摘要
半导体材料硅,在第三周期IVA族,核外有4个电子,具有较稳定的结构。简述了硅的发展应用史;从化学角度,对单质硅材料、二氧化硅材料、有机硅材料等几个典型材料的元素结构、制备工艺、反应机理和应用机理等方面进行详细分析;总结展望了硅元素未来的发展。
Silicon, the emiconductor material, is in the third cycle, IVA family. There are four electrons outside the nucleus, with a more stable structure. A brief history of silicon development and application was specified. From the chemical point of view, the elemental structure, preparation technology, reaction mechanism and application mechanism of several typical materials such as silicon, silicon dioxide and organic silicon are analyzed in detail. The future development of silicon is summarized and prospected.
引文
[1] Terry Devitt.Main Group Chemistry,1994,2(3):32
[2] 中国有色金属工业协会.中国硅业.北京:冶金工业出版社,2014:1
[3] 金学桐,冯殿义.科学家,2017(17):2,15
[4] Plummer J D,Deal M D,Griffin P B.硅超大规模集成电路工艺技术:理论、实践与模型Silicon VLSI Technology:fundamentals,practice and modeling.北京:电子工业出版社,2003:94-149
[5] 黄伟.薄膜晶体管的功能层修饰与性能关系的研究.成都:电子科技大学博士学位论文,2016:5
[6] 魏亚魁,张琳,孟坤,等.广州化工,2018,46(23):141-142
[7] 田丽.微电子工艺[EB/OL].(2012-08-30).https://wenku.baidu.com/view/7ef1c51ac281e53a5802ffad.html
[8] Cui Y,Wei Q,Park H,et al.Science,2001,293(5533):1289-1292
[9] Chiappini C,Campagnolo P,Almeida C S,et al.Advanced Materials,2015,27(35):5147-5152
[10] Peretz-Soroka H,Pevzner A,Davidi G,et al.Nano Lett.,2013,13(7):3157-3168
[11] Shalek A K,Robinson J T,Karp E S,et al.Proceedings of the National Academy of Sciences,2010,107(5):1870-1875
[12] Lee S K,Kim G S,Wu Y,et al.Nano Lett.,2012,12 (6):2697-2704
[13] Miao R,Mu L,Zhang H,et al.Nano Lett.,2014,14 (6):3124-3129
[14] Xue M,Zhong X,Shaposhnik Z,et al.Journal of the American Chemical Society,2011,133(23):8798-8801
[15] Cao X,Mu L,Chen M,et al.Advanced Biosystems,2018,DOI:10.1002/adbi.201800213
[16] Assaedi H,Shaikh F U A,Low I M.Construction and Building Materials,2016,123:541-552
[17] Qin W,Vautard F,Askeland P,et al.Polymer Composites,2017,38(7):1474-1482
[18] Kresge C T,Leonowicz M E,Roth W J,et al.Nature,1992,359(6397):710-712
[19] Teng Z,Su X,Zheng Y,et al.Journal of the American Chemical Society,2015,137(24):7935-7944
[20] Anglin E J,Cheng L,Freeman W R,et al.Advanced drug delivery reviews,2008,60(11):1266-1277
[21] Liu H,Song J,Shang S,et al.ACS Applied Materials & Interfaces,2012,4(5):2413-2419
[22] Asadollahi S,Profili J,Farzaneh M,et al.Materials,2019,12(2):219
[23] Longhi M,Casagrande R B,Kunst S R,et al.Materials Research,2019,22(3):1-11
[24] 尚洪帅,邹松华,杨韶,等.电镀与涂饰,2019,38(6):266-269
[25] 何益飞,张利萍,李飞娥.有机硅材料,2009,23(2):122-125
[26] Aziz T,Fan H,Khan FU,et al.Polym.Bull,2019,76:2129
[27] Lei H,Xiao J,Xiong M,et al.Coatings,2019,9:159
[28] Chen Q,Zhao J,Ren J,et al.Advanced Functional Materials,2019,DOI:10.1002/adfm.201900469
[29] Tsurugi H,Mashima K.Chemistry-A European Journal,2019,25(4):913-919