集成电路真伪辨识方法
|
摘要
随着电子产品的高度集成化,电子元器件不断更新换代,旧版本的集成电路逐步停产,加上国外公司的禁运等多种因素的影响,翻新、假冒和伪劣的集成电路越来越多,给电子产品和军用装备的可靠性带来很大的风险。按照从简单到复杂、从外部到内部、从非破坏性到破坏性的顺序介绍了几种辨识假冒伪劣集成电路的方法,通过检查集成电路的外部标识、引线、表面状况以及内部工艺,配合二筛的环境适应性试验及电性能测试,可以有效判断是否为假冒伪劣集成电路。
With the high integration of electronic products, multi-factor of the electronic components are continuous updating and replacement, the old version of the Integrated Circuits are off production and the embargoes of foreign companies, etc. There are more and more Integrated Circuits of refurbishment,counterfeiting and shoddy, that makes great risks to the reliability of electronic products and military equipments. This paper introduced several methods to identify counterfeit and fake IC in accordance with fake and shoddy IC, from simple to complex, from external to interior, from non-destructive to destructive. By checking the external identification, leads, surface condition and internal technology of the IC, the environmental adaptability test and electrical performance test of the two sieves can be used to judge whether it is a fake and inferior IC effectively.
With the high integration of electronic products, multi-factor of the electronic components are continuous updating and replacement, the old version of the Integrated Circuits are off production and the embargoes of foreign companies, etc. There are more and more Integrated Circuits of refurbishment,counterfeiting and shoddy, that makes great risks to the reliability of electronic products and military equipments. This paper introduced several methods to identify counterfeit and fake IC in accordance with fake and shoddy IC, from simple to complex, from external to interior, from non-destructive to destructive. By checking the external identification, leads, surface condition and internal technology of the IC, the environmental adaptability test and electrical performance test of the two sieves can be used to judge whether it is a fake and inferior IC effectively.
引文
[1]曹春芝.塑封集成电路真伪鉴别方法[J].铁道通信信号工程技术,2013,10(4).
[2]慧眼识别假冒翻新IC[J].电源世界,2006,1:56-57.
[3]GJB4027A-2006.军用电子元器件破坏性物理分析方法[S].北京:总装备部军标出版发行部,2006:35-37.
[2]慧眼识别假冒翻新IC[J].电源世界,2006,1:56-57.
[3]GJB4027A-2006.军用电子元器件破坏性物理分析方法[S].北京:总装备部军标出版发行部,2006:35-37.