水合抛光加工的运动学特性
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摘要
建立了旋摆驱动方式下水合平面抛光过程中工件的运动学模型,揭示了抛光盘开孔方式对蓝宝石衬底的水合抛光均匀性影响规律。旋摆驱动条件下,杉木抛光盘的开孔方式对蓝宝石衬底水合抛光加工全局均匀性和局部均匀性具有重要的作用,局部均匀性的阶梯状分布为直线、圆环和螺旋线开孔方式的共性特征。与直线、圆环开孔方式相比,在一定的参数取值条件下,螺旋线开孔方式可更好地实现水合抛光加工的全局均匀性和局部均匀性要求。
Kinematic model for rotating and swing drive plane polishing process is deduced, effect of opening holes in the fir polishing plate on the uniformity during hydration polishing is revealed. Under the condition of rotating and swing drive plane polishing, distribution of opening holes have great effect on the global and local uniformity of sapphire substrates during hydration polishing. Same characteristics of line, circular and spiral holes are expressed as stepped straight for different areas of sapphire substrate. Compared with polishing plates with line and circular holes, spiral holes can achieve better global and local uniformity under certain conditions.
Kinematic model for rotating and swing drive plane polishing process is deduced, effect of opening holes in the fir polishing plate on the uniformity during hydration polishing is revealed. Under the condition of rotating and swing drive plane polishing, distribution of opening holes have great effect on the global and local uniformity of sapphire substrates during hydration polishing. Same characteristics of line, circular and spiral holes are expressed as stepped straight for different areas of sapphire substrate. Compared with polishing plates with line and circular holes, spiral holes can achieve better global and local uniformity under certain conditions.
引文
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[4]SAMUELS L.Metallographic polishing by mechanical methods[M].4th ed.Ohio:ASM International,2003.
[5]GRIM J,SKOWRONSKI M,EVERSON W,et al.Selectivity and residual damage of colloidal silica chemi-mechanical polishing of silicon carbide[J].Materials Science Forum,2006(527-529):1095-1098.
[6]SAITO T,HIRAYAMA T.Lattice strain and dislocations in polished surfaces on sapphire[J].Journal of the American Ceramic Society,2005,88(8):2277-2285.
[7]MARINESCU I,ROWE W,DIMITROV B,et al.Tribology of abrasive machining processes[M].2nd ed.New York:William Andrew Inc.,2012.
[8]AIDA H,DOI T,TAKEDA H,et al.Ultraprecision CMP for sapphire,Ga N,and Si C for advanced optoelectronics materials[J].Current Applied Physics,2012,12,(Suppl.2):S41-S46.
[9]盛继生,文东辉,计时鸣.主动驱动条件下研磨轨迹均匀性的研究[J].农业机械学报,2010,41(4):209-212.SHENG Jisheng,WEN Donghui,JI Shiming.Uniformity of kinematic trajectory with wafer driving initiatively in plane lapping process[J].Transactions of the Chinese Society for Agricultural Machinery,2010,41(4):209-212.
[10]GAGLIARDI J,KIM D,SOLOL J,et al.A case for2-body material removal in prime LED sapphire substrate lapping and polishing[J].Journal of Manufacturing Processes,2013,15(3):348-354.
[11]陈燕,刘昭前,王显康.超声波振动辅助磁力研磨加工研究[J].农业机械学报,2013,44(10):294-298.CHEN Yan,LIU Zhaoqian,WANG Xiankang.Ultrasonic vibration-assisted magnetic abrasive finishing[J].Transactions of the Chinese Society for Agricultural Machinery,2013,44(10):294-298.
[12]XU W,LU X,PAN G,et al.Effects of the ultrasonic flexural vibration on the interaction between the abrasive particles;pad and sapphire substrate during chemical mechanical polishing(CMP)[J].Applied Surface Science,2011,257(7):2905-2911.
[13]ZHANG Z,YAN W,ZHANG L,et al.Effect of mechanical process parameters on friction behavior and material removal during sapphire chemical mechanical polishing[J].Microelectronic Engineering,2011,88(9):3020-3023.
[14]KASAI T.A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization(CMP)[J].Tribology International,2008,41(2):111-118.
[15]WANG J,LU Y,SHU Q,et al.Design and analysis on kinematics of the lap-polisher with planet movement for optical fiber end-face[J].The International Journal of Advanced Manufacturing Technology,2010,50(5-8):651-658.
[16]吴宏基,曹利新,刘健.基于行星式平面研磨机研抛过程的运动几何学分析[J].机械工程学报,2002,38(6):144-147.WU Hongji,CAO Lixin,LIU Jian.Analysis on kinematic geometry on face grinding process on lapping machines[J].Chinese Journal of Mechanical Engineering,2002,38(6):144-147.
[17]樊成,赵继,张雷,等.移动抛光自由曲面材料去除的理论建模与试验研究[J].机械工程学报,2014,50(5):173-181.FAN Cheng,ZHAO Ji,ZHANG Lei,et al.Modeling and experimental study on the material removal in the velocity-dwell-mode polishing process[J].Journal of Mechanical Engineering,2014,50(5):173-181.
[18]计时鸣,金明生,张宪,等.应用于模具自由曲面的新型气囊抛光技术[J].机械工程学报,2007,43(8):2-6.JI Shiming,JIN Mingsheng,ZHANG Xian,et al.Novel gasbag polishing technique for free-form mold[J].Chinese Journal of Mechanical Engineering,2007,43(8):2-6.