New discovery of ZnO whisker in SnZn/Cu solder joints interconnection in concentrator silicon solar cells solder layer
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- 作者：Liang Zhang ; zhangliang@jsnu.edu.cn" class="auth_mail" title="E-mail the corresponding author ; Fan Yang
- 关键词：ZnO whisker ; Solder joints ; Oxidation ; Tensile stress
- 刊名：Materials Letters
- 出版年：2016
- 出版时间：15 May 2016
- 年：2016
- 卷：171
- 期：Complete
- 页码：154-157
- 全文大小：1894 K
文摘
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It is the first time to report the ZnO whiskers growth on the surface of SnZn/Cu.
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Sn9Zn alloy shows a short circuiting failure risk for electronic interconnection.
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The growth mechanism of ZnO whiskers was researched.