装动态过程的各因素分析表明，随着钎料熔滴体积的减小，自组装翻转的速度也越快；钎料润湿铺展速度较慢时，自组装过程呈现出明显的“快-慢-快”的三阶段，这是钎料不对称铺展的结果。而钎料润湿铺展速度较快时，翻转作用对于润湿力的增强效应减弱，钎料熔滴呈现对称铺展的趋势。对于自组装翻转速度而言，当翻转速度较慢时，钎料熔滴自由表面能最低。翻转速度较快时，钎料熔滴自由表面能会出现升高的趋势，之后随着固定微部件上接触线的快速前进，又会急剧降低。
最后，使用激光偏置局部加热方法在开放的固体基板上成功实现了微钎料熔滴的驱动，熔滴总是向着激光中心一侧（热端）移动，之后当激光束中心线同钎料熔滴对称中心重合时，熔滴停止前进。这同一般的液滴热致驱动方向（向冷端移动）正好相反。定性及定量分析结果表明微钎料熔滴驱动过程中，Marangoni对流及钎剂蒸汽反冲作用力会推动熔滴向偏离激光束中心一侧移动（冷端），减弱熔滴向激光束中心靠拢的趋势，钎料熔滴在基板上的热致润湿性变化才是驱动熔滴前进的主要机制。
MEMS self-assembly, which utilizes molten solder surface tension forces to self-assemble MEMS microcomponents, can successfully fabricate sophisticated3-D microstructures with high aspect-ratio. It is significant for MEMS manufacturing. Moreover, actuation of microdroplet is a critical technique for microswithes and microfluidic devices, inspiring the developments of novel MEMS devices. This dissertation presented a new self-assembly method using laser reflowing, and a micromanipulation prototype was developed. Systematic studies were conducted on the factors affecting the equilibrium position and precision of self-assembly via the combined experimental and numerical approaches. Dynamic self-assembly process and solder-microcomponents interactions were also investigated. In addition, a pioneer research was conducted on actuating a microscale solder droplet on an open surface.
Studies on the factors affecting the self-assembly precision show that variations of the equilibrium angle can be controlled within±2.5o; the increasing of pad size and aspect-ratio decrease the equilibrium angle; with smaller solder volume, the equilibrium angle is also smaller and the tendency restoring the microcomponents to equilibrium position is stronger; based on the assumption that the pads can be completely wetted, the variations of solder surface tension and contact angle have no effects on the equilibrium position; a parameter η representing the combination of pad size and solder volumes is proposed and the same η value almost achieves the same equilibrium angle. Energy investigations on the hingeless self-assembly structures demonstrate
that the self-assembly system has the tendency decreasing the gap between the microcomponents (a visual hinge definition is proposed). This tendency decreases with the free microcomponent approaching the equilibrium position, and it vanishes at the equilibrium position. For hingeless structures, a wire limiter, which optimized the self-assembly precision to±0.5o, was developed. Based on the numerical method, dynamic wetting of a microscale solder
droplet was studied. It shows that the dynamic contact angle model is more appropriate for describing the initial fast wetting process, and has a poor accuracy in the vicinity of the equilibrium position. Moreover, the prediction shows that the relations between wetting radius and time can be perfectly described by Rw(t)~tn (n=0.32~0.45) in the initial fast wetting process. A further study indicates that the overall process of wetting can be described by the combined of two Rw(t)~tn relations, in which the change of n represents the difference of wetting mechanisms.
Studies were conducted on the dynamic self-assembly process. The results show that the solder droplet tends to spreading on the free microcomponent firstly, and then spreads on the fixed microcomponent. The self-assembly rotation has the tendency increasing the dynamic contact angle of solder on the free microcomponent. This tendency can increase the wetting force, leading a fast and asymmetric spreading process. A torque analysis show that the net torque of self-assembly oscillates. The advancing of the contact line will increase the complexity of net torque. In the vicinity of the equilibrium position, the net torque oscillates between zero-value and almost presents same amplitudes at positive and negative sides. Energy analysis shows that the kinetic energies of the microcomponent and solder are small compared with the decease of the solder surface energy, which indicates the energy conversion efficiency is low and most of the energy needs to be dissipated.
Analysis on the factors affecting the dynamic self-assembly process shows that the microcomponent rotates faster with the decrease of solder volume. For the slow spreading solder, self-assembly shows obvious “fast-slow-fast” three-stage, which is induced by asymmetric wetting. For the fast spreading solder, the wetting force enhancing effect induced by rotation is weakened, and the solder tends to spreading symmetrically. Investigation on the rotating rate shows that the smaller rate leads to a smaller solder surface energy. With a high rotating rate, the solder surface energy may increase during the self-assembly, and then decreases fast when the contact line advancing on the fixed microcomponent.
In addition, microscale solder droplets were successfully actuated by laser offset-heating on an open surface. The actuations always allow the microdroplet moving to the center of laser beam (hot side), and then trap the droplet when the center of the laser beam and droplet coincides. This movement is opposite to the common thermally induced microdroplet actuations. Qualitative and quantitative analyses demonstrate that Marangoni flow and the vapor recoil forces of the soldering flux lead a movement towards the cold regions, weakening the driving tendency. Whereas, thermally induced wettability alternation is the main mechanism driving the droplet forward.
引文
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