Y_2O_3对含Cu钛合金激光熔覆层微观组织与性能的影响
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摘要
在Ti811钛合金表面利用同步送粉激光熔覆技术,制备了TC4+Ni45+WC+Y_2O_3+Cu多道搭接激光熔覆层。利用X射线衍射仪、扫描电镜、能谱分析仪分析了该熔覆层的微观组织和相组成。利用显微硬度计测试了熔覆层的显微硬度。结果表明,熔覆层微观组织中的生成相主要包括增强相TiC、金属间化合物Ti_2Ni、Ti_2Cu_3和TiCu_2等,基底为α-Ti;熔覆层增强相大部分偏聚于晶界生长,且晶粒得到细化;反应析出的Ti-Cu金属间化合物以超细纳米颗粒的形式存在于熔覆层晶界附近区域;熔覆层的显微硬度相比基底有了一定的提高,最高硬度为613 HV0.5,较基底提高了约0.5倍。
By using synchronous powder feeding laser cladding technology, TC4+Ni45+WC+Y_2O_3+Cu multi-channel lap laser cladding layer on the surface of Ti811 titanium alloy were achieved. X ray diffractometer(XRD), scanning electron microscope(SEM) and energy dispersive spectrometry(EDS) were employed to analyze the microstructure and phase composition of the cladding layer. The microhardness of the cladding layer was examined by microhardness tester. The results show that the formed phases in the microstructure of the cladding layer mainly include the enhanced phases Ti C, the intermetallic compounds Ti_2Ni, Ti_2Cu_3 and TiCu_2. The substrate is α-Ti. Most of the enhanced phases of the cladding layer tend to grow in the grain boundary, and the grains are refined. The reacted Ti-Cu intermetallic compounds exist in the vicinity of the grain boundary of the cladding layer in the form of ultra-fine nanoparticles. The microhardness of the cladding layer is higher than that of the substrate, and the maximum hardness is about 613 HV0.5, which is about 0.5 times higher than that of the substrate.
By using synchronous powder feeding laser cladding technology, TC4+Ni45+WC+Y_2O_3+Cu multi-channel lap laser cladding layer on the surface of Ti811 titanium alloy were achieved. X ray diffractometer(XRD), scanning electron microscope(SEM) and energy dispersive spectrometry(EDS) were employed to analyze the microstructure and phase composition of the cladding layer. The microhardness of the cladding layer was examined by microhardness tester. The results show that the formed phases in the microstructure of the cladding layer mainly include the enhanced phases Ti C, the intermetallic compounds Ti_2Ni, Ti_2Cu_3 and TiCu_2. The substrate is α-Ti. Most of the enhanced phases of the cladding layer tend to grow in the grain boundary, and the grains are refined. The reacted Ti-Cu intermetallic compounds exist in the vicinity of the grain boundary of the cladding layer in the form of ultra-fine nanoparticles. The microhardness of the cladding layer is higher than that of the substrate, and the maximum hardness is about 613 HV0.5, which is about 0.5 times higher than that of the substrate.
引文
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