塑料机盒的抗EMI膜研究
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摘要
当今社会电磁污染变得日益严重,而塑料在电子产品封装上的广泛应用也从另一个方面加重了电磁污染,随着世界各国关于电子设备的电磁兼容标准和法规的出台,对电子产品进行电磁屏蔽设计已成为必然趋势,塑料机壳的电磁屏蔽已成为国际上热门的研究课题。
本文从理论和实验研究两个方面研究了塑料机壳的电磁屏蔽膜,设计并成功制备了多层膜系结构的屏蔽膜,论文取得的成果和创新点在于:
(1)从经典的传输线理论出发,推导出了与S.A.Schelkunoff电磁屏蔽理论相符合的屏蔽效能理论计算公式,并据此仿真设计了多层、夹层结构的屏蔽膜系结构。
(2)采用磁控溅射技术成功地在PET基底上制备出附着力大于500 kPa、在2 GHz～4 GHz范围内屏蔽效能大于60 dB的多层膜系结构的电磁屏蔽膜;通过实验提出400 nm Cu/160 nm 1Cr18Ni9Ti最佳双层膜结构,这一结构经济实用,完全能满足实际应用的需求;在保持屏蔽膜总厚度不变的情况下,夹层结构的屏蔽膜层可以有效提高屏蔽效能,提高幅度达到10 dB。实验结果与理论设计值也较为吻合,表明所推导研究的屏蔽效能理论计算公式有较大的应用价值。
(3)通过湿法喷砂或等离子处理工艺,增加塑料表面的活性与机械铆合作用,使金属Cu膜和塑料的附着力达到500 kPa以上,提高幅度达到37%,这一工艺对产业化应用有重要实用价值。
(4)提出了用波导法通过测量S_(21)参数来测量金属抗EMI膜的屏蔽效能的测试方法,实现了薄膜屏蔽效能的快捷、准确测试,有实用价值。这一方法在国内尚未见报道。
Nowadays electromagnetic pollution is becoming worse and worse, and the abroad application of the plastic in the package of electronic products also aggravates the pollution. With the electromagnetic compatibility standards and regulations of electronic equipments being promulgated by most countries, it's becoming a trend to do the design of electromagnetic shielding. And the electromagnetic shielding of plastic package has become internationally popular research topics.
In this paper, we researched on the electromagnetic shielding films of plastic package from both theoretical and experimental aspects. We successfully designed and deposited various kinds of metal films for shielding on the plastic PET by magnetron sputtering. The major works and innovation in this paper are as follows:
(1) We deduced the formula for shielding effectiveness using the classic transmission line theory, which complies with the S.A.Schelkunoff theory of electromagnetic shielding. And we simulated and designed shielding films with multi-layers and sandwich structure from the formula.
(2) We deposited various kinds of metal films for shielding with an adhesion of more than 500 kPa and a shielding effectiveness of more than 60 dB between 2 GHz and 4 GHz on the plastic PET by magnetron sputtering; we put forward optimal anti-EMI metal films of 400 nm Cu/160 nm 1Cr18Ni9Ti through experiments, which can meet the needs of practical use; it was proved that shielding films with sandwich structure with the same total thickness can greatly improve the shielding effectiveness by about 10 dB. The experiment results complied with the theory design very well, which indicated that the deduced formula for shielding effectiveness had very important practical value.
(3) We increased the plastic surface roughness and activity with a riveting effect by means of sandblasting or plasma processing-cleaning. As a result, the adhesion of Cu film and plastic had reached more than 500 kPa and been greatly enhanced by 37%. And this technology has important practical applications in the process of industrialization.
(4) We put forward the waveguide to measure the shielding effectiveness by measuring the parameter S_(21) of Anti-EMI metal films, which was fast, exact and practical. And this method has not been reported domestically.
本文从理论和实验研究两个方面研究了塑料机壳的电磁屏蔽膜,设计并成功制备了多层膜系结构的屏蔽膜,论文取得的成果和创新点在于:
(1)从经典的传输线理论出发,推导出了与S.A.Schelkunoff电磁屏蔽理论相符合的屏蔽效能理论计算公式,并据此仿真设计了多层、夹层结构的屏蔽膜系结构。
(2)采用磁控溅射技术成功地在PET基底上制备出附着力大于500 kPa、在2 GHz～4 GHz范围内屏蔽效能大于60 dB的多层膜系结构的电磁屏蔽膜;通过实验提出400 nm Cu/160 nm 1Cr18Ni9Ti最佳双层膜结构,这一结构经济实用,完全能满足实际应用的需求;在保持屏蔽膜总厚度不变的情况下,夹层结构的屏蔽膜层可以有效提高屏蔽效能,提高幅度达到10 dB。实验结果与理论设计值也较为吻合,表明所推导研究的屏蔽效能理论计算公式有较大的应用价值。
(3)通过湿法喷砂或等离子处理工艺,增加塑料表面的活性与机械铆合作用,使金属Cu膜和塑料的附着力达到500 kPa以上,提高幅度达到37%,这一工艺对产业化应用有重要实用价值。
(4)提出了用波导法通过测量S_(21)参数来测量金属抗EMI膜的屏蔽效能的测试方法,实现了薄膜屏蔽效能的快捷、准确测试,有实用价值。这一方法在国内尚未见报道。
Nowadays electromagnetic pollution is becoming worse and worse, and the abroad application of the plastic in the package of electronic products also aggravates the pollution. With the electromagnetic compatibility standards and regulations of electronic equipments being promulgated by most countries, it's becoming a trend to do the design of electromagnetic shielding. And the electromagnetic shielding of plastic package has become internationally popular research topics.
In this paper, we researched on the electromagnetic shielding films of plastic package from both theoretical and experimental aspects. We successfully designed and deposited various kinds of metal films for shielding on the plastic PET by magnetron sputtering. The major works and innovation in this paper are as follows:
(1) We deduced the formula for shielding effectiveness using the classic transmission line theory, which complies with the S.A.Schelkunoff theory of electromagnetic shielding. And we simulated and designed shielding films with multi-layers and sandwich structure from the formula.
(2) We deposited various kinds of metal films for shielding with an adhesion of more than 500 kPa and a shielding effectiveness of more than 60 dB between 2 GHz and 4 GHz on the plastic PET by magnetron sputtering; we put forward optimal anti-EMI metal films of 400 nm Cu/160 nm 1Cr18Ni9Ti through experiments, which can meet the needs of practical use; it was proved that shielding films with sandwich structure with the same total thickness can greatly improve the shielding effectiveness by about 10 dB. The experiment results complied with the theory design very well, which indicated that the deduced formula for shielding effectiveness had very important practical value.
(3) We increased the plastic surface roughness and activity with a riveting effect by means of sandblasting or plasma processing-cleaning. As a result, the adhesion of Cu film and plastic had reached more than 500 kPa and been greatly enhanced by 37%. And this technology has important practical applications in the process of industrialization.
(4) We put forward the waveguide to measure the shielding effectiveness by measuring the parameter S_(21) of Anti-EMI metal films, which was fast, exact and practical. And this method has not been reported domestically.
引文
1.胡世祥,电磁兼容技术.2005,北京:国防工业出版社.
2.陈伟华,电磁兼容实用手册.2000,北京:机械工业出版社
3.Gandelli,A.,F.Grimaccia,and R.E.Zich,EMC strategy in wireless sensor packaging.17th International Zurich Symposium on Electromagnetic Compatibility,2006.:p.582-585.
4.Kuznetsov,V.A.and V.N.Khramenkov,Radio measuring instruments:Present state and development prospects.Measurement Techniques,1995.35(4):p.357-360.
5.孙昌,et al.,Ni3Al/聚酯复合材料的制备及电磁特性研究.电子元件与材料,2007.26(001):p.8-10.
6.Sarto,M.S.,et al.,Nanolayered Lightweight Flexible Shields With Multidirectional Optical Transparency.IEEE Transactions on Electromagnetic Compatibility,2005.47(3):p.602-611.
7.Hansen,D.,Review of EMC aspects in recent European PLC development.Power Engineering Society Summer Meeting,2002 IEEE,2002.3.
8.Guide,A.U.K.,ELECTROMAGNETIC COMPATIBILITY and STRUCTURED CABLING 1996:p.1-15.
9.Mandrusov,V.,et al.,EMC development process for information technology equipment.1999 IEEE International Symposium on Electromagnetic Compatibility,1999.1.
10.Meng,J.,J.Cai,and C.Han,Control methods of EMI for modern radar.2002 3rd International Symposium on Electromagnetic Compatibility,2002:p.714-717.
11.李金儡,et al.,雷达吸波材料的研究进展.功能材料,2005.8:p.1151.
12.潘成,et al.,导电高分子电磁屏蔽材料研究进展.安全与电磁兼容,2004(003):p.1-4.
13.Olmedo,L.,P.Hourquebie,and F.Jousse,Microwave properties of conductive polymers.Synthetic Metals,1995.69(1-3):p.205-208.
14.Shacklette,L.W.,et al.,EMI Shielding of Intrinsically Conductive Polymers.Search of Excellence by Society of Plastic Engineers and Plastics Engineering,1991:p.665-667.
15.刘顺华 and 郭辉进,电磁屏蔽与吸波材料.功能材料与器件学报,2002.8(003):p.213-217.
16.沈国柱,徐政,and蔡瑞琦,基于铁氧体和磁纤维的双层复合材料吸波性能研究.玻璃钢/复合材料,2007(001):p.19-23.
17.陈亮,et al.,雷达吸波涂料的研究进展.表面技术,2007.36(002):p.54-55.
18.张晓宁 and 司琼,纳米技术的杰作--纳米吸波材料.功能材料信息,2006.3(003):p.15-18.
19.朱伟,等离子体技术让所有装备隐形.国防,2006(8):p.08.
20.王岩,et al.,隐身技术与隐身材料研究进展.化学工程师,2006(009):p.43-47.
21.袁林生,et al.,透明屏蔽材料的研究现状及展望.兵器材料科学与工程,2007.2(30):p.82-84.
22.Jackson,B.C.and W.B.Thomas,Performance characteristics of conductive coatings for EMI control.West Conshohoken,PA,ITEM,1999:p.125.
23.Grabner,F.and J.Weiss,Development of flexible materials suitable for shielding electromagnetic waves over a wide range of frequencies.ITEM update,2000:p.46-52.
24.Sarto,M.S.,S.Di Michele,and P.Leerkamp,Electromagnetic performance of innovative lightweight shields toreduce radiated emissions from PCBs.IEEE Transactions on Electromagnetic Compatibility,2002.44(2):p.353-363.
25.Sarto,F.,et al.,Transparent films for electromagnetic shielding of plastics.Reviews on Advanced Materials Science,2003.5(4):p.329-336.
26.Bhatgadde,L.G.and S.Joseph,Electroless techniques for EMI shieldings.Proceedings of the International Conference on Electromagnetic Interference and Compatibility'97,1997:p.443-445.
27.Eveloy,V.,S.Ganesan,and Y.Fukuda,Are you ready for lead-free electronics? IEEE Transactions on Components and Packaging Technologies,2005.28(4):p.884-894.
28.司琼,电磁屏蔽材料的研究现状及发展趋势.上海涂料,2005(04).
29.赵福辰,电磁屏蔽材料的发展现状.材料开发与应用,2001.16(005):p.29-33.
30.刘继光 and 陈奎儒,PP化学镀Ni-Cu-P导电粉末及其涂覆ABS板电磁屏蔽性能研究.工程塑料应用,2006.34(8):p.54-56.
31.孙晓刚,et al.,稀土改性碳纳米管宽带吸波材料.机械工程材料,2006.30(001):p.66-67.
32.杨广舟,et al.,Ni-P-La合金镀层电磁屏蔽效能的研究.金属功能材料,2006.13(002):p.17-20.
33.张丽芳 and 李文明,磁控溅射Cu/Ni薄膜的电磁屏蔽作用.塑料工业,1996.24(003):p.95-97.
34.杨盟,et al.,氧化铟锡(ITO)薄膜的透明吸波特性研究.功能材料与器件学报.2006.12(005):p.465-468.
35.Grabner,F.,G.Teichert,and H.Romanus,Ni-Zn Ferrite Thin Films and Maultilayers for EMC Applications.Journal of Electrical Engineering,2002.53(10):p.10-11.
36.Sarto,M.S.,F.Sarto,and M.Candidi,Ion beam sputtering of Fe-Hf-O ferromagnetic thin films of EMI shielding applications.2003 IEEE International Symposium on Electromagnetic Compatibility,2003.1.
37.Kim,W.M.,et al.,The electromagnetic interference shielding effect of indium-zinc oxide/silver alloy multilayered thin films.Thin Solid Films,2005.473(2):p.315-320.
38.S.R.RAMASAMY.,A REVIEW OF EMI SHIELDING AND SUPPRESSION MATERIALS.SEMCEI,1997:p.459-466.
39.Sadiku,M.N.O.,Electromagnetic compatibility.Potentials,IEEE,1992.11(2):p.16-18.
40.Colaneri,N.F.,et al.,EMI shielding measurements of conductive polymer blends.IEEE Transactions on Instrumentation and Measurement,1992.41(2):p.291-297.
41.蔡任钢,电磁兼容原理、设计和预则技术.1997,北京:北京航空航天大学出版社.
42.陈抗生,电磁场与电磁波.2003,北京:高等教育出版社.
43.Schelkunoff,S.A.,The Electromagnetic Theory of Coaxial Transmission Lines and Cylindrical Shields.Bell Syst.Tech.J,1934.13(4):p.532.
44.Schelkunoff,S.A.,Electromagnetic Waves.1943:D.Van Nostrand Company,inc.
45.田民汉 and 刘德令,薄膜科学与技术手册.1991,北京:机械工业出版社.
46.中华人民共和国电子工业部,材料屏蔽交通的测量方法 SJ20524-1995.1995.
47.张宇民,et al.,金属丝网透明电磁屏蔽层材料制备与性能研究.兵器材料科学与工程,2007:p.8-10.
48.Yasufuku,S.,Technical progress of EMI shielding materials in Japan.Electrical Insulation Magazine,IEEE,1990.6(6):p.21-30.
49.程明军,et al.,抗电磁辐射织物屏蔽效能的测试方法.印染,2003.29(009):p.31-35.
50.View,T.O.C.,Nanotechnology of transparent metals for radio frequency electromagnetic shielding.IEEE Transactions on Electromagnetic Compatibility,2003.45(4):p.586-594.
51.http://info.china.alibaba.com/news/subject/v6-s5008350.html.
2.陈伟华,电磁兼容实用手册.2000,北京:机械工业出版社
3.Gandelli,A.,F.Grimaccia,and R.E.Zich,EMC strategy in wireless sensor packaging.17th International Zurich Symposium on Electromagnetic Compatibility,2006.:p.582-585.
4.Kuznetsov,V.A.and V.N.Khramenkov,Radio measuring instruments:Present state and development prospects.Measurement Techniques,1995.35(4):p.357-360.
5.孙昌,et al.,Ni3Al/聚酯复合材料的制备及电磁特性研究.电子元件与材料,2007.26(001):p.8-10.
6.Sarto,M.S.,et al.,Nanolayered Lightweight Flexible Shields With Multidirectional Optical Transparency.IEEE Transactions on Electromagnetic Compatibility,2005.47(3):p.602-611.
7.Hansen,D.,Review of EMC aspects in recent European PLC development.Power Engineering Society Summer Meeting,2002 IEEE,2002.3.
8.Guide,A.U.K.,ELECTROMAGNETIC COMPATIBILITY and STRUCTURED CABLING 1996:p.1-15.
9.Mandrusov,V.,et al.,EMC development process for information technology equipment.1999 IEEE International Symposium on Electromagnetic Compatibility,1999.1.
10.Meng,J.,J.Cai,and C.Han,Control methods of EMI for modern radar.2002 3rd International Symposium on Electromagnetic Compatibility,2002:p.714-717.
11.李金儡,et al.,雷达吸波材料的研究进展.功能材料,2005.8:p.1151.
12.潘成,et al.,导电高分子电磁屏蔽材料研究进展.安全与电磁兼容,2004(003):p.1-4.
13.Olmedo,L.,P.Hourquebie,and F.Jousse,Microwave properties of conductive polymers.Synthetic Metals,1995.69(1-3):p.205-208.
14.Shacklette,L.W.,et al.,EMI Shielding of Intrinsically Conductive Polymers.Search of Excellence by Society of Plastic Engineers and Plastics Engineering,1991:p.665-667.
15.刘顺华 and 郭辉进,电磁屏蔽与吸波材料.功能材料与器件学报,2002.8(003):p.213-217.
16.沈国柱,徐政,and蔡瑞琦,基于铁氧体和磁纤维的双层复合材料吸波性能研究.玻璃钢/复合材料,2007(001):p.19-23.
17.陈亮,et al.,雷达吸波涂料的研究进展.表面技术,2007.36(002):p.54-55.
18.张晓宁 and 司琼,纳米技术的杰作--纳米吸波材料.功能材料信息,2006.3(003):p.15-18.
19.朱伟,等离子体技术让所有装备隐形.国防,2006(8):p.08.
20.王岩,et al.,隐身技术与隐身材料研究进展.化学工程师,2006(009):p.43-47.
21.袁林生,et al.,透明屏蔽材料的研究现状及展望.兵器材料科学与工程,2007.2(30):p.82-84.
22.Jackson,B.C.and W.B.Thomas,Performance characteristics of conductive coatings for EMI control.West Conshohoken,PA,ITEM,1999:p.125.
23.Grabner,F.and J.Weiss,Development of flexible materials suitable for shielding electromagnetic waves over a wide range of frequencies.ITEM update,2000:p.46-52.
24.Sarto,M.S.,S.Di Michele,and P.Leerkamp,Electromagnetic performance of innovative lightweight shields toreduce radiated emissions from PCBs.IEEE Transactions on Electromagnetic Compatibility,2002.44(2):p.353-363.
25.Sarto,F.,et al.,Transparent films for electromagnetic shielding of plastics.Reviews on Advanced Materials Science,2003.5(4):p.329-336.
26.Bhatgadde,L.G.and S.Joseph,Electroless techniques for EMI shieldings.Proceedings of the International Conference on Electromagnetic Interference and Compatibility'97,1997:p.443-445.
27.Eveloy,V.,S.Ganesan,and Y.Fukuda,Are you ready for lead-free electronics? IEEE Transactions on Components and Packaging Technologies,2005.28(4):p.884-894.
28.司琼,电磁屏蔽材料的研究现状及发展趋势.上海涂料,2005(04).
29.赵福辰,电磁屏蔽材料的发展现状.材料开发与应用,2001.16(005):p.29-33.
30.刘继光 and 陈奎儒,PP化学镀Ni-Cu-P导电粉末及其涂覆ABS板电磁屏蔽性能研究.工程塑料应用,2006.34(8):p.54-56.
31.孙晓刚,et al.,稀土改性碳纳米管宽带吸波材料.机械工程材料,2006.30(001):p.66-67.
32.杨广舟,et al.,Ni-P-La合金镀层电磁屏蔽效能的研究.金属功能材料,2006.13(002):p.17-20.
33.张丽芳 and 李文明,磁控溅射Cu/Ni薄膜的电磁屏蔽作用.塑料工业,1996.24(003):p.95-97.
34.杨盟,et al.,氧化铟锡(ITO)薄膜的透明吸波特性研究.功能材料与器件学报.2006.12(005):p.465-468.
35.Grabner,F.,G.Teichert,and H.Romanus,Ni-Zn Ferrite Thin Films and Maultilayers for EMC Applications.Journal of Electrical Engineering,2002.53(10):p.10-11.
36.Sarto,M.S.,F.Sarto,and M.Candidi,Ion beam sputtering of Fe-Hf-O ferromagnetic thin films of EMI shielding applications.2003 IEEE International Symposium on Electromagnetic Compatibility,2003.1.
37.Kim,W.M.,et al.,The electromagnetic interference shielding effect of indium-zinc oxide/silver alloy multilayered thin films.Thin Solid Films,2005.473(2):p.315-320.
38.S.R.RAMASAMY.,A REVIEW OF EMI SHIELDING AND SUPPRESSION MATERIALS.SEMCEI,1997:p.459-466.
39.Sadiku,M.N.O.,Electromagnetic compatibility.Potentials,IEEE,1992.11(2):p.16-18.
40.Colaneri,N.F.,et al.,EMI shielding measurements of conductive polymer blends.IEEE Transactions on Instrumentation and Measurement,1992.41(2):p.291-297.
41.蔡任钢,电磁兼容原理、设计和预则技术.1997,北京:北京航空航天大学出版社.
42.陈抗生,电磁场与电磁波.2003,北京:高等教育出版社.
43.Schelkunoff,S.A.,The Electromagnetic Theory of Coaxial Transmission Lines and Cylindrical Shields.Bell Syst.Tech.J,1934.13(4):p.532.
44.Schelkunoff,S.A.,Electromagnetic Waves.1943:D.Van Nostrand Company,inc.
45.田民汉 and 刘德令,薄膜科学与技术手册.1991,北京:机械工业出版社.
46.中华人民共和国电子工业部,材料屏蔽交通的测量方法 SJ20524-1995.1995.
47.张宇民,et al.,金属丝网透明电磁屏蔽层材料制备与性能研究.兵器材料科学与工程,2007:p.8-10.
48.Yasufuku,S.,Technical progress of EMI shielding materials in Japan.Electrical Insulation Magazine,IEEE,1990.6(6):p.21-30.
49.程明军,et al.,抗电磁辐射织物屏蔽效能的测试方法.印染,2003.29(009):p.31-35.
50.View,T.O.C.,Nanotechnology of transparent metals for radio frequency electromagnetic shielding.IEEE Transactions on Electromagnetic Compatibility,2003.45(4):p.586-594.
51.http://info.china.alibaba.com/news/subject/v6-s5008350.html.
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