一种优化的大面积薄板焊接工艺
详细信息 查看官网全文
- 英文论文题名：An optimized welding process for large area sheet
- 论文作者：徐晟晨 ; 汪健 ; 魏子陵
- 英文论文作者：XU Sheng-chen ; WANG Jian ; WEI Zi-ling ; Nanjing Lijingsheng Electronic Co. ; Ltd ; Nanjing Tongchuang Electronic Information Equipment Manufacturing Co. ; Ltd
- 年：2016
- 作者机构：南京利景盛电子有限公司;南京同创电子信息设备制造有限公司;
- 论文关键词：大面积薄板 ; 空洞率 ; 印刷 ; 回流焊
- 英文论文关键词：Large area sheet ; Voidage ; Printing ; Reflow soldering
- 会议召开时间：2016-11-10
- 会议录名称：2016中国高端SMT学术会议论文集
- 语种：中文
- 分类号：TN405
- 学会代码：SMTS
- 会议名称：2016中国高端SMT学术会议
- 会议地点：中国福建厦门
- 主办单位：四川省电子学会SMT专委会、广东省电子学会SMT专委会、厦门市技师协会SMT专委会、陕西省电子学会SMT专委会、山东省电子制造技术专委会、上海市电子学会SMT专委会、安徽省电子学会SMT专委会、南京市电子学会SMT专委会、清华大学伟创力SMT实验室、SMTA China、英国环球SMT与封装、EM Asia、电子工艺技术杂志社、广东技术师范学院SMT实训中心
- 学会名称：四川省电子学会SMT专业委员会
- 页数：7
- 文件大小：1352k
- 原文格式：D
- 会议级别：全国
摘要
为了降低大面积薄板的焊接空洞率,通过对大面积薄板回流焊工艺进行一系列优化,将原圆形矩阵开口印刷焊网孔改为菱形矩阵开口,增加了焊接面积,并且采用分别印刷单独回流工艺代替传统工艺。X射线等检测结果表明,采用上述优化工艺处理的大面积薄板,焊接的空洞率在10%以下。
In order to reduce the welded voidage of the large area sheet, a series of optimized steps were proceeded based on the common reflow soldering for the large area sheet. The diamond matrix opening changed from the original circular matrix opening increased the welding area. And the used process of respective printing and respective backflow was instead of the common process. After handled by the improved process, the large area sheet was tested by the X ray and its result shows that the value of the welded voidage is below 10%.
In order to reduce the welded voidage of the large area sheet, a series of optimized steps were proceeded based on the common reflow soldering for the large area sheet. The diamond matrix opening changed from the original circular matrix opening increased the welding area. And the used process of respective printing and respective backflow was instead of the common process. After handled by the improved process, the large area sheet was tested by the X ray and its result shows that the value of the welded voidage is below 10%.
引文
[1]魏子陵,陈旭,周健.大面积薄板回流焊工艺的优化设计[J].电子元件与材料,2014,33(1).
[2]张英,安占军.印制板在腔体内大面积回流焊接工艺研究[C]//全国青年印制电路学术年会.2014.
[3]孙立军,吴岳琳.回流焊接质量缺陷的控制技术[C]//第九届中国高端SMT学术会议.2015:12.
[4]程鹏飞.LF2000锡膏印刷性能及回流焊后空洞的研究[D].哈尔滨工业大学,2010.
[5]彭勇,王万刚,刘新.回流焊缺陷成因及其解决对策的研究[J].热加工工艺,2011,40(1):149-151.
[6]史建卫,宋耀宗.回流焊工艺中常见缺陷及其防止措施[J].电子工艺技术,2011,32(1):58-61.
[7]旷仁雄,谢飞.无/低空洞回流焊接技术[J].半导体技术,2010,35(6):577-579.
[2]张英,安占军.印制板在腔体内大面积回流焊接工艺研究[C]//全国青年印制电路学术年会.2014.
[3]孙立军,吴岳琳.回流焊接质量缺陷的控制技术[C]//第九届中国高端SMT学术会议.2015:12.
[4]程鹏飞.LF2000锡膏印刷性能及回流焊后空洞的研究[D].哈尔滨工业大学,2010.
[5]彭勇,王万刚,刘新.回流焊缺陷成因及其解决对策的研究[J].热加工工艺,2011,40(1):149-151.
[6]史建卫,宋耀宗.回流焊工艺中常见缺陷及其防止措施[J].电子工艺技术,2011,32(1):58-61.
[7]旷仁雄,谢飞.无/低空洞回流焊接技术[J].半导体技术,2010,35(6):577-579.