高导热金刚石/铜复合材料界面修饰研究进展
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摘要
界面结合良好的金刚石/铜复合材料具有优异的热物理性能。通过各种手段修饰金刚石-铜界面能够充分发挥金刚石/铜复合材料的高导热潜力。综述了制备金刚石/铜复合材料时主要的两类界面修饰方法:金刚石表面预镀碳化物形成元素和对铜基体预合金化,并对这两类修饰手段的制备工艺和导热机制进行了简单评述。探讨了金刚石/铜复合材料制备及界面修饰领域目前存在的问题及发展趋势。
Diamond/copper composites with well-bonded interface have excellent thermophysical properties.Modified by various means,the diamond-copper interface can sufficiently enhance the thermal conductivity of diamond/copper composites.In this paper,recent progress about two main kinds of interfacial modification methods to prepare diamond/copper composite was reviewed,respectively as the preplating of carbide forming elements on diamond surface and pre-alloying of copper substrate.Preparation process and thermal conduction mechanism of these two modification methods were introduced briefly.The existing problems and development trend of diamond/copper composite preparation and interface modification were discussed.
Diamond/copper composites with well-bonded interface have excellent thermophysical properties.Modified by various means,the diamond-copper interface can sufficiently enhance the thermal conductivity of diamond/copper composites.In this paper,recent progress about two main kinds of interfacial modification methods to prepare diamond/copper composite was reviewed,respectively as the preplating of carbide forming elements on diamond surface and pre-alloying of copper substrate.Preparation process and thermal conduction mechanism of these two modification methods were introduced briefly.The existing problems and development trend of diamond/copper composite preparation and interface modification were discussed.
引文
1 Yoshida K,Morigami H.Thermal properties of dia mond/copper composite material[J].Microelectronics Reliability,2004,44(2):303.
2 Yan G,Wei B R,Yang Haitao,et al.Research progress in thermal conductivity models of polymer based composite[J].Fiber Reinforced Plastics/Composites,2006(3):50(in Chinese).闫刚,魏伯荣,杨海涛,等.聚合物基复合材料导热模型及其研究进展[J].玻璃钢/复合材料,2006(3):50.
3 Wang X T,Zhang Y,Che Z F,et al.Review on the progress of diamond particles dispersed metal matrix composites with superior high thermal conductivity[J].Journal of Functional Materials,2014(7):7001(in Chinese).王西涛,张洋,车子璠,等.金刚石颗粒增强金属基高导热复合材料的研究进展[J].功能材料,2014(7):7001.
4 Hasselman D P H,Johnson L F.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Journal of Composite Materials,1987,21(6):508.
5 Tavangar R,Molina J M,Weber L.Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast[J].Scripta Materialia,2007,56(5):357.
6 Kems J A,Colella N J,Makowiecki D,et al.Dymalloy:A composite substrate for high power density electronic components[C]∥Proceeding of the 1995international symposium on microelectronics.Los Angeles,US,1995.
7 Bai H,Ma N G,Lang J,et al.Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites[J].Journal of Alloys and Compounds,2013,580:382.
8 Hu H B,Kong J.Improved thermal performance of diamond-copper composites with boron carbide coating[J].Journal of Materials Engineering and Performance,2014,23(2):651.
9 Hell J,Chirtoc M,Eisenmenger S C,et al.Characterisation of sputter deposited niobium and boron interlayer in the copper-diamond system[J].Surface&Coatings Technology,2012,208:24.
10 Xia Y,Song Y Q,Lin C G,et al.Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials[J].Transactions of Nonferrous Metals Society of China,2009,19(5):1161.
11 Deng L F,Zhu X K,Tao J M,et al.Application of active element to Cu/diamond composites[J].Electronics Process Technology,2009,30(3):128(in Chinese).邓丽芳,朱心昆,陶静梅,等.活性元素在铜/金刚石复合材料中的应用[J].电子工艺技术,2009,30(3):128.
12 Zain-Ul-Abdein M,Raza K,Khalid F A,et al.Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites[J].Materials and Design,2015,86:248.
13 Wang P P,Guo H,Zhang X M,et al.Interfacial reaction of diamond/Copper composites[J].Chinese Journal of Rare Metals,2015,39(4):308(in Chinese).王鹏鹏,郭宏,张习敏,等.金刚石/铜复合材料的界面反应研究[J].稀有金属,2015,39(4):308.
14 Chu K,Liu Z F,Jia C C,et al.Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles[J].Journal of Alloys and Compounds,2010,490(1):453.
15 Kang Q P,He X B,Ren S B,et al.Preparation of copper-diamond composites with chromium carbide coatings on diamond particles for heat sink applications[J].Applied Thermal Engineering,2013,60(1):423.
16 Ren S B,Shen X Y,Guo C Y,et al.Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy[J].Composites Science and Technology,2011,71(13):1550.
17 Lin J M.Research on fabrication and properties of diamond/copper composites[D].Nanjing:Southeast University,2014(in Chinese).林金梅.金刚石/铜复合材料的制备及性能研究[D].南京:东南大学,2014.
18 Mortimer D A,Nicholas M.The wetting of carbon and carbides by copper alloys[J].Journal of Materials Science,1973,8(5):640.
19 Dong Y H,He X B,Rafi U D,et al.Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infil-tration[J].Journal of Materials Science,2011,46(11):3862.
20 Dong Y H,Zhang R Q,He X B,et al.Fabrication and infiltration kinetics analysis of Ti-coated diamond/copper composites with nearnet-shape by pressureless infiltration[J].Materials Science and Engineering B,2012,177(17):1524.
21 Xu X L.Diamond surface modification and preparation and performance of its composites[D].Changsha:Hunan University,2012(in Chinese).徐兴龙.金刚石表面改性及其复合材料制备工艺与性能[D].长沙:湖南大学,2012.
22 Wang Q.Study on diamond/copper composites fabricated by surface metallization-chemical co-deposition method in electronic packaging application[D].Tianjin:Tianjin University,2008(in Chinese).王强.表面金属化-共沉积法制备金刚石/铜基封装材料的研究[D].天津:天津大学,2008.
23 Zhang Y,Zhang H L,Wu J H,et al.Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles[J].Scripta Materialia.2011,65(12):1097.
24 Wei C L,Xu L,Zhang L B,et al.Research on the density of Cr coating diamond/copper composite material under microwave heating[J].Mining&Metallurgy,2016,25(1):31(in Chinese).卫陈龙,许磊,张利波,等.微波烧结镀铬金刚石/铜复合材料的致密度研究[J].矿冶,2016,25(1):31.
25 Abyzov A M,Kidalov S V,Shakhov F M.High thermal conductivity composites consisting of diamond filler with tungsten coating and copper(silver)matrix[J].Journal of Materials Science,2011,46(5):1424.
26 Abyzov A M,Kidalov S V,Shakhov F M.Filler-matrix thermal boundary resistance of diamond copper composite with high thermal conductivity[J].Physics of the Solid State,2012,54(1):210.
27 Abyzov A M,Kidalov S V,Averkin A I,et al.Mechanical properties of a diamond-copper composite with high thermal conductivity[J].Materials and Design,2015,87:527.
28 Bai H,Ma N G,Lang J,et al.Thermal conductivity of Cu/diamond compo-sites prepared by a new pretreatment of diamond powder[J].Composites:Part B,2013,52:182.
29 Zhang C,Wang R,Cai Z,et al.Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles[J].Journal of Materials Science:Materials in Electronics,2015,26(1):185.
30 Li J W,Zhang H L,Zhang S M,et al.On the thermal conductivity of Cu/diamond composite of diamond particles with tungsten coating[J].Journal of Functional Materials,2016,47(1):1034(in Chinese).李建伟,张海龙,张少明,等.金刚石表面镀钨对铜/金刚石复合材料热导率的影响[J].功能材料,2016,47(1):1034.
31 Kang Q P,He X B,Ren S B,et al.Effect of molybdenum carbide intermediate layers on thermal properties of copper-diamond composites[J].Journal of Alloys and Compounds,2013,576:380.
32 Kang Q P,He X B,Ren S B,et al.Preparation of high thermal conductivity copper-diamond composites using molybdenum carbidecoated diamond particles[J].Journal of Materials Science,2013,48(18):6133.
33Shen X Y,He X B,Ren S B,et al.Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites[J].Journal of Alloys and Compounds,2012,529:134.
34Schubert T,Trindade B,Weigrber T,et al.Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Materials Science and Engineering A,2008,475:39.
35 Schubert T,Ciupiński,Zielinński W,et al.Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications[J].Scripta Materialia,2008,58:263.
36 Weber L,Tavangar R.On the influence of active element content on the thermal conducti-vity and thermal expansion of Cu-X(X=Cr,B)diamond composites[J].Scripta Materialia,2007,57(11):988.
37 Ciupiński,Kruszewski M J,Grzonka J,et al.Design of interfacial Cr3C2,carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications[J].Materials&Design,2017,120:170.
38 Mańkowski P,Dominiak A,Domański R,et al.Thermal conductivity enhancement of copper-diamond composites by sintering with chromium additive[J].Journal of Thermal Analysis and Calorimetry,2014,116(2):881.
39 Grzonka J,Kruszewski M J,Rosiński M,et al.Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route[J].Materials Characterization,2015,99:188.
40 Guo H,Wang G Z,Zhang X M,et al.Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method[J].Rare Metals,2013,32(6):579.
41 Guo H,Wang G Z,Jia C C,et al.Low-temperature heat conduction characteristics of diamond/Cu composite by high pressure infiltration[J].Acta Materiae Compositae Sinica,2014,31(3):550(in Chinese).郭宏,王光宗,贾成厂,等.高压熔渗金刚石/铜复合材料的低温导热特性[J].复合材料学报,2014,31(3):550.
42 Fan Y M,Guo H,Xu J,et al.Effects of boron on the microstructure and thermal properties of Cu/diamond composites prepared by pressure infiltration[J].International Journal of Minerals,Metallurgy and Materials,2011,18(4):472.
43 Fan Y M,Guo H,Xu J,et al.Pressure infiltrated Cu/diamond composites for LED applications[J].Rare Metals,2011,30(2):206.
44 Chu K,Jia C C,Guo H,et al.On the thermal conductivity of CuZr/diamond composites[J].Materials and Design,2013,45:36.
45 He J S,Wang X T,Zhang Y,et al.Thermal conductivity of Cu-Zr/diamond composites produced by high temperature-high pressure method[J].Composites:Part B,2015,68:22.
46Shen W P,Shao W J,Wang Q Y,et al.Thermal conductivity and thermal expansion coefficient of diamond/5wt%Si-Cu composite by vacuum hot pressing[J].Fusion Engineering and Design,2010,85(10):2237.
47 Chen H,Jia C C,Li S J,et al.Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique[J].International Journal of Minerals,Metallurgy and Materials,2012,19(4):364.
48 Ali N,Ahmed W,Rego C A,et al.Chromium interlayers as a tool for enhancing diamond adhesion on copper[J].Diamond&Related Materials,2000,9(8):1464.
49 Zhang X M,Guo H,Yin F Z,et al.Influences of Cr element on interface structures and thermal properties of Diamond/Cu composites[J].Chinese Journal of Rare Metals,2010,34(2):221(in Chinese).张习敏,郭宏,尹法章,等.Cr元素对Diamond/Cu复合材料界面结构及热导性能的影响[J].稀有金属,2010,34(2):221.
50 Zhang X M,Guo H,Yin F Z,et al.Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications[J].Rare Metals,2011,30(1):94.
2 Yan G,Wei B R,Yang Haitao,et al.Research progress in thermal conductivity models of polymer based composite[J].Fiber Reinforced Plastics/Composites,2006(3):50(in Chinese).闫刚,魏伯荣,杨海涛,等.聚合物基复合材料导热模型及其研究进展[J].玻璃钢/复合材料,2006(3):50.
3 Wang X T,Zhang Y,Che Z F,et al.Review on the progress of diamond particles dispersed metal matrix composites with superior high thermal conductivity[J].Journal of Functional Materials,2014(7):7001(in Chinese).王西涛,张洋,车子璠,等.金刚石颗粒增强金属基高导热复合材料的研究进展[J].功能材料,2014(7):7001.
4 Hasselman D P H,Johnson L F.Effective thermal conductivity of composites with interfacial thermal barrier resistance[J].Journal of Composite Materials,1987,21(6):508.
5 Tavangar R,Molina J M,Weber L.Assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast[J].Scripta Materialia,2007,56(5):357.
6 Kems J A,Colella N J,Makowiecki D,et al.Dymalloy:A composite substrate for high power density electronic components[C]∥Proceeding of the 1995international symposium on microelectronics.Los Angeles,US,1995.
7 Bai H,Ma N G,Lang J,et al.Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites[J].Journal of Alloys and Compounds,2013,580:382.
8 Hu H B,Kong J.Improved thermal performance of diamond-copper composites with boron carbide coating[J].Journal of Materials Engineering and Performance,2014,23(2):651.
9 Hell J,Chirtoc M,Eisenmenger S C,et al.Characterisation of sputter deposited niobium and boron interlayer in the copper-diamond system[J].Surface&Coatings Technology,2012,208:24.
10 Xia Y,Song Y Q,Lin C G,et al.Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials[J].Transactions of Nonferrous Metals Society of China,2009,19(5):1161.
11 Deng L F,Zhu X K,Tao J M,et al.Application of active element to Cu/diamond composites[J].Electronics Process Technology,2009,30(3):128(in Chinese).邓丽芳,朱心昆,陶静梅,等.活性元素在铜/金刚石复合材料中的应用[J].电子工艺技术,2009,30(3):128.
12 Zain-Ul-Abdein M,Raza K,Khalid F A,et al.Numerical investigation of the effect of interfacial thermal resistance upon the thermal conductivity of copper/diamond composites[J].Materials and Design,2015,86:248.
13 Wang P P,Guo H,Zhang X M,et al.Interfacial reaction of diamond/Copper composites[J].Chinese Journal of Rare Metals,2015,39(4):308(in Chinese).王鹏鹏,郭宏,张习敏,等.金刚石/铜复合材料的界面反应研究[J].稀有金属,2015,39(4):308.
14 Chu K,Liu Z F,Jia C C,et al.Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles[J].Journal of Alloys and Compounds,2010,490(1):453.
15 Kang Q P,He X B,Ren S B,et al.Preparation of copper-diamond composites with chromium carbide coatings on diamond particles for heat sink applications[J].Applied Thermal Engineering,2013,60(1):423.
16 Ren S B,Shen X Y,Guo C Y,et al.Effect of coating on the microstructure and thermal conductivities of diamond-Cu composites prepared by powder metallurgy[J].Composites Science and Technology,2011,71(13):1550.
17 Lin J M.Research on fabrication and properties of diamond/copper composites[D].Nanjing:Southeast University,2014(in Chinese).林金梅.金刚石/铜复合材料的制备及性能研究[D].南京:东南大学,2014.
18 Mortimer D A,Nicholas M.The wetting of carbon and carbides by copper alloys[J].Journal of Materials Science,1973,8(5):640.
19 Dong Y H,He X B,Rafi U D,et al.Fabrication and thermal conductivity of near-net-shaped diamond/copper composites by pressureless infil-tration[J].Journal of Materials Science,2011,46(11):3862.
20 Dong Y H,Zhang R Q,He X B,et al.Fabrication and infiltration kinetics analysis of Ti-coated diamond/copper composites with nearnet-shape by pressureless infiltration[J].Materials Science and Engineering B,2012,177(17):1524.
21 Xu X L.Diamond surface modification and preparation and performance of its composites[D].Changsha:Hunan University,2012(in Chinese).徐兴龙.金刚石表面改性及其复合材料制备工艺与性能[D].长沙:湖南大学,2012.
22 Wang Q.Study on diamond/copper composites fabricated by surface metallization-chemical co-deposition method in electronic packaging application[D].Tianjin:Tianjin University,2008(in Chinese).王强.表面金属化-共沉积法制备金刚石/铜基封装材料的研究[D].天津:天津大学,2008.
23 Zhang Y,Zhang H L,Wu J H,et al.Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles[J].Scripta Materialia.2011,65(12):1097.
24 Wei C L,Xu L,Zhang L B,et al.Research on the density of Cr coating diamond/copper composite material under microwave heating[J].Mining&Metallurgy,2016,25(1):31(in Chinese).卫陈龙,许磊,张利波,等.微波烧结镀铬金刚石/铜复合材料的致密度研究[J].矿冶,2016,25(1):31.
25 Abyzov A M,Kidalov S V,Shakhov F M.High thermal conductivity composites consisting of diamond filler with tungsten coating and copper(silver)matrix[J].Journal of Materials Science,2011,46(5):1424.
26 Abyzov A M,Kidalov S V,Shakhov F M.Filler-matrix thermal boundary resistance of diamond copper composite with high thermal conductivity[J].Physics of the Solid State,2012,54(1):210.
27 Abyzov A M,Kidalov S V,Averkin A I,et al.Mechanical properties of a diamond-copper composite with high thermal conductivity[J].Materials and Design,2015,87:527.
28 Bai H,Ma N G,Lang J,et al.Thermal conductivity of Cu/diamond compo-sites prepared by a new pretreatment of diamond powder[J].Composites:Part B,2013,52:182.
29 Zhang C,Wang R,Cai Z,et al.Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles[J].Journal of Materials Science:Materials in Electronics,2015,26(1):185.
30 Li J W,Zhang H L,Zhang S M,et al.On the thermal conductivity of Cu/diamond composite of diamond particles with tungsten coating[J].Journal of Functional Materials,2016,47(1):1034(in Chinese).李建伟,张海龙,张少明,等.金刚石表面镀钨对铜/金刚石复合材料热导率的影响[J].功能材料,2016,47(1):1034.
31 Kang Q P,He X B,Ren S B,et al.Effect of molybdenum carbide intermediate layers on thermal properties of copper-diamond composites[J].Journal of Alloys and Compounds,2013,576:380.
32 Kang Q P,He X B,Ren S B,et al.Preparation of high thermal conductivity copper-diamond composites using molybdenum carbidecoated diamond particles[J].Journal of Materials Science,2013,48(18):6133.
33Shen X Y,He X B,Ren S B,et al.Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites[J].Journal of Alloys and Compounds,2012,529:134.
34Schubert T,Trindade B,Weigrber T,et al.Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Materials Science and Engineering A,2008,475:39.
35 Schubert T,Ciupiński,Zielinński W,et al.Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications[J].Scripta Materialia,2008,58:263.
36 Weber L,Tavangar R.On the influence of active element content on the thermal conducti-vity and thermal expansion of Cu-X(X=Cr,B)diamond composites[J].Scripta Materialia,2007,57(11):988.
37 Ciupiński,Kruszewski M J,Grzonka J,et al.Design of interfacial Cr3C2,carbide layer via optimization of sintering parameters used to fabricate copper/diamond composites for thermal management applications[J].Materials&Design,2017,120:170.
38 Mańkowski P,Dominiak A,Domański R,et al.Thermal conductivity enhancement of copper-diamond composites by sintering with chromium additive[J].Journal of Thermal Analysis and Calorimetry,2014,116(2):881.
39 Grzonka J,Kruszewski M J,Rosiński M,et al.Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route[J].Materials Characterization,2015,99:188.
40 Guo H,Wang G Z,Zhang X M,et al.Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method[J].Rare Metals,2013,32(6):579.
41 Guo H,Wang G Z,Jia C C,et al.Low-temperature heat conduction characteristics of diamond/Cu composite by high pressure infiltration[J].Acta Materiae Compositae Sinica,2014,31(3):550(in Chinese).郭宏,王光宗,贾成厂,等.高压熔渗金刚石/铜复合材料的低温导热特性[J].复合材料学报,2014,31(3):550.
42 Fan Y M,Guo H,Xu J,et al.Effects of boron on the microstructure and thermal properties of Cu/diamond composites prepared by pressure infiltration[J].International Journal of Minerals,Metallurgy and Materials,2011,18(4):472.
43 Fan Y M,Guo H,Xu J,et al.Pressure infiltrated Cu/diamond composites for LED applications[J].Rare Metals,2011,30(2):206.
44 Chu K,Jia C C,Guo H,et al.On the thermal conductivity of CuZr/diamond composites[J].Materials and Design,2013,45:36.
45 He J S,Wang X T,Zhang Y,et al.Thermal conductivity of Cu-Zr/diamond composites produced by high temperature-high pressure method[J].Composites:Part B,2015,68:22.
46Shen W P,Shao W J,Wang Q Y,et al.Thermal conductivity and thermal expansion coefficient of diamond/5wt%Si-Cu composite by vacuum hot pressing[J].Fusion Engineering and Design,2010,85(10):2237.
47 Chen H,Jia C C,Li S J,et al.Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique[J].International Journal of Minerals,Metallurgy and Materials,2012,19(4):364.
48 Ali N,Ahmed W,Rego C A,et al.Chromium interlayers as a tool for enhancing diamond adhesion on copper[J].Diamond&Related Materials,2000,9(8):1464.
49 Zhang X M,Guo H,Yin F Z,et al.Influences of Cr element on interface structures and thermal properties of Diamond/Cu composites[J].Chinese Journal of Rare Metals,2010,34(2):221(in Chinese).张习敏,郭宏,尹法章,等.Cr元素对Diamond/Cu复合材料界面结构及热导性能的影响[J].稀有金属,2010,34(2):221.
50 Zhang X M,Guo H,Yin F Z,et al.Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications[J].Rare Metals,2011,30(1):94.