激光辅助电化学放电加工微通道的特性
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摘要
玻璃材料近年来被广泛应用于微电子机械系统(MEMS),对于玻璃材料的加工,电化学放电加工(ECDM)是一种被广泛运用的手段。针对目前的电化学放电加工存在热影响区和过切现象的问题,提出了一种激光辅助电化学放电加工玻璃的加工方法,阐述了其作用机理,设计了实验装置,并与传统电化学放电加工进行了微通道加工的对比实验。通过与传统电化学放电加工对比,发现激光辅助电化学放电的加工方式能明显减少放电加工过程中的热影响区和过切现象,故激光辅助有效改善了电化学放电在玻璃材料上加工微通道的质量和精度,在MEMS领域具有良好的应用前景。
Glass materials have been widely used in micro-electromechanical systems(MEMS)in recent years.The electrochemical discharge machining(ECDM)is a widely used means to process glass materials.Aiming at the problems of the heat-affected zone and over-cutting phenomenon in current ECDM,a laser-assisted ECDM method for processing the glass was presented.Its processing mechanism was discussed,the experimental device was designed,and a contrasting experiment with the traditional ECDM for micro-channel processing was carried out.It is found that the laserassisted ECDM can significantly reduce the heat-affected zone and over-cutting phenomenon in the process of discharge machining.Therefore,the laser-assisted ECDM can effectively improve the quality and accuracy of micro-channel processing on glass materials,and has a good application prospect in the field of MEMS.
Glass materials have been widely used in micro-electromechanical systems(MEMS)in recent years.The electrochemical discharge machining(ECDM)is a widely used means to process glass materials.Aiming at the problems of the heat-affected zone and over-cutting phenomenon in current ECDM,a laser-assisted ECDM method for processing the glass was presented.Its processing mechanism was discussed,the experimental device was designed,and a contrasting experiment with the traditional ECDM for micro-channel processing was carried out.It is found that the laserassisted ECDM can significantly reduce the heat-affected zone and over-cutting phenomenon in the process of discharge machining.Therefore,the laser-assisted ECDM can effectively improve the quality and accuracy of micro-channel processing on glass materials,and has a good application prospect in the field of MEMS.
引文
[1]张朝阳,毛卫平,陈飞.纳米、亚微米的超窄脉宽微细电化学加工[J].微纳电子技术,2009,469(12):684-689.
[2]WüTHRICH R,FASCIO V.Machining of non-conducting materials using electrochemical discharge phenomenon-an overview[J].International Journal of Machine Tools&Manufacture,2005,45(9):1095-1108.
[3]ZHENG Z P,SU H C,HUANG F Y,et al.The tool geometrical shape and pulse-off time of pulse voltage effects in a Pyrex glass electrochemical discharge micro drilling process[J].Journal of Micromechanics&Microengineering,2007,17(2):265-272.
[4]KURAFUJI H.Electrical discharge drilling of glass[J].CIRPAnnals,1968,16:415-419.
[5]魏臣隽.基于电解电火花效应的硬脆绝缘材料微加工技术[D].上海:上海交通大学,2011.
[6]WüTHRICH R,DESPONT B,MAILLARD P,et al.Improving the material removal rate in spark-assisted chemical engraving(SACE)gravity-feed micro-hole drilling by tool vibration[J].Journal of Micromechanics and Microengineering,2006,16(11):N28-N31.
[7]CHENG C P,WU K L,MAI C C,et al.Magnetic field-assisted electrochemical discharge machining[J].Journal of Micromechanics&Microengineering,2010,20(7):75019-75025.
[8]仲继卉.电解电火花机械磨削复合加工新方法研究[D].山东:山东科技大学,2006.
[9]王耀民,张朝阳,李中洋,等.纳秒激光电化学复合掩模的微细加工[J].微纳电子技术,2012,49(5):336-339.
[10]姜雨佳,张朝阳,黄磊,等.激光热力强化电化学沉积试验研究[J].激光技术,2016,40(5):660-664.
[11]NAYAK B K,GUPTA M C.Self-organized micro/nano structures in metal surfaces by ultrafast laser irradiation[J].Optics and Lasers in Engineering,2010,48(10):940-949
[12]MCMILLEN B,ZHANG B,CHEN K P,et al.Ultrafast laser fabrication of low-loss waveguides in chalcogenide glass with 0.65 dB/cm loss[J].Optics letters,2012,37(9):1418-1420
[13]魏臣隽.基于电解电火花效应的硬脆绝缘材料微加工技术[D].上海:上海交通大学,2011.
[2]WüTHRICH R,FASCIO V.Machining of non-conducting materials using electrochemical discharge phenomenon-an overview[J].International Journal of Machine Tools&Manufacture,2005,45(9):1095-1108.
[3]ZHENG Z P,SU H C,HUANG F Y,et al.The tool geometrical shape and pulse-off time of pulse voltage effects in a Pyrex glass electrochemical discharge micro drilling process[J].Journal of Micromechanics&Microengineering,2007,17(2):265-272.
[4]KURAFUJI H.Electrical discharge drilling of glass[J].CIRPAnnals,1968,16:415-419.
[5]魏臣隽.基于电解电火花效应的硬脆绝缘材料微加工技术[D].上海:上海交通大学,2011.
[6]WüTHRICH R,DESPONT B,MAILLARD P,et al.Improving the material removal rate in spark-assisted chemical engraving(SACE)gravity-feed micro-hole drilling by tool vibration[J].Journal of Micromechanics and Microengineering,2006,16(11):N28-N31.
[7]CHENG C P,WU K L,MAI C C,et al.Magnetic field-assisted electrochemical discharge machining[J].Journal of Micromechanics&Microengineering,2010,20(7):75019-75025.
[8]仲继卉.电解电火花机械磨削复合加工新方法研究[D].山东:山东科技大学,2006.
[9]王耀民,张朝阳,李中洋,等.纳秒激光电化学复合掩模的微细加工[J].微纳电子技术,2012,49(5):336-339.
[10]姜雨佳,张朝阳,黄磊,等.激光热力强化电化学沉积试验研究[J].激光技术,2016,40(5):660-664.
[11]NAYAK B K,GUPTA M C.Self-organized micro/nano structures in metal surfaces by ultrafast laser irradiation[J].Optics and Lasers in Engineering,2010,48(10):940-949
[12]MCMILLEN B,ZHANG B,CHEN K P,et al.Ultrafast laser fabrication of low-loss waveguides in chalcogenide glass with 0.65 dB/cm loss[J].Optics letters,2012,37(9):1418-1420
[13]魏臣隽.基于电解电火花效应的硬脆绝缘材料微加工技术[D].上海:上海交通大学,2011.
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