微电容超声换能器的前端专用集成电路设计
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摘要
针对微电容超声换能器(CMUT)微弱电流信号检测的要求,设计了一种用于CMUT的前端专用集成电路——运算放大器(OPA)电路。运算放大器电路采用两级放大结构,第一级采用全差分折叠-共源共栅结构,输出级采用AB类控制的轨到轨输出级,在运算放大器电路反相输入端和输出端通过一个反馈电阻实现CMUT电流信号到电压信号的转换。采用GlobalFoundries 0.18μm的标准CMOS工艺进行了仿真设计和流片,芯片尺寸为226μm×75μm。仿真结果表明,运算放大器的开环增益为62 dB,单位增益带宽为30 MHz,在3 MHz处的输入参考噪声电压为2.9μV/Hz~(1/2),电路采用±3.3 V供电,静态功耗为11 mW。测试结果表明仿真与实测结果相符,该运算放大器电路能够实现CMUT微弱电流信号检测功能。
For the requirements of the detecting weak current signal of capacitive micromachined ultrasonic transducer(CMUT), an application special integrated circuit—operational amplifier(OPA) circuit for CMUT front-end was designed and fabricated. The proposed two-stage OPA circuit consisted of a full differential folded-cascode amplifier stage followed by a class AB rail-to-rail output stage. A feedback resistor was used between the inverting input and the output of the amplifier, which could convert the output current signal of the CMUT to a voltage signal. The OPA circuit was simulated and designed by GlobalFoundries 0.18 μm standard CMOS technology, and then it was taped out. The chip area is 226 μm×75 μm. The simulation results show that the open loop gain of the operational amplifier is 62 dB, the unity gain bandwidth is 30 MHz, and the input reference noise voltage is 2.9 μV/Hz~(1/2) at 3 MHz. And the static power consumption of the OPA circuit is 11 mW with a ±3.3 V power supply voltage. The test results show that the simulation results are in agreement with the experimental ones. The OPA circuit can realize the weak current signal detection function of CMUT.
For the requirements of the detecting weak current signal of capacitive micromachined ultrasonic transducer(CMUT), an application special integrated circuit—operational amplifier(OPA) circuit for CMUT front-end was designed and fabricated. The proposed two-stage OPA circuit consisted of a full differential folded-cascode amplifier stage followed by a class AB rail-to-rail output stage. A feedback resistor was used between the inverting input and the output of the amplifier, which could convert the output current signal of the CMUT to a voltage signal. The OPA circuit was simulated and designed by GlobalFoundries 0.18 μm standard CMOS technology, and then it was taped out. The chip area is 226 μm×75 μm. The simulation results show that the open loop gain of the operational amplifier is 62 dB, the unity gain bandwidth is 30 MHz, and the input reference noise voltage is 2.9 μV/Hz~(1/2) at 3 MHz. And the static power consumption of the OPA circuit is 11 mW with a ±3.3 V power supply voltage. The test results show that the simulation results are in agreement with the experimental ones. The OPA circuit can realize the weak current signal detection function of CMUT.
引文
[1] ERGUN A S, YARALIOGLU G G, KHURI-YAKUB B T. Capacitive micromachined ultrasonic transducers: theory and technology [J]. Journal of Aerospace Engineering, 2003, 16(2):76-84.
[2] NOVELL A, LEGROS M, FELIX N, et al. Exploitation of capacitive micromachined transducers for nonlinear ultrasound imaging [J]. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2009, 56(12):2733-2743.
[3] GURUN G, HASLER P, DEGERTEKIN F. Front-end receiver electronics for high-frequency monolithic CMUT-on-CMOS imaging arrays [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2011, 58(8):1658-1668.
[4] WYGANT I O, ZHUANG X F, YEH D T, et al. Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2008, 55(2):327-342.
[5] HUANG X W, CHEONG J H, CHA H K, et al. A high-frequency transimpedance amplifier for CMOS integrated 2D CMUT array towards 3D ultrasound imaging [C] // Proceedings of the 35th Annual International Conference of the IEEE Engineering in Medicine and Biology. Osaka, Japan, 2013: 101-104.
[6] CICEK I, BOZKURT A, KARAMAN M. Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays[J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2005, 52(12):2235-2241.
[7] BOSE S, MANDAL P. A fully differential amplifier with CMOS feedback biasing for sensing CMUT signals[C] // Proceedings of the IEEE Students’ Technology Symposium. Kharagpur, India, 2014:159-163.
[8] 赵蕾,张文栋,何常德,等. 电容式微机械超声换能器的信号调理电路设计[J]. 电测与仪表, 2017, 54(7):122-128. ZHAO L, ZHANG W D, HE C D, et al. Design of a signal processing circuit of capacitive micromachined ultrasonic transducer [J]. Electrical Measurement & Instrumentation, 2017, 54(7):122-128 (in Chinese).
[9] CALIANO G, MATRONE G, SAVOIA A S. Biasing of capacitive micromachined ultrasonic transducers [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2017: 64(2):402-413.
[10] MOMENI O, HASHEMI H, AFSHARI E. A 10-Gb/s inductorless transimpedance amplifier [J]. IEEE Tran-sactions on Circuits and Systems: II, 2010, 57(12):926-930.
[11] RAZAVI B. 模拟CMOS集成电路设计 [M]. 陈贵灿,程军,张瑞智,等译. 1版. 西安:西安交通大学出版社,2003:276-279.
[12] MALLYA S, NEVIN J H. Design procedures for a fully differential folded-cascode CMOS operational amplifier [J]. IEEE Journal of Solid-State Circuits, 1989, 24(6):1737-1740.
[13] SHARMA S, YTTERDAL T. Low noise front-end amplifier design for medical ultrasound imaging applications [C] // Proceedings of the 20th IEEE-IFIP International Conference on VLSI and System-on-Chip. Santa Cruz, CA,USA, 2012:12-16.
[2] NOVELL A, LEGROS M, FELIX N, et al. Exploitation of capacitive micromachined transducers for nonlinear ultrasound imaging [J]. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 2009, 56(12):2733-2743.
[3] GURUN G, HASLER P, DEGERTEKIN F. Front-end receiver electronics for high-frequency monolithic CMUT-on-CMOS imaging arrays [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2011, 58(8):1658-1668.
[4] WYGANT I O, ZHUANG X F, YEH D T, et al. Integration of 2D CMUT arrays with front-end electronics for volumetric ultrasound imaging [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2008, 55(2):327-342.
[5] HUANG X W, CHEONG J H, CHA H K, et al. A high-frequency transimpedance amplifier for CMOS integrated 2D CMUT array towards 3D ultrasound imaging [C] // Proceedings of the 35th Annual International Conference of the IEEE Engineering in Medicine and Biology. Osaka, Japan, 2013: 101-104.
[6] CICEK I, BOZKURT A, KARAMAN M. Design of a front-end integrated circuit for 3D acoustic imaging using 2D CMUT arrays[J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2005, 52(12):2235-2241.
[7] BOSE S, MANDAL P. A fully differential amplifier with CMOS feedback biasing for sensing CMUT signals[C] // Proceedings of the IEEE Students’ Technology Symposium. Kharagpur, India, 2014:159-163.
[8] 赵蕾,张文栋,何常德,等. 电容式微机械超声换能器的信号调理电路设计[J]. 电测与仪表, 2017, 54(7):122-128. ZHAO L, ZHANG W D, HE C D, et al. Design of a signal processing circuit of capacitive micromachined ultrasonic transducer [J]. Electrical Measurement & Instrumentation, 2017, 54(7):122-128 (in Chinese).
[9] CALIANO G, MATRONE G, SAVOIA A S. Biasing of capacitive micromachined ultrasonic transducers [J]. IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, 2017: 64(2):402-413.
[10] MOMENI O, HASHEMI H, AFSHARI E. A 10-Gb/s inductorless transimpedance amplifier [J]. IEEE Tran-sactions on Circuits and Systems: II, 2010, 57(12):926-930.
[11] RAZAVI B. 模拟CMOS集成电路设计 [M]. 陈贵灿,程军,张瑞智,等译. 1版. 西安:西安交通大学出版社,2003:276-279.
[12] MALLYA S, NEVIN J H. Design procedures for a fully differential folded-cascode CMOS operational amplifier [J]. IEEE Journal of Solid-State Circuits, 1989, 24(6):1737-1740.
[13] SHARMA S, YTTERDAL T. Low noise front-end amplifier design for medical ultrasound imaging applications [C] // Proceedings of the 20th IEEE-IFIP International Conference on VLSI and System-on-Chip. Santa Cruz, CA,USA, 2012:12-16.
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