退火工艺对快速凝固Au-20Sn钎料组织与性能的影响
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摘要
采用单辊快速凝固技术制备了Au-20Sn钎料薄带,借助FESEM、EPMA和EDS等测试手段,研究退火工艺对快速凝固Au-20Sn钎料合金组织与性能的影响。结果表明,单辊快速凝固Au-20Sn钎料合金由少量树枝状的初生ζ′-Au_5Sn相和共晶组织(ζ′-Au_5Sn+δ-AuSn)组成,显微组织细小。退火过程中,Sn元素从ζ′-Au_5Sn相中向δ-AuSn相中扩散,δ-AuSn相长大。基于钎料薄带显微组织、成分分布和塑性综合考虑,确定退火工艺为240℃×4h。
Au-20 Sn solder ribbon was prepared by single-roller rapid solidification technology.The effects of annealing process on microstructure and properties of rapidly solidified Au-20 Sn solder alloy were characterized by FESEM,EPMA and EDS.The results show that the single-roller rapidly solidified Au-20 Sn solder alloy consists of a small amount of primaryζ′-Au5 Sn dendrites and eutectic structure(ζ′-Au5 Sn+δ-AuSn),and the microstructure is refined.During the annealing treatment,theδ-AuSn phase grows gradually because Sn element is diffused into theδ-AuSn phase from theζ′-Au5 Sn phase.Based on considering the microstructure,composition distribution and toughness,the annealing process is determined to be at 240 ℃for 4 h.
Au-20 Sn solder ribbon was prepared by single-roller rapid solidification technology.The effects of annealing process on microstructure and properties of rapidly solidified Au-20 Sn solder alloy were characterized by FESEM,EPMA and EDS.The results show that the single-roller rapidly solidified Au-20 Sn solder alloy consists of a small amount of primaryζ′-Au5 Sn dendrites and eutectic structure(ζ′-Au5 Sn+δ-AuSn),and the microstructure is refined.During the annealing treatment,theδ-AuSn phase grows gradually because Sn element is diffused into theδ-AuSn phase from theζ′-Au5 Sn phase.Based on considering the microstructure,composition distribution and toughness,the annealing process is determined to be at 240 ℃for 4 h.
引文
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[2]周涛,汤姆·鲍勃,马丁·奥德,等.金锡焊料及其在电子器件封装领域中的应用[J].电子与封装,2005,5(8):5-8.
[3]LIU Y C,TEO J W R,TUNG S K.High-temperature creep and hardness of eutectic 80Au/20Sn solder[J].Journal of Alloys and Compounds,2008,448(1-2):340-343.
[4]WEI X F,ZHANG Y K,WANG R C,et al.Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints[J].Microelectronics Reliability,2013,53(5):748-754.
[5]李才巨,陶静梅,朱心昆,等.机械合金化法制备金锡合金[J].材料热处理学报,2010,31(4):40-44.
[6]熊杰然.光电子封装用金锡焊片的制备[D].武汉:华中科技大学,2008.
[7]YAMADA T,MIURA K,KAJIHARA M,et al.Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433K[J].Journal of Materials Science,2004,39(7):2 327-2 334.
[8]KANESHI R,YOSHI O.Production of gold-tin Foil:Japan,200026989[P].1998-07-10.
[9]张静,徐会武,李学颜,等.电镀Au-Sn合金的研究[J].半导体技术,2009,34(11):1 066-1 069.
[10]刘生发,陈晨,熊杰然,等.AuSn20共晶合金钎料制备工艺研究进展[J].特种铸造及有色合金,2017,37(9):952-956.
[11]MIYAZAKI K,HIRATSUKA S.Foil-form soldering metal and method for processing the same:United States,7048813[P].2003-10-04.
[12]TAN Q B,DENG C,MAO Y,et al.Evolution of primary phases and high-temperature compressive behaviors of as-cast AuSn20alloys prepared by different solidification pathways[J].Gold Bull.,2011,44(1):27-35.