A perspective of the IPC report on lead-free electronics in military/aerospace applications

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• 作者：Aleksandra Fortier^a ; ^{drafortier@gmail.com} ; Michael G. Pecht^b
• 关键词：Lead-free electronics ; Lead-free solders ; Sn whiskers ; Military/aerospace application ; RoHS exempt ; Reliability risks
• 刊名：Microelectronics Reliability
• 出版年：2017
• 出版时间：February 2017
• 年：2017
• 卷：69
• 期：Complete
• 页码：66-70
• 全文大小：600 K
• 卷排序：69

文摘

Significant progress towards lead-free technology implementation has been made in the last decade. However, majority of the successful transition has been done within consumer electronics industry while high reliability military/aerospace products are yet to fully transition. This study discusses viewpoint on the recent IPC report published on lead-free electronics in military and aerospace applications. Additionally, reliability considerations are discussed, and guidelines along with standards for robust transition and implementation towards lead-free technology is presented. A “preventive” transition approach based upon more accurate models of failure mechanisms and life prediction than are currently available will be required in order to assess successful implementation within military/aerospace products and for high reliability to be achieved.