集成电路可靠性评价技术
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摘要
基于集成电路技术的发展趋势,从技术发展、应用、鉴定评价三个层面提出集成电路可靠性评价的新需求。针对可靠性筛选、寿命试验和可靠性预计进行传统集成电路可靠性评价技术的适用性分析。针对六种集成电路可靠性评价新方法进行基础理论和国内研究现状分析,包括可靠性预计方法的扩展、基于敏感参数的可靠性评价、基于失效物理的可靠性评价、基于失效物理的可靠性预计、故障预计与健康管理和可靠性强化试验。提出即时定量地对高可靠集成电路进行有效的可靠性评价,需要根据具体需求采取各种先进的可靠性评价方法。强调可靠性是设计出来的,核心永远是设计。
Based on the development of integrated circuit, new requirement of reliability evaluation was discussed from technological development, application and evaluation. Applicability analysis of traditional ICs reliability evaluation technique including reliability screening, life test and reliability prediction was carried out. Theory of foundation and domestic research status was analyzed against six new reliability evaluation techniques, including extension of reliability prediction, sensitive parameter method, physics of failure, reliability prediction based on physics of failure, prognostics and health management and high accelerated stress test. It was proposed that various advanced reliability evaluation methods should be adopted according to specific needs for effective reliability evaluation of high reliability ICs. It was emphasized that reliability is designed, and the core is always the design.
Based on the development of integrated circuit, new requirement of reliability evaluation was discussed from technological development, application and evaluation. Applicability analysis of traditional ICs reliability evaluation technique including reliability screening, life test and reliability prediction was carried out. Theory of foundation and domestic research status was analyzed against six new reliability evaluation techniques, including extension of reliability prediction, sensitive parameter method, physics of failure, reliability prediction based on physics of failure, prognostics and health management and high accelerated stress test. It was proposed that various advanced reliability evaluation methods should be adopted according to specific needs for effective reliability evaluation of high reliability ICs. It was emphasized that reliability is designed, and the core is always the design.
引文
[1]杨立功,于晓权,李晓红,罗俊.半导体可靠性技术现状与展望[J].微电子学,2015,45(03):391-394+399.
[2]骆明珠,康锐,刘法旺.电子产品可靠性预计方法综述[J].电子科学技术,2014,01(02):246-256.
[3]刘文.浅析FIDES可靠性预计方法在COTS产品中的应用[J].电子技术与软件工程,2014(06):169-170.
[4]YE Z S, Wang Y, TSUI K L, et al. Degradation data analysis using wiener processes with measurement with measurement errors[J]. IEEE Transactions on Reliability, 2013,62(4):772-780.
[5]彭建.基于失效物理的电子系统可靠性预计研究与实现[D].电子科技大学,2012.
[6]孔学东,陆裕东,恩云飞.电子产品PHM及其关键技术[J].中国质量,2010(03):15-18.
[7]何文波,张涛,郝苗苗,黄泽贵.可靠性强化试验在高可靠性产品设计中的应用[J].电子产品可靠性与环境试验,2013,31(S1):29-35.
[2]骆明珠,康锐,刘法旺.电子产品可靠性预计方法综述[J].电子科学技术,2014,01(02):246-256.
[3]刘文.浅析FIDES可靠性预计方法在COTS产品中的应用[J].电子技术与软件工程,2014(06):169-170.
[4]YE Z S, Wang Y, TSUI K L, et al. Degradation data analysis using wiener processes with measurement with measurement errors[J]. IEEE Transactions on Reliability, 2013,62(4):772-780.
[5]彭建.基于失效物理的电子系统可靠性预计研究与实现[D].电子科技大学,2012.
[6]孔学东,陆裕东,恩云飞.电子产品PHM及其关键技术[J].中国质量,2010(03):15-18.
[7]何文波,张涛,郝苗苗,黄泽贵.可靠性强化试验在高可靠性产品设计中的应用[J].电子产品可靠性与环境试验,2013,31(S1):29-35.