Rapid Heating Micro-Embossing and Injection Molding Using Molds with Carbide-Bonded Graphene Coating
- 作者：Pengcheng XieL.James LeeEusebio Duarte CabreraPanpan ZhangYing-Chieh YenPeng HeDaniel Gallego-PerezLingqian ChangAllen YiJose Castro
- 会议时间：2014-07-23
- 关键词：micro-embossing ; ultrathin injection molding ; carbide-bonded graphene coating ; silicon mold inserts
- 作者单位：Pengcheng Xie,Panpan Zhang,Ying-Chieh Yen(Department of Chemical and Biomolecular Engineering)L.James Lee(Department of Chemical and Biomolecular Engineering;Center for Affordable Nanoengineering of Polymeric Biomedical Devices,The Ohio State University,Ohio USA 43201)Eusebio Duarte Cabrera,Peng He,Allen Yi,Jose Castro(Department of Integrated Systems Engineering)Daniel Gallego-Perez,Lingqian Chang(Center for Affordable Nanoengineering of Polymeric Biomedical Devices,The Ohio State University,Ohio USA 43201)
- 母体文献：第十一届先进成型与材料加工技术国际研讨会论文集
- 会议名称：第十一届先进成型与材料加工技术国际研讨会
- 会议地点：大连
- 主办单位：中国机械工程学会
- 语种：chi
摘要
Both hot embossing and injection molding are widely used for the fabrication of polymer products with very thin or micro scale features.However, the mold usually needs to be pre-heated to ensure complete filling and good replication of microscale features, particularly with high aspect ratios.Consequently, the long cycle time and incomplete filling have become major concerns in the industry.In this study, we present a novel carbide-bonded graphene coating on silicon molds/stampers to solve these problems.The graphene layer is highly electrically and thermally conductive, where a ~45 nm thick coating layer on silicon wafer surface could reach an electrical conductivity of 1.98×104 S/m.Direct current with a relatively low voltage could be applied on the graphene layer to achieve very fast local heating.