用户名: 密码: 验证码:
Roughness kinetic and multiaffinity of anisotropic etched silicon
详细信息    查看全文
文摘
Morphology evolution of silicon wafers during anisotropic etching is investigated. Roughness changes periodically in time with a decreasing exponentially trend. Pyramid structures disappear in large times and porous structures form. Mono-scaling of un-etched silicon changes to multifractality with etching time. Deviated normal distribution and different correlations are source of multifractality.

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700