Adhesion quality of evaporated aluminum layers on passivation layers for rear metallization of silicon solar cells
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- 作者：Julia Kumm ; Philip Hartmann ; Dirk Eberlein ; Andreas Wolf ; andreas.wolf@ise.fraunhofer.de" class="auth_mail" title="E-mail the corresponding author
- 关键词：Physical vapor deposition ; Evaporation ; Aluminum ; Metallization ; Adhesion ; Interface ; Silicon solar cell
- 刊名：Thin Solid Films
- 出版年：2016
- 出版时间：1 August 2016
- 年：2016
- 卷：612
- 期：Complete
- 页码：393-399
- 全文大小：1293 K
文摘
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We examine the adhesion quality of evaporated aluminum on passivation layers.
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Adhesion quality strongly varies with passivation type and evaporation process.
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SEM cross-section images are taken to gain insight into the interface region.
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A water-free surface and elevated deposition temperatures promote adhesion.
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By process optimization we achieve strong adhesion on all passivation layers.