基于Ni中间层的DT4A与12Cr18Ni9扩散焊接接头组织及力学性能研究
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摘要
采用电镀纯Ni作为中间层,在不同的连接压力下进行了工业纯铁DT4A和12Cr18Ni9不锈钢扩散焊接试验,并测试了接头的抗拉强度和接头压缩量,利用光学显微镜(OM)、扫描电镜(SEM)和能谱分析仪(EDS)对接头的金相组织、元素分布以及断口形貌进行了分析。结果表明:Ni中间层的存在,可以实现DT4A与12Cr18Ni9的可靠连接。在合适的工艺参数下,连接接头的力学性能优于原始纯铁母材,接头抗拉强度可达309 MPa,压缩量不大于1%。扩散焊接结合区Cr、Ni元素均存在明显的浓度梯度,Ni元素向母材中扩散,形成了紧密的冶金结合。
Diffusion welding experiments of industrial pure iron DT4A and 12Cr18Ni9 stainless steel were performed under different bonding pressures by using electroplated pure Ni as interlayer. Tensile strength and compression value of the welded joints were tested. The metallographic structure, element distribution and fracture morphology were analyzed by optical microscope, scanning electron microscope and energy dispersive spectrometer. The results show that reliable bonding between DT4 A and 1Cr18Ni9 can be realized by using the Ni as interlayer. The mechanical properties of welded joints are better than that of the pure iron base material, and the tensile strength can reach 309 MPa while the compression value is no more than 1% under appropriate welding parameters. Obvious concentration gradient of Cr, Ni elements appears, Ni diffuses into base metal, which forms a secure metallurgical bonding joint.
Diffusion welding experiments of industrial pure iron DT4A and 12Cr18Ni9 stainless steel were performed under different bonding pressures by using electroplated pure Ni as interlayer. Tensile strength and compression value of the welded joints were tested. The metallographic structure, element distribution and fracture morphology were analyzed by optical microscope, scanning electron microscope and energy dispersive spectrometer. The results show that reliable bonding between DT4 A and 1Cr18Ni9 can be realized by using the Ni as interlayer. The mechanical properties of welded joints are better than that of the pure iron base material, and the tensile strength can reach 309 MPa while the compression value is no more than 1% under appropriate welding parameters. Obvious concentration gradient of Cr, Ni elements appears, Ni diffuses into base metal, which forms a secure metallurgical bonding joint.
引文
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