瞬态喷雾冷却中使用导热逆问题求解热边界条件
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摘要
随着电子器件的散热需求越来越大,关于液体冷却系统的研究愈发增多.瞬态喷雾冷却(ISC)是一个新颖高效的冷却IC芯片的方法.导热逆问题(IHCP)是一种通过测量介质内部的温度分布来估计表面热流密度的方法.采用IHCP计算喷雾冷却过程中随时间变化的表面热流密度.选用一维未来序列函数(SFS)方法由测量内部温度而估计表面热流密度.使用模拟温度数据来检查该计算方法的精度和误差,得到各个参数的影响规律以估计该方法对实验中求解热流密度的影响.
With the increasing demand of heat dissipation of electronic devices, the research on liquid cooling system is increasing. Intermittent spray cooling(ISC) is a novel and efficient method for cooling IC chips. The inverse heat conduction problem(IHCP) is a method for estimating surface heat flux by measuring the temperature distribution inside the medium. IHCP is used to predict the time-varying surface heat flux during the spray cooling process. The one-dimensional sequential function specification(SFS) method is used to estimate the surface heat flux by measuring the internal temperature. The accuracy and error of the calculation method are checked by the simulated temperature, and the influence rule of each parameter is obtained to estimate the effect of the method on the heat flux calculated in the experiment.
With the increasing demand of heat dissipation of electronic devices, the research on liquid cooling system is increasing. Intermittent spray cooling(ISC) is a novel and efficient method for cooling IC chips. The inverse heat conduction problem(IHCP) is a method for estimating surface heat flux by measuring the temperature distribution inside the medium. IHCP is used to predict the time-varying surface heat flux during the spray cooling process. The one-dimensional sequential function specification(SFS) method is used to estimate the surface heat flux by measuring the internal temperature. The accuracy and error of the calculation method are checked by the simulated temperature, and the influence rule of each parameter is obtained to estimate the effect of the method on the heat flux calculated in the experiment.
引文
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[2] 国建鸿,李振国,傅德平.大功率电力电子器件蒸发冷却技术研究 [J].电力电子技术,2005,39(5):138-140.GUO Jianhong,LI Zhenguo,FU Deping.Study on evaporative-cooling technology for high-power power electronic components [J].Power Electronics,2005,39(5):138-140.(in Chinese)
[3] PANAO M R O,MOREIRA A L N.Intermittent spray cooling:A new technology for controlling surface temperature [J].International Journal of Heat and Fluid Flow,2009,30(1):117-130.
[4] AGUILAR G,WANG Guoxiang,NELSON J S.Effect of spurt duration on the heat transfer dynamics during cryogen spray cooling [J].Physics in Medicine and Biology,2003,48(14):2169-2181.
[5] TALER J.Theory of transient experimental techniques for surface heat transfer [J].International Journal of Heat and Mass Transfer,1996,39(17):3733-3748.
[6] STOLZ G.Numerical solutions to an inverse problem of heat conduction for simple shapes [J].Journal of Heat Transfer,1960,82(1):20-25.
[7] REICHELT L,MEINGAST U,RENZ U.Calculating transient wall heat flux from measurements of surface temperature [J].International Journal of Heat and Mass Transfer,2002,45(3):579-584.
[8] WOODBURY K A.Inverse Engineering Handbook [M].Boca Raton:CRC Press,2002.
[9] BECK J V,BLACKWELL B,ST CLAIR JR C R.Inverse Heat Conduction:Ill-Posed Problems [M].New York:Wiley-Interscience Publication,1985.
[10] 周致富,徐腾宇,赵曦,等.喷雾冷却表面瞬态热流密度计算方法研究 [J].工程热物理学报,2016,37(11):2452-2456.ZHOU Zhifu,XU Tengyu,ZHAO Xi,et al.Methodology for prediction of time-varying heat flux during pulsed spray cooling [J].Journal of Engineering Thermophysics,2016,37(11):2452-2456.(in Chinese)
[11] TUNNELL J W,TORRES J H,ANVARI B.Methodology for estimation of time-dependent surface heat flux due to cryogen spray cooling [J].Annals of Biomedical Engineering,2002,30(1):19-33.
[12] SOMASUNDARAM S,TAY A A O.A study of intermittent spray cooling process through application of a sequential function specification method [J].Inverse Problems in Science and Engineering,2012,20(4):553-569.