Mass transfer trends of AlCoCrFeNi high-entropy alloy coatings on TC11 substrate via electrospark − computer numerical control deposition

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• 作者：Xiao-Rong Wang^a ; ^b ; ^{wxrlanzhou@126.com} ; Zhao-Qin Wang^c ; ^d ; Tie-Song Lin^b ; Peng He^b ; ^{hithepeng@hit.edu.cn} ; ^{hitjoining@hit.edu.cn}
• 关键词：Electrospark - computer numerical control deposition ; Electrospark deposition ; High-entropy alloy ; Mass transfer ; Deposition strategy
• 刊名：Journal of Materials Processing Technology
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：241
• 期：Complete
• 页码：93-102
• 全文大小：3894 K
• 卷排序：241

文摘

A new electrospark deposition (ESD) process, electrospark – computer numerical control deposition (ES-CNCD), was proposed based on an ES-computer integrated deposition system (ES-CIDS). The ES-CIDS integrated a 3-axis CNC milling machine with an ESD welder via a passive exsertile/retractable pattern special deposition holder. The ES-CNCD process employs high-current electrical pulses of short duration to modify the metal surface. In this work, an AlCoCrFeNi high-entropy alloy (HEA) was used as the electrode to prepare HEA coatings on TC11 titanium alloy substrate via weld-spot pattern deposition strategy. Three quantities of cathode mass gain (CMG), anode mass gain (AMG) and material transfer coefficient (MTC) were redefined for ES-CNCD process. The impact of process parameters on CMG, AMG, MTC was investigated via designing orthogonal experiments. The physical mode of mass transfer of ES-CNCD process has been proposed and confirmed by experiments.