pH值对镁铝尖晶石化学机械抛光效果的影响
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摘要
抛光液pH值对镁铝尖晶石的材料去除率和表面质量具有重要作用。采用不同pH值的抛光液对尖晶石样品进行研磨加工并测量其去除率和表面粗糙度,评价pH值对尖晶石化学机械抛光效果的影响。配制多种pH值抛光液,在转速为80 r/min和100 r/min的条件下开展两组化学机械抛光实验研究。采用失重法测量材料去除率;采用粗糙度仪测量尖晶石表面微观形貌,分析pH值和转速对抛光效果的影响规律,探索尖晶石材料的化学机械抛光机理。结果表明:加酸或加碱能有效提高材料去除率且降低表面粗糙度,但碱性介质帮助更大;抛光盘转速越高,尖晶石材料去除率和表面粗糙度也将增加,选择合适的抛光速度也是必要的。该研究成果将为进一步研究镁铝尖晶石化学机械抛光机理奠定实验基础。
Chemical effect of polishing slurry and rotational speed are very important for Material Removal Rate(MRR) and surface quality during polishing. Under different rotational speed, the slurries with different pH were used for the analysis of spinel wafers lapping, and the effects of pH slurries on MRR and surface quality were explored. Through making the slurries with different pH, both groups of experiments were carried out of chemical mechanical polishing(CMP) at the speeds of 80 r/min and 100 r/min. The MRRs of spinel were measured using the lost weight analysis law, and the surface roughness was checked with a roughness instrument. They were used to analyze the effects of pH and rotational speed on lapping accuracy,and were also used to explore the mechanism of CMP. The results show that the MRRs increase with the rising of acid or alkaline, and that their roughness decreases instead. Of them, alkaline slurries have a greater effect on MRR and roughness. With the increase of rotational speed, MRR and surface roughness can also be increased obviously. A suitable speed should be considered carefully. The study will lay an experimental foundation for exploring further the chemical mechanical polishing mechanism.
Chemical effect of polishing slurry and rotational speed are very important for Material Removal Rate(MRR) and surface quality during polishing. Under different rotational speed, the slurries with different pH were used for the analysis of spinel wafers lapping, and the effects of pH slurries on MRR and surface quality were explored. Through making the slurries with different pH, both groups of experiments were carried out of chemical mechanical polishing(CMP) at the speeds of 80 r/min and 100 r/min. The MRRs of spinel were measured using the lost weight analysis law, and the surface roughness was checked with a roughness instrument. They were used to analyze the effects of pH and rotational speed on lapping accuracy,and were also used to explore the mechanism of CMP. The results show that the MRRs increase with the rising of acid or alkaline, and that their roughness decreases instead. Of them, alkaline slurries have a greater effect on MRR and roughness. With the increase of rotational speed, MRR and surface roughness can also be increased obviously. A suitable speed should be considered carefully. The study will lay an experimental foundation for exploring further the chemical mechanical polishing mechanism.
引文
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[15]Ju Zhilan,Zhu Yongwei,Wang Jianbin,et al.Effect of slurries on chemical mechanical polishing of decorative glasses by fixed-abrasive pad[J].Optics and Precision Engineering,2013,21(4):955-962.(in Chinese)居志兰,朱永伟,王建彬,等.抛光介质对固结磨料化学机械抛光水晶的影响[J].光学精密工程,2013,21(4):955-962.
[16]Wang Zhankui,Zhu Yongwei,Su Jianxiu,et al.Effect of acidic slurries on lapping spinel wafer with fixed abrasive pad[J].Journal of Synthetic Crystals,2016,45(2):339-345.(in Chinese)王占奎,朱永伟,苏建修,等.酸性体系对镁铝尖晶石工件固结磨料研磨的影响[J].人体晶体学报,2016,45(2):339-345.
[17]Han Jinghua,Feng Guoying,Yang Liming,et al.The influences of the polishing liquid′s p H values upon the roughness of the polishing component surface[J].Optical Technique,2006,32(4):562-564.(in Chinese)韩敬华,冯国英,杨李茗,等.抛光液的p H值对抛光元件表面粗糙度的影响[J].光学技术,2006,32(4):562-564.
[18]Liu Dongmei,Li Xiao,Fu Xiuhua,et al.Chemical mechanical polishing technology for optical manufacture based on magnesia alumina spinel[J].Journal of Changchun University of Science&Technology,2017,40(1):47-50.(in Chinese)刘冬梅,李晓,付秀华,等.基于铝酸镁尖晶石材料的化学机械抛光工艺技术研究[J].长春理工大学学报,2017,40(1):47-50.
[2]Gritsyna V T,Afanasyev-Charkin I V,Kazarinov Y G,et al.Optical properties of magnesium aluminate spinel crystals implanted with helium ions[J].Vacuum,2006,81(2):174-178.
[3]Song H L,Yu X F,Zhang L,et al.Optical planar waveguide in magnesium aluminate spinel crystal using oxygen ion implantation[J].Applied Physics B,2015,120(1):25-29.
[4]Zhou Guanguan,Yu Haiou,Zheng Lihe,et al.Optical,mechanical and thermal properties of mid-IR materials under high temperature[J].Infrared and Laser Engineering,2012,41(3):554-558.(in Chinese)周关关,于海鸥,郑丽和,等.中红外光学材料的高温性能研究[J].红外与激光工程,2012,41(3):554-558.
[5]Zhao Hongwei,Hou Tianjin,Zhu Bin.Experimental research of aerodynamic effects of spinel domes[J].Infrared and Laser Engineering,2012,41(2):297-303.(in Chinese)赵洪卫,侯天晋,朱斌.尖晶石整流罩气动效应的试验研究[J].红外与激光工程,2012,41(2):297-303.
[6]Li Z,Lei M Y,Wang L D.Preparation of enhanced transparent magnesia-alumina spinel ceramics[J].Journal of Ceramics,2012,33(4):488-491.
[7]Gusmano G,Montesperelli G,Traversa E,et al.Microstructure and electrical properties of Mg Al2O4thin films for humidity sensing[J].Journal of the American Ceramic Society,1993,76(3):743-750.
[8]Zhao D,Lu X.Chemical mechanical polishing:theory and experiment[J].Friction,2013,1(4):306-326.
[9]Wang Juan,Liu Yuling,Tan Baimei,et al.Chemical mechanical polishing of sapphire substrate[J].Journal of the Electrochemical Society,2010,157(6):688-691.
[10]Chen Xiaochun.Experimental study on material removal mechanism in chemical mechanical polishing[D].Wuxi:Jiangnan University,2014.(in Chinese)陈晓春.化学机械抛光试验及其材料去除机理的研究[D].无锡:江南大学,2014.
[11]Wu Changhao,Guo Bing,Yao Guang,et al.The chemical mechanical polishing technique research of the hard and brittle materials[J].Machinery Design&Manufacture,2014(2):37-39.(in Chinese)武昌壕,郭冰,姚光,等.硬脆材料的化学机械抛光机理研究[J].机械设计与制造,2014(2):37-39.
[12]Peng Jin,Xia Lin,Zou Wenjun.Research status and prospect of chemical mechanical polishing slurry[J].Surface Technology,2012,41(4):95-98.(in Chinese)彭进,夏琳,邹文俊.化学机械抛光液的发展现状与研究方向[J].表面技术,2012,41(4):95-98.
[13]Cao Jun,Wei Chaoyang,Liu Shijie,et al.Polishing performances of different optics with different size powder and different p H value slurries during CMP polishing[C]//SPIE,2015,9633:96332O
[14]Xu L,Zou C,Shi X,et al.Fe-Nx/C assisted chemicalmechanical polishing for improving the removal rate of sapphire[J].Applied Surface Science,2015,343:115-120.
[15]Ju Zhilan,Zhu Yongwei,Wang Jianbin,et al.Effect of slurries on chemical mechanical polishing of decorative glasses by fixed-abrasive pad[J].Optics and Precision Engineering,2013,21(4):955-962.(in Chinese)居志兰,朱永伟,王建彬,等.抛光介质对固结磨料化学机械抛光水晶的影响[J].光学精密工程,2013,21(4):955-962.
[16]Wang Zhankui,Zhu Yongwei,Su Jianxiu,et al.Effect of acidic slurries on lapping spinel wafer with fixed abrasive pad[J].Journal of Synthetic Crystals,2016,45(2):339-345.(in Chinese)王占奎,朱永伟,苏建修,等.酸性体系对镁铝尖晶石工件固结磨料研磨的影响[J].人体晶体学报,2016,45(2):339-345.
[17]Han Jinghua,Feng Guoying,Yang Liming,et al.The influences of the polishing liquid′s p H values upon the roughness of the polishing component surface[J].Optical Technique,2006,32(4):562-564.(in Chinese)韩敬华,冯国英,杨李茗,等.抛光液的p H值对抛光元件表面粗糙度的影响[J].光学技术,2006,32(4):562-564.
[18]Liu Dongmei,Li Xiao,Fu Xiuhua,et al.Chemical mechanical polishing technology for optical manufacture based on magnesia alumina spinel[J].Journal of Changchun University of Science&Technology,2017,40(1):47-50.(in Chinese)刘冬梅,李晓,付秀华,等.基于铝酸镁尖晶石材料的化学机械抛光工艺技术研究[J].长春理工大学学报,2017,40(1):47-50.