C194铜合金表面热浸镀SnAgCu镀层的组织与性能
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摘要
利用扫描电镜、能谱仪和盐雾腐蚀试验等分析了在C194铜合金表面热浸镀SnAgCu镀层的微观组织、热稳定性、微区成分和耐蚀性;利用可焊性测试仪分析了C194铜合金和SnAgCu合金液之间的润湿性。结果表明:SnAgCu镀层光滑平整,镀层分为两部分,顶层为富Sn层,由两相组成;底层是Cu_6Sn_5金属间化合物层,使镀层与铜合金基体实现了良好的冶金结合,形成了一定程度的取向选择生长;C194铜合金和SnAgCu合金液之间具有良好的润湿性,280℃时的润湿性要明显优于260℃;镀层表面发生均匀腐蚀,没有出现明显的点蚀;镀层具有良好的热稳定性。
Microstructure, thermal stability, micro-area composition and corrosion resistance of hot-dip SnAgCu coating on C194 copper alloy surface were investigated by means of scanning electron microscopy, energy dispersive spectroscopy analysis and salt spray corrosion test. The wettability of C194 copper alloy and liquid SnAgCu alloy was studied by solderability tester. The results show that the SnAgCu coating is smooth and flat which consists of two layers. The top layer is Sn-rich layer composed of two phases, and the bottom layer is Cu_6Sn_5 intermetallic compound layer, which makes the coating and C194 copper alloy matrix achieve a good metallurgical bonding, resulting in a certain degree of oriented selective growth. There is a good wettability between the C194 Cu alloy and SnAgCu alloy solution, and the wettability of the C194 Cu alloy at 280 ℃ is obviously better than that of at 260 ℃. The surface of the coating is uniformly corroded without obvious pitting corrosion, and the coating has a good thermal stability.
Microstructure, thermal stability, micro-area composition and corrosion resistance of hot-dip SnAgCu coating on C194 copper alloy surface were investigated by means of scanning electron microscopy, energy dispersive spectroscopy analysis and salt spray corrosion test. The wettability of C194 copper alloy and liquid SnAgCu alloy was studied by solderability tester. The results show that the SnAgCu coating is smooth and flat which consists of two layers. The top layer is Sn-rich layer composed of two phases, and the bottom layer is Cu_6Sn_5 intermetallic compound layer, which makes the coating and C194 copper alloy matrix achieve a good metallurgical bonding, resulting in a certain degree of oriented selective growth. There is a good wettability between the C194 Cu alloy and SnAgCu alloy solution, and the wettability of the C194 Cu alloy at 280 ℃ is obviously better than that of at 260 ℃. The surface of the coating is uniformly corroded without obvious pitting corrosion, and the coating has a good thermal stability.
引文
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[2] 王畅畅.钢材表面热浸镀铝技术研究进展[J].材料保护,2016,49(10):74-77.WANG Chang-chang.Recent research in the field of hot-dip aluminizing[J].Materials Protection,2016,49(10):74-77.
[3] Chen K J,Hung F Y,Lui T S,et al.Studies of interfacial microstructures and series resistance on electroplated and hot-dipped Sn-xCu photovoltaic modules[J].Journal of Electronic Materials,2018,47(1):1-8.
[4] 张平平.热浸镀Zn-Al-Mg合金镀层组织及耐腐蚀性能的研究[D].天津:河北工业大学,2015.ZHANG Ping-ping.Study on the microstructure and corrosion resistance of hot dipping Zn-Al-Mg alloy coating[D].Tianjin:Hebei University of Technology,2015.
[5] 郝虎,李广东,史耀武,等.SnAgCuCe/Er无铅钎料表面锡晶须的形态及特性[J].焊接学报,2009,30(5):25-28.HAO Hu,LI Guang-dong,SHI Yao-wu,et al.Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solder[J].Transactions of the China Welding Institution,2009,30(5):25-28.
[6] 颜怡文,李照康,邹孟妤.电镀雾锡层锡晶须生长机制的研究[J].表面技术,2010,39(3):19-22.YAN Yi-wen,LI Zhao-kang,ZOU Meng-yu.Sn whisker growth mechanism in the electroplating matte Sn system[J].Surface Technology,2010,39(3):19-22.
[7] 岳振廷,廉广堂.我国第一条铜带热浸镀锡生产线在金龙集团新乡基地建成投产[J].中国有色金属,2016(1):21-22.YUE Zhen-ting,LIAN Guang-tang.China’s first copper strip hot dip tinning production line was completed and put into operation at Xinxiang base of jinlong group[J].China Nonferrous Metals,2016(1):21-22.
[8] 左勇,马立民,刘思涵,等.通过添加POSS颗粒抑制锡基无Pb焊层的晶须生长[J].金属学报,2015,51(6):685-692.ZUO Yong,MA Li-min,LIU Si-han,et al.Whisker mitigation for Sn-based Pb-free solders by POSS addition[J].Acta Metallurgica Sinica,2015,51(6):685-692.
[9] 刘璐.无助焊剂条件下SnAgCu/Cu 钎焊接头金属间化合物的生长规律[D].郑州:郑州大学,2017.LIU Lu.Growth rule of intermetallic compound in SnAgCu/Cu brazed joint without flux[D].Zhengzhou:Zhengzhou University,2017.
[10] 王要利,程光辉,张柯柯.Sn-2.5Ag-0.7Cu-0.1RE-xNi的润湿特性[J].材料热处理学报,2016,37(3):24-29.WANG Yao-li,CHENG Guang-hui,ZHANG Ke-ke.Wetting properties of Sn-2.5Ag-0.7Cu-0.1RE-xNi solder alloy[J].Transactions of Materials and Heat Treatment,2016,37(3):24-29.
[11] Song M,Prabhu K.Effect of reflow time on wetting behavior,microstructure evolution,and joint strength of Sn-2.5Ag-0.5Cu solder on bare and nickel-coated copper substrates[J].Journal of Electronic Materials,2016,45(7):3744-3758.
[12] Zhang Z H,Cao H J,Xiao,Y L,et al.Morphology,kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface[C].15th International Conference on Electronic Packaging Technology,Chengdu:Institute of Electrical and Electronics Engineers,2014,1056-1059.
[13] Zhang Z H,Cao H J,Li M Y,et al.Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction[J].Materials and Design,2016,94(4):280-285.
[14] Yang M,Ko Y H,Bang J W.Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates[J].Journal of Alloys and Compounds,2017,701:533-541.
[15] Jagtap P.Manipulating crystallographic texture of Sn coatings by optimization of electrodeposition process conditions to suppress growth of whiskers[J].Journal of Electronic Materials,2015,44(4):1206-1219.
[16] 赵子寿,冼爱平.锡晶须生长机理研究的现状与问题[J].中国有色金属学报,2012,22(8):2267-2275.ZHAO Zi-shou,XIAN Ai-ping.Mechanisms and questions of tin whisker growth[J].The Chinese Journal of Nonferrous Metals,2012,22(8):2267-2275.
[17] 徐春花,郭卫华,覃信茂.镀锡铜箔表面小丘和晶须的生长行为[J].河南科技大学学报:自然科学版,2010,31(5):1-3.XU Chun-hua,GUO Wei-hua,QIN Xin-mao.Growth behavior of hillocks and whiskers on tinned copper foil[J].Journal of Henan University of Science and Technology:Natural Science,2010,31(5):1-3.
[18] Jagtap P,Sethuraman V A.Critical evaluation of relative importance of stress and stress gradient in whisker growth in Sn coatings[J].Journal of Electronic Materials,2018,47(9):5229-5242.
[19] Jagtap P.Effect of substrate composition on whisker growth in Sn coatings[J].Journal of Electronic Materials,2018,47(7):4177-4189.