Chemical Cracking Effect of Aqua Regia on the Purification of Metallurgical-Grade Silicon

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• 作者：Hu Zhang ; Zhi Wang ; Wenhui Ma ; Keqiang Xie ; Lei Hu
• 刊名：Industrial & Engineering Chemistry Research
• 出版年：2013
• 出版时间：June 5, 2013
• 年：2013
• 卷：52
• 期：22
• 页码：7289-7296
• 全文大小：563K
• 年卷期：v.52,no.22(June 5, 2013)
• ISSN：1520-5045

文摘

The chemical cracking effect on metallurgical-grade silicon (MG-Si) during leaching by aqua regia was investigated. The results showed that the granularity of the particles was reduced by acid leaching, and the phenomenon was more noticeable with the increase in the silicon particle size. The cracking was essentially ascribed to the dissolution of the major impurities that depended on the composition and distribution of the impurity phases in MG-Si. In addition, the removal efficiency of the main metallic impurities with the occurrence of the chemical cracking effect during the leaching process was studied. The remarkable removal efficiency was obtained from the coarse particle size, where 79% Fe, 77% Al, 45% Ca, and 63% Ti were removed. The reason could be attributed to the strong oxidation of aqua regia that promoted the dissolution of the Si鈥揂l鈥揊e soluble phase, which resulted in the enhanced removal effect of acid on the impurities.