不同添加剂对Ni-Sn-Mn合金电沉积行为的影响
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摘要
采用阴极极化曲线、循环伏安曲线、电化学阻抗和电位阶跃等电化学方法,研究了糖精(BSI)、1,4-丁炔二醇(BYD)及两种添加剂组合对Ni-Sn-Mn合金电沉积行为的影响。结果表明:加入不同添加剂均使Ni-Sn-Mn合金电沉积的阴极极化增大,沉积电位负移,对合金电沉积起阻化作用;不同添加剂作用下电沉积过程均为不可逆;加入BSI的电荷转移电阻大于加入BYD的电荷转移电阻,而加入BSI+BYD的电荷转移电阻最大;在不同添加剂作用下Ni-Sn-Mn合金电沉积无因次曲线接近理论连续成核曲线,电沉积结晶过程遵循三维生长方式的连续成核机制。
The effect of benzosulfimide,1,4-butynediol and the additive compounded from benzosulfimide and 1,4-butynediol on electrodeposition behavior of Ni-Sn-Mn alloy was investigated by cathodic polarization curve,cyclic voltammetry curve,electrochemical impedance spectroscopy,and potential step.The results showed that the various additives could enhance the cathodic polarization, cause deposition potential to shift negatively and hinder the electrodeposition process. The electrodeposition process of Ni-Sn-Mn alloy with different additives was all irreversible.The charge transfer resistance of electrodeposition process by the actions of benzosulfimide was larger than that of 1,4-butynediol.The electrodeposition process by the actions of the additive compounded from 1,4-butynediol and benzosulfimide has the largest charge transfer resistance.The dimensionless curves of electrodeposition of Ni-Sn-Mn alloy by the actions of different additives was close to theoretical continuous nucleation curve.The electrocrystallization of Ni-Sn-Mn alloy in the presence of different additives followed the mechanism of continuous nucleation and three dimensional growth.
The effect of benzosulfimide,1,4-butynediol and the additive compounded from benzosulfimide and 1,4-butynediol on electrodeposition behavior of Ni-Sn-Mn alloy was investigated by cathodic polarization curve,cyclic voltammetry curve,electrochemical impedance spectroscopy,and potential step.The results showed that the various additives could enhance the cathodic polarization, cause deposition potential to shift negatively and hinder the electrodeposition process. The electrodeposition process of Ni-Sn-Mn alloy with different additives was all irreversible.The charge transfer resistance of electrodeposition process by the actions of benzosulfimide was larger than that of 1,4-butynediol.The electrodeposition process by the actions of the additive compounded from 1,4-butynediol and benzosulfimide has the largest charge transfer resistance.The dimensionless curves of electrodeposition of Ni-Sn-Mn alloy by the actions of different additives was close to theoretical continuous nucleation curve.The electrocrystallization of Ni-Sn-Mn alloy in the presence of different additives followed the mechanism of continuous nucleation and three dimensional growth.
引文
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[3]冯拉俊,樊菊红,雷阿利.电镀镍组合添加剂研究[J].贵金属,2006,27(3):30-34.
[4]周小琴.光亮电镀镍添加剂的研究[J].铸造技术,2008,30(7):955-958.
[5]龚利华.添加剂对锌镍合金电镀的影响[J].腐蚀与防护,2006,27(4):171-173.
[6]李俊华,邝代治,冯泳兰,等.有机添加剂作用下锌镍合金电沉积机理[J].化学试剂,2011,33(2):152-156.
[7]李延伟,尚雄,姚金环,等.糖精对柠檬酸盐中性电镀镍影响的研究[J].电镀与精饰,2013,35(9):43-46.
[8]PAVLATOU E A,RAPTTAKIS M,SPYRELLIS N.Synergistic effect of 2-butyne-1,4-diol and pulse plating on the structure and properties of nickel nanocrystalline deposits[J].Surface and coatings technology,2007,201(8):4571-4577.
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[10]辜敏,钟琴.3-巯基-1-丙烷磺酸钠复配添加剂对铜电沉积的作用及机理[J].材料保护,2011,44(4):11-14.
[11]夏熙,刘洪涛,刘洋.Ce4+/Ce3+氧化还原体系线性极化与交流阻抗研究[J].化学学报,2002,60(9):1630-1636.
[12]SCHARIFKER B,HILLS G.Theoretical and experimental studies of multiple nucleation[J].Eletrochimica acta,1983,28(7):879-889.