芯片补强固定光热双固化封装材料的制备与表征
|
摘要
以双酚A型环氧树脂828el和改性脂环族环氧树脂2021P复配作为树脂体系,Irgacure261为阳离子光引发剂,三氟化硼单乙胺为热固化剂,活性硅微粉为填料,白炭黑为增稠剂混合配制成胶液,制备用于芯片补强固定的高性能光热双固化封装材料。通过紫外光能量和差示扫描量热测试表征确定胶黏剂固化工艺,并研究了填料种类和用量对双固化封装材料剪切强度、黏度、热膨胀系数(CTE)、吸湿率和热稳定性能的影响。结果表明,当改性脂环族环氧树脂2021P、双酚A型环氧树脂828el、Irgacure261、三氟化硼单乙胺和活性硅微粉质量比为90∶10∶3∶2.5∶40,光固化条件为UV能量2800 mJ/cm~2,热固化条件为80℃/30 min时,可得到满足黏接强度为25.2 MPa,CTE为130×10~(-6)℃~(-1)(55～70℃)、240×10~(-6)℃~(-1)(115～130℃),吸湿率为0.131%,热稳定性好的光热双固化封装材料。
The bisphenol A epoxy resin 828 el and modified alicyclic epoxy resin 2021P compound as resin system, Irgacure261 as carnation photoinitiator, boron trifluoride monoethylamine as heat curing agent, activated silicon fine powder as filler,and white carbon as thickener were mixed to prepare the glue solution. And high-performance light-heat dual-cure packaging materials for chip-reinforced and fixed were prepared with the glue solution. The adhesive curing process was determined by UV energy meter and differential scanning calorimetry(DSC), and the effects of the type and amount of filler on the shear strength, viscosity, thermal expansion coefficient(CTE), moisture absorption rate and thermal stability of the dual-cured packaging materials were investigated. The results show that when the mass ratio of modified aliphatic epoxy resin 2021P, bisphenol A epoxy resin 828 el, Irgacure261, boron trifluoride monoethylamine and active silica powder is 90∶10∶3∶2.5∶40, the curing process system is as follows∶ UV energy of 2800 mJ/cm~2 to achieve dry, 80 ℃/30 min for complete curing, light-heat double-cured packaging materials with good thermal stability are got, the adhesive strength of 25.2 MPa, the CTE of 130×10~(-6) ℃~(-1)(55～70 ℃) and 240×10~(-6) ℃~(-1)(115～130 ℃), the moisture absorption rate of 0.131%.
The bisphenol A epoxy resin 828 el and modified alicyclic epoxy resin 2021P compound as resin system, Irgacure261 as carnation photoinitiator, boron trifluoride monoethylamine as heat curing agent, activated silicon fine powder as filler,and white carbon as thickener were mixed to prepare the glue solution. And high-performance light-heat dual-cure packaging materials for chip-reinforced and fixed were prepared with the glue solution. The adhesive curing process was determined by UV energy meter and differential scanning calorimetry(DSC), and the effects of the type and amount of filler on the shear strength, viscosity, thermal expansion coefficient(CTE), moisture absorption rate and thermal stability of the dual-cured packaging materials were investigated. The results show that when the mass ratio of modified aliphatic epoxy resin 2021P, bisphenol A epoxy resin 828 el, Irgacure261, boron trifluoride monoethylamine and active silica powder is 90∶10∶3∶2.5∶40, the curing process system is as follows∶ UV energy of 2800 mJ/cm~2 to achieve dry, 80 ℃/30 min for complete curing, light-heat double-cured packaging materials with good thermal stability are got, the adhesive strength of 25.2 MPa, the CTE of 130×10~(-6) ℃~(-1)(55～70 ℃) and 240×10~(-6) ℃~(-1)(115～130 ℃), the moisture absorption rate of 0.131%.
引文
[1] Park Y J,Lim D H,Kim H J,et al.UV-and thermal-curing behaviors of dual-curable adhesives based on epoxy acrylate oligomers[J].Int.J.Adhes.Adhes.,2009,29:710-717.
[2] Lee S W,Park J W,Park C H,et al.UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process[J].Int.J.Adhes.Adhes.,2013,29:138-143.
[3] 李建林.HgCdTe芯片黏接可靠性设计[J].红外技术,2000,22(1):29-32.Li J L.A reliable design of HgCdTe chips attachment[J].Infrared Technology,2000,22(1):29-32.
[4] 王德海,江棂.紫外光固化材料理论与应用[M].北京:科学出版社,2001:92-94.
[5] Noh S M,Lee J W,Nam J H,et al.Dual-curing behavior and scratch characteristics of hydroxyl functionalized urethane methacrylate oligomer for automotive clear coats[J].Prog.Org.Coat.,2012,74:257-269.
[6] Park C H,Lee S W,Park J W,et al.Preparation and characterization of dual curable adhesives containing epoxy and acrylate functionalities[J].React.Funct.Polym.,2013,73:641-646.
[7] Jian Z,Yong H,Ming X,et al.Preparation and properties of dual-cure polyurethane acrylate[J].Prog.Org.Coat.,2009,66:35-39.
[8] Kumar R N,Po P L,Rozman H D.Studies on the synthesis of acrylamidomethyl cellulose ester and its application in UV curable surface coatings induced by free radical photoinitiator.Part 1:acrylamidomethyl cellulose acetate[J].Carbohydr.Polym.,2006,64:112-126.
[9] Trey S M,Sidenvall P,Alavi K,et al.Dual cure (UV/thermal) primers for composite substrates—Effect of surface treatment and primer composition on adhesion[J].Prog.Org.Coat.,2009,64:489-496.
[10] 杨柳.单组分环氧树脂流动型底部填充胶的研制[D].西安:西安科技大学,2014.Yang L.The study on preparing single-component flow-type EP underfill adhesives[D].Xi'an:Xi'an University of Science and Technology,2014.
[11] 李会录,张挺,邵康宸,等.热塑性聚氨酯热熔胶的制备及性能[J].高分子材料科学与工程,2016,32(1):36-40.Li H L,Zhang T,Shao K C,et al.Preparation and properties of thermoplastic polyurethane hot melt adhesive[J].Polymer Materials Science & Engineering,2016,32(1):36-40.
[2] Lee S W,Park J W,Park C H,et al.UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process[J].Int.J.Adhes.Adhes.,2013,29:138-143.
[3] 李建林.HgCdTe芯片黏接可靠性设计[J].红外技术,2000,22(1):29-32.Li J L.A reliable design of HgCdTe chips attachment[J].Infrared Technology,2000,22(1):29-32.
[4] 王德海,江棂.紫外光固化材料理论与应用[M].北京:科学出版社,2001:92-94.
[5] Noh S M,Lee J W,Nam J H,et al.Dual-curing behavior and scratch characteristics of hydroxyl functionalized urethane methacrylate oligomer for automotive clear coats[J].Prog.Org.Coat.,2012,74:257-269.
[6] Park C H,Lee S W,Park J W,et al.Preparation and characterization of dual curable adhesives containing epoxy and acrylate functionalities[J].React.Funct.Polym.,2013,73:641-646.
[7] Jian Z,Yong H,Ming X,et al.Preparation and properties of dual-cure polyurethane acrylate[J].Prog.Org.Coat.,2009,66:35-39.
[8] Kumar R N,Po P L,Rozman H D.Studies on the synthesis of acrylamidomethyl cellulose ester and its application in UV curable surface coatings induced by free radical photoinitiator.Part 1:acrylamidomethyl cellulose acetate[J].Carbohydr.Polym.,2006,64:112-126.
[9] Trey S M,Sidenvall P,Alavi K,et al.Dual cure (UV/thermal) primers for composite substrates—Effect of surface treatment and primer composition on adhesion[J].Prog.Org.Coat.,2009,64:489-496.
[10] 杨柳.单组分环氧树脂流动型底部填充胶的研制[D].西安:西安科技大学,2014.Yang L.The study on preparing single-component flow-type EP underfill adhesives[D].Xi'an:Xi'an University of Science and Technology,2014.
[11] 李会录,张挺,邵康宸,等.热塑性聚氨酯热熔胶的制备及性能[J].高分子材料科学与工程,2016,32(1):36-40.Li H L,Zhang T,Shao K C,et al.Preparation and properties of thermoplastic polyurethane hot melt adhesive[J].Polymer Materials Science & Engineering,2016,32(1):36-40.
© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号 地址：北京市海淀区学院路29号 邮编：100083 电话：办公室：(+86 10)66554848；文献借阅、咨询服务、科技查新：66554700 |