微波组件激光封焊脉冲波形研究
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摘要
微波组件的壳体多为金属外壳,根据使用场合的需要,常规的壳体材料有铝合金、铜合金和Kovar合金等。为确保微波组件壳体内部电路长期工作的可靠性,激光封焊技术正广泛应用于微波组件壳体气密性封装工艺中。由于微波组件壳体材料合金成分的不同,其物理特性也不一致,在激光封焊过程中需要不同的能量输入方式。根据常用微波组件壳体材料的主要合金成分,为不同型号的铝合金、铜合金和Kovar合金设计了不同的脉冲波形,并设置了合适的工艺参数,获得了成型好无缺陷的焊缝,微波组件封焊后的漏率都达到了1×10-9 Pa·m3/s的密封要求。
The shell of microwave module is metals which are aluminium alloys, copper alloy and kovar alloy according to the requirements of use fields. The laser seal welding technology is widely used in gastightness packaging of microwave module in order to ensure the reliability of microwave module. The physical characteristics of material are not consistent due to the different alloy composition of the shell material of microwave module, so different energy input modes are needed in the process of laser seal welding. Designed different pulse waveforms for different types of aluminum alloy, copper alloy and Kovar alloy according to the main alloy components of common microwave component shell materials, and set appropriate process parameters to obtain well-formed non-defective welding joint. The leakage rate of microwave component after welding reached the requirement of 1×10-9 Pa·m3/s.
The shell of microwave module is metals which are aluminium alloys, copper alloy and kovar alloy according to the requirements of use fields. The laser seal welding technology is widely used in gastightness packaging of microwave module in order to ensure the reliability of microwave module. The physical characteristics of material are not consistent due to the different alloy composition of the shell material of microwave module, so different energy input modes are needed in the process of laser seal welding. Designed different pulse waveforms for different types of aluminum alloy, copper alloy and Kovar alloy according to the main alloy components of common microwave component shell materials, and set appropriate process parameters to obtain well-formed non-defective welding joint. The leakage rate of microwave component after welding reached the requirement of 1×10-9 Pa·m3/s.
引文
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[2]房善玺,王传伟,栾兆菊.弹载高密度T/R组件激光气密封装技术研究[J].电子工艺技术,2018,39(2):76-78.
[3]郭永强,徐阳熠,易一平,等.激光脉冲波形对铝合金焊接效果的影响[J].应用激光,2013,33(4):434-439.
[4]Braun R.Nd:YAG laser butt welding of AA6013 using silicon and magnesium containing filler powders[J].Mater Sci Eng A,2006,426(1):250-262.
[5]王振家,欧向军,陈武柱,等.H62黄铜激光封焊性研究[J].清华大学学报(自然科学版),1997,37(8):40-43.
[6]朱小军,刘刚.4J42合金电子封装外壳的激光封焊裂纹控制[J].混合微电子技术,2010,21(2-3):79-81.
[7]程迎军,罗乐,蒋玉齐,等.多芯片组件散热的三维有限元分析[J].电子元件与材料,2004,23(5):43-45.
[8]伍艺龙,李悦,李慧.高功率多芯片组件的散热分析[J].电子工艺技术,2017,38(2):77-79.
[9]陈品,吴兆华,黄红艳,等.LTCC中内埋大功率芯片散热的三维有限元分析[J].电子与封装,2011,11(3):5-9.